My Inquiry
My Account
Infineon Technologies XMC1100T038X0064ABXUMA1
- Part No.:
- XMC1100T038X0064ABXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
XMC1100T038X0064ABXUMA1.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,581
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XMC1100T038X0064ABXUMA1 from Infineon Technologies is an ARM® Cortex®-M0 32-bit microcontroller designed for industrial control and embedded sensing applications. It features 64 KB Flash, 16 KB SRAM, a 12-channel 12-bit ADC, two Universal Serial Interface Channels (USIC), and operates across -40°C to +105°C. Its TSSOP-38 package supports high-pin-count I/O in space-constrained industrial modules.
For engineers reviewing the XMC1100T038X0064ABXUMA1 datasheet, XMC1100T038X0064ABXUMA1 pinout, XMC1100T038X0064ABXUMA1 application, or XMC1100T038X0064ABXUMA1 equivalent, key selection criteria include operating temperature range, on-chip ADC channel count, USIC interface flexibility (UART/I²C/I²S/SPI/LIN), and Flash/SRAM memory allocation for real-time firmware execution.
Technical Context
The XMC1100T038X0064ABXUMA1 implements a single-core ARM Cortex-M0 CPU with Thumb/Thumb-2 instruction set support, 32-bit hardware multiplier, and SysTick timer. It integrates a nested vectored interrupt controller (NVIC) and event request unit (ERU) for deterministic real-time response to external and internal triggers.
Its analog subsystem includes a 12-bit VADC with up to 12 input channels and dedicated temperature sensor interface. Digital peripherals comprise two USIC modules supporting UART, I²C, I²S, SPI, and LIN protocols, plus CCU4 timers, RTC, WDT, and PRNG - all connected via AHB-Lite and APB buses with bridge arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit, Thumb/Thumb-2 ISA, single-cycle 32-bit hardware multiplier - enables efficient C/C++ code execution and deterministic interrupt latency. |
| Flash Memory | 64 KB on-chip Flash with sector 0 read-only protection - sufficient for bootloader + application firmware with field-upgrade capability. |
| SRAM | 16 KB on-chip SRAM - supports real-time data buffering, stack/heap allocation, and peripheral descriptor storage without external memory. |
| ADC | 12-bit VADC with 12 input channels - provides precision analog sensing for motor current, voltage, temperature, and environmental monitoring. |
| Temperature Range | -40°C to +105°C - qualified for extended industrial environments including motor drives, power supplies, and factory automation nodes. |
| Package | TSSOP-38 (PG-TSSOP-38-9) - surface-mount, 0.5 mm pitch, thermally enhanced for convection-cooled PCBs in compact enclosures. |
| Debug Interface | Serial Wire Debug (SWD) and Single Pin Debug (SPD) - enables low-pin-count in-circuit debugging and production programming. |
Pinout & Package
Package: PG-TSSOP-38-9 (38-pin Thin Shrink Small Outline Package, 9.7 mm × 4.4 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Core Power Supply | 1.8–5.5 V supply for digital logic and CPU core - supports wide-input industrial power rails with internal LDO regulation. |
| VSSP | Digital Ground | Reference ground for digital I/O and core logic - must be connected to system GND plane with low-inductance path. |
| P0.0–P0.15 | General-Purpose I/O Port 0 | 16-bit bidirectional port with individual bit control, configurable pull-up/down, hysteresis, and open-drain option - used for GPIO, PWM output, or peripheral function multiplexing. |
| P1.0–P1.7 | General-Purpose I/O Port 1 | 8-bit bidirectional port with same configurability as P0 - extends I/O count for sensor interfaces, status LEDs, or relay drivers. |
| USID0.SCLK / USID1.SCLK | USIC Clock Output | Dedicated clock pins for USIC0 and USIC1 synchronous serial interfaces - enables independent SPI master/slave or I²C clock generation per channel. |
| VAREF | Analog Reference Input | External reference voltage input for VADC - sets full-scale conversion range; can be tied to internal 3.3 V or external precision reference. |
| TSIN | Temperature Sensor Input | Analog input for integrated temperature sensor - allows on-die thermal monitoring without external components. |
Key Features
| Feature | Design Value |
|---|---|
| Two USIC Modules | Each supports UART, I²C, I²S, SPI, and LIN in hardware - eliminates software bit-banging and reduces CPU load for multi-protocol communication stacks. |
| 12-Bit VADC with 12 Channels | Simultaneous sampling not supported, but configurable scan sequences enable sequential acquisition of multiple sensors - ideal for motor phase current and bus voltage monitoring. |
| CCU4 Timer Units | Four capture/compare units per CCU4 block - provide flexible PWM generation, input capture for encoder signals, and dead-time insertion for half-bridge gate driving. |
| Real-Time Clock (RTC) | Independent 32.768 kHz oscillator input with alarm and calendar functions - maintains timekeeping during sleep modes for scheduled wake-up or logging intervals. |
| Window Watchdog Timer (WDT) | Configurable timeout window prevents runaway code while allowing safe firmware updates - critical for safety-compliant industrial firmware. |
Applications
| Motor Control Subsystem | Industrial Sensor Node |
|---|---|
|
Use Scenario: Closed-loop BLDC motor commutation in HVAC blowers or conveyor drives. IC Role / Device Role / Timing Role: Real-time PWM generation, current/voltage ADC sampling, and position feedback decoding via ERU and CCU4. Use Value: Enables precise 6-step or FOC control with <1 µs interrupt latency and hardware-accelerated signal processing. |
Use Scenario: Multi-sensor environmental monitoring in factory floor cabinets. IC Role / Device Role / Timing Role: Analog front-end for temperature, humidity, and vibration sensors; time-stamped data logging via RTC and SPI flash interface. Use Value: Integrates 12 ADC channels and dual USIC for simultaneous sensor reads and wireless gateway communication (e.g., UART-to-LoRa). |
| Power Supply Monitoring | PLC I/O Module |
|
Use Scenario: Overvoltage, undervoltage, and overtemperature protection in AC/DC SMPS. IC Role / Device Role / Timing Role: High-speed ADC sampling of rail voltages and thermal diode outputs; fast WDT-triggered shutdown via GPIO. Use Value: Achieves <10 µs fault detection-to-shutdown latency using hardware comparators and ERU event chaining. |
Use Scenario: Digital input/output expansion for modular PLC backplanes. IC Role / Device Role / Timing Role: Isolated digital I/O conditioning, debounce filtering, and protocol translation (e.g., Modbus RTU over RS-485 via USIC). Use Value: Reduces BOM cost by integrating 24 GPIOs, UART, and hardware CRC in one TSSOP-38 device - no external level shifters or protocol ICs required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar industrial microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XMC1100T038F0064ABXUMA1 | Same core, Flash, SRAM, and package; rated for -40°C to +85°C instead of +105°C. | Limited to ambient-controlled enclosures; unsuitable for under-hood or high-heat industrial zones. | Select when operating environment stays below 85°C and cost sensitivity outweighs extended temperature margin. |
| XMC1200T038X0064ABXUMA1 | ARM Cortex-M0+, higher clock speed (up to 48 MHz vs. 32 MHz), 2x CCU8 units, enhanced USIC features. | Supports more complex motion control algorithms and faster communication stacks (e.g., CAN FD via USIC). | Choose for next-generation designs requiring higher compute throughput or future-proofing beyond basic motor/sensor tasks. |
Compared with XMC1100T038X0064ABXUMA1, the F-variant trades temperature grade for lower cost in benign environments, while the XMC1200 offers architectural upgrades - not drop-in replacements - requiring firmware and timing validation for migration.
Availability
XMC1100T038X0064ABXUMA1 is available at Aetrix Electronics and suitable for industrial motor control, sensor node deployment, and power supply monitoring requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for XMC1100T038X0064ABXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO 9001 and IATF 16949.
The XMC1100 series belongs to Infineon's XMC1000 family - engineered specifically for cost-sensitive, real-time industrial applications where robustness, analog integration, and protocol flexibility outweigh raw performance.
FAQ
What debug interfaces does XMC1100T038X0064ABXUMA1 support?
The device supports Serial Wire Debug (SWD) using SWDIO and SWCLK pins, and Single Pin Debug (SPD) using a dedicated SPD pin. SWD enables full JTAG-like debugging with breakpoints and watchpoints; SPD reduces pin count for production programming and basic firmware verification. Both interfaces are accessible via standard ARM-compliant debug probes.
Does XMC1100T038X0064ABXUMA1 include hardware encryption or secure boot?
No. The XMC1100T038X0064ABXUMA1 does not integrate hardware cryptographic accelerators, TRNG, or secure boot ROM. It relies on software-based security primitives and external secure elements for authentication or encrypted firmware updates. Its PRNG is pseudo-random and not certified for cryptographic use.
Can the USIC modules operate simultaneously as different protocols?
Yes. USIC0 and USIC1 are fully independent. One can run UART for host communication while the other executes I²C for sensor polling or SPI for EEPROM access - all concurrently without CPU intervention. Each USIC has its own clock generator, FIFO, and protocol-specific state machines.
What is the maximum ADC sampling rate for a single channel?
The VADC achieves up to 1.5 MSps (mega-samples per second) for single-channel operation at 12-bit resolution. This rate assumes optimal clock configuration (PCLK = 48 MHz) and minimal conversion overhead. Multi-channel scanning reduces effective throughput due to sequencing and settling delays.
XMC1100T038X0064ABXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- XMC1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, I2S, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XMC1100T038X0064ABXUMA1 FAQ
1.How can I place an order for XMC1100T038X0064ABXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XMC1100T038X0064ABXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XMC1100T038X0064ABXUMA1 reliable?
The price and inventory of XMC1100T038X0064ABXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XMC1100T038X0064ABXUMA1 is usually 5 days.
3.What payment methods are accepted for XMC1100T038X0064ABXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XMC1100T038X0064ABXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XMC1100T038X0064ABXUMA1?
XMC1100T038X0064ABXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XMC1100T038X0064ABXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XMC1100T038X0064ABXUMA1?
For technical support, including XMC1100T038X0064ABXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XMC1100T038X0064ABXUMA1 requirements.
6.How does Aetrix verify that XMC1100T038X0064ABXUMA1 is sourced from the original manufacturer or authorized distributors?
All XMC1100T038X0064ABXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC1100T038X0064ABXUMA1 meets industry standards.
7.What is the process for return or replacement of XMC1100T038X0064ABXUMA1?
All XMC1100T038X0064ABXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XMC1100T038X0064ABXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XMC1100T038X0064ABXUMA1 part is unused and in its original packaging.
Return procedure for XMC1100T038X0064ABXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XMC1100T038X0064ABXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
