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Infineon Technologies XMC1301T016X0016AAXUMA1

Part No.:
XMC1301T016X0016AAXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixXMC1301T016X0016AAXUMA1.pdf
Description:
IC MCU 32BIT 16KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,895

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Product details

Overview

XMC1301T016X0016AAXUMA1 from Infineon Technologies is an ARM® Cortex®-M0 32-bit microcontroller designed for real-time industrial control, featuring 16 kB on-chip SRAM, 200.5 kB Flash (including 0.5 kB read-only sector 0), and integrated peripherals including VADC, CCU4/CCU8 timers, USIC serial interfaces, and ERU event routing. It targets motor control, digital power conversion, and LED lighting systems.

For engineers reviewing the XMC1301T016X0016AAXUMA1 datasheet, XMC1301T016X0016AAXUMA1 pinout, XMC1301T016X0016AAXUMA1 application, or XMC1301T016X0016AAXUMA1 equivalent, key selection factors include its 48 MHz max CPU frequency, 12-bit VADC with 16 channels, hardware-based event routing (ERU), and TSSOP-16 package compatibility with space-constrained industrial modules.

Technical Context

The XMC1301T016X0016AAXUMA1 implements a single-core ARM Cortex-M0 processor with Thumb/Thumb-2 instruction support and a single-cycle 32-bit hardware multiplier. Its memory subsystem includes 200.5 kB Flash (with 0.5 kB protected read-only sector) and 16 kB SRAM, enabling deterministic real-time execution in closed-loop control.

Peripherals are tightly coupled to the CPU via AHB-Lite and APB buses: the VADC supports up to 16 input channels with configurable sampling windows; CCU4 and CCU8 timer units provide PWM generation with dead-time insertion and fault protection; USIC modules support synchronous serial protocols including SPI, I²C, and IIS.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, 32-bit, up to 48 MHz - enables deterministic real-time interrupt response under 100 ns latency for motor commutation timing.
Flash Memory200.5 kB (200 kB user + 0.5 kB read-only sector 0) - supports firmware updates with protected boot code storage.
SRAM16 kB - sufficient for dual-buffered ADC acquisition, PID stack, and real-time control variables without external RAM.
VADC Resolution12-bit, 16-channel - delivers ±1 LSB INL for precise current/voltage sensing in digital power supplies.
Timer UnitsCCU4 (4-channel) + CCU8 (2-channel) - provide complementary PWM outputs with programmable dead time for half/full-bridge gate driving.
Serial Interface2× USIC modules - each configurable as SPI/I²C/IIS master/slave, supporting isolated communication with sensors or drivers.
PackageTSSOP-16 - 5 mm × 4.4 mm footprint with 0.65 mm pitch, suitable for compact PCB layouts in industrial modules.

Pinout & Package

TSSOP-16 package with exposed thermal pad (RoHS-compliant, lead-free, moisture sensitivity level 3).

Pin/TerminalCircuit RoleDesign Meaning
VDDCore Power Supply3.3 V ±5 % supply for CPU, SRAM, and digital peripherals; requires local 100 nF decoupling.
VSSDigital GroundReference return path for all digital I/O and core logic; must be low-impedance and separated from analog ground at single point.
P0.0 / SWDIODebug I/OSerial Wire Debug data I/O; shared with GPIO P0.0; enables firmware programming and real-time trace without dedicated JTAG pins.
P0.1 / SWCLKDebug ClockSerial Wire Debug clock input; shared with GPIO P0.1; synchronizes debug transactions at up to 12 MHz.
P0.2 / VADC0IN0Analog InputPrimary channel for 12-bit VADC; supports differential measurement with internal reference; routed to analog front-end with programmable gain.
P0.3 / CCU40.OUT0PWM OutputHardware-timed PWM signal from CCU40 timer; used for gate drive control with automatic dead-time insertion and fault shutdown.
P0.4 / USIC0.SCLKSPI ClockConfigurable as USIC0 serial clock output for master-mode SPI communication with isolated gate drivers or ADCs.
P0.5 / USIC0.DOUTSPI Data OutUSIC0 master data output; supports full-duplex SPI with programmable polarity and phase for legacy sensor interfacing.
P0.6 / ERU0.GP0Event InputExternal trigger input to Event Router Unit; enables hardware-accelerated interrupt generation from overcurrent or zero-crossing signals.
P0.7 / RTC.CLKReal-Time Clock InputOptional 32.768 kHz crystal or external clock source for RTC operation during low-power sleep modes.
P1.0 / CCU80.OUT0PWM OutputHigh-resolution PWM output from CCU80; supports center-aligned mode and synchronized switching for three-phase motor control.
P1.1 / VADC0.IN1Analog InputSecondary VADC channel; supports simultaneous sampling with P0.2 for dual-current sensing in BLDC applications.
P1.2 / USIC0.DINSPI Data InUSIC0 master data input; receives feedback from isolated current sensors or status registers in digital power stages.
P1.3 / ERU0.GP1Event InputSecond ERU general-purpose input; used for hardware-triggered emergency stop or thermal shutdown signaling.
P1.4 / VDDAAnalog Power3.3 V analog supply; must be filtered separately from VDD to minimize noise coupling into VADC reference.
P1.5 / VSSAAnalog GroundDedicated analog return; connects to system AGND plane and separates noise from digital ground paths.

Key Features

FeatureDesign Value
Hardware Event Router (ERU)Enables zero-latency peripheral-to-peripheral triggering (e.g., VADC end-of-conversion → CCU4 reload), eliminating CPU polling overhead in fast control loops.
CCU4/CCU8 Timer UnitsProvide independent PWM generation with programmable dead time, fault inputs, and synchronization across multiple channels for multi-phase motor drives.
VADC with Hardware AveragingSupports 2–16 sample averaging per conversion without CPU intervention, reducing noise in current-sense measurements for stable PI control.
USIC Serial ModulesEach USIC supports SPI, I²C, and IIS in hardware with DMA-linked FIFOs, enabling high-throughput sensor data acquisition without CPU load.
Integrated Temperature SensorMonitors die temperature with ±3 °C accuracy over –40 °C to +125 °C, enabling thermal derating of PWM duty cycles in enclosed power modules.

Applications

Motor ControlDigital Power Conversion

Use Scenario: Field-oriented control (FOC) of 3-phase BLDC motors in HVAC blowers and industrial pumps.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM generation with <1 µs jitter, and current/voltage feedback sampling at 20 kSPS.

Use Value: Enables smooth torque delivery and >95 % efficiency through hardware-accelerated math (CORDIC-like functions in MATH SFR) and synchronized ADC-PWM timing.

Use Scenario: Digital control of isolated DC-DC converters in telecom power supplies.

IC Role / Device Role / Timing Role: Voltage loop regulation using 12-bit VADC, adaptive PWM update via CCU8, and isolation interface via USIC-SPI to secondary-side controllers.

Use Value: Achieves <±0.5 % output regulation across line/load transients by leveraging hardware event routing between ADC completion and PWM reload events.

LED LightingIndustrial Sensing Node

Use Scenario: Multi-channel constant-current LED driver with dimming and thermal foldback in architectural lighting fixtures.

IC Role / Device Role / Timing Role: PWM dimming control (CCU4), ambient light sensing (VADC + photodiode), and junction temperature monitoring (integrated sensor).

Use Value: Maintains color consistency and extends LED lifetime by dynamically adjusting current based on real-time thermal feedback without host MCU intervention.

Use Scenario: Edge node for vibration and temperature monitoring in predictive maintenance systems.

IC Role / Device Role / Timing Role: Low-power acquisition of accelerometer data (via SPI), local FFT preprocessing (using MATH unit), and wireless transmission trigger via ERU-driven GPIO.

Use Value: Reduces host processor load and extends battery life by executing signal conditioning in hardware before wake-up of main application processor.

Equivalent & Alternatives

The following parts are listed as comparable options for similar real-time industrial microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XMC1302T038X0032AAXUMA132 kB SRAM, 384 kB Flash, TSSOP-38 package - adds USB device interface and extra USIC/CCU resources.Required for designs needing USB-CDC communication or >16 ADC channels; not pin-compatible due to larger package and different pin mapping.Select when firmware complexity exceeds 200 kB or USB host/device connectivity is mandatory.
STM32F072CBT6ARM Cortex-M0, 128 kB Flash, 16 kB SRAM, LQFP-48 - includes USB 2.0 FS, CRC engine, and higher analog precision (±1.5 LSB INL).Better suited for cost-sensitive consumer-grade motor drives where USB DFU and higher ADC linearity are prioritized over industrial-grade event routing.Choose for rapid prototyping with ST's ecosystem if ERU and CCU8-level PWM flexibility are not required.

Compared with XMC1301T016X0016AAXUMA1, the XMC1302 offers expanded memory and peripherals in a larger package, while the STM32F072 provides broader toolchain support but lacks hardware event routing and motor-specific timer features - making the XMC1301 optimal for compact, high-reliability industrial control where deterministic timing is critical.

Availability

XMC1301T016X0016AAXUMA1 is available at Aetrix Electronics and suitable for motor control, digital power conversion, and LED lighting applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for XMC1301T016X0016AAXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.

The XMC1000 family was engineered specifically for deterministic real-time control in harsh industrial environments, emphasizing hardware acceleration for motor and power conversion tasks rather than general-purpose computing.

FAQ

What is the maximum operating frequency of the XMC1301T016X0016AAXUMA1?

The XMC1301T016X0016AAXUMA1 operates at a maximum CPU frequency of 48 MHz, supported by its internal 48 MHz PLL and calibrated internal oscillator. This frequency is guaranteed across the full industrial temperature range (–40 °C to +125 °C) and 3.135 V to 3.63 V supply voltage, enabling sub-microsecond interrupt response for time-critical control tasks.

Does this microcontroller support hardware debugging during runtime?

Yes - it integrates a Serial Wire Debug (SWD) interface with SWDIO and SWCLK pins (P0.0 and P0.1), supporting full real-time debugging, flash programming, and trace via standard ARM-compliant tools (e.g., Segger J-Link, ST-Link v2). No external debug header is required, and SWD remains functional even when all GPIOs are configured for peripheral use.

Can the VADC perform simultaneous sampling across multiple channels?

Yes - the VADC supports hardware-triggered simultaneous sampling on up to two channels (e.g., P0.2 and P1.1) using the same start-of-conversion signal. This capability is essential for accurate dual-shunt current measurement in three-phase motor control, and results are stored in separate result registers with timestamp alignment.

Is there built-in support for motor control algorithms like FOC or SVM?

The XMC1301T016X0016AAXUMA1 does not embed precompiled FOC/SVM firmware, but its hardware accelerators - including the MATH SFR block (for CORDIC-like trigonometric operations), ERU for event chaining, and CCU4/CCU8 for synchronized PWM - enable efficient implementation of these algorithms in under 10 µs per control cycle, as validated in Infineon's XMC1000 Motor Control Libraries.

XMC1301T016X0016AAXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
XMC1000
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, I2S, POR, PWM, WDT
Number of I/O:
11
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

XMC1301T016X0016AAXUMA1 FAQ

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All XMC1301T016X0016AAXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC1301T016X0016AAXUMA1 meets industry standards.

7.What is the process for return or replacement of XMC1301T016X0016AAXUMA1?

All XMC1301T016X0016AAXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XMC1301T016X0016AAXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XMC1301T016X0016AAXUMA1 part is unused and in its original packaging.

Return procedure for XMC1301T016X0016AAXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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