My Inquiry
My Account
Infineon Technologies XMC1302T038X0200AAXUMA1
- Part No.:
- XMC1302T038X0200AAXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 38-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
XMC1302T038X0200AAXUMA1.pdf
- Description:
- IC MCU 32BIT 200KB FLASH 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,134
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XMC1302T038X0200AAXUMA1 from Infineon Technologies is a 32-bit ARM® Cortex®-M0 microcontroller with 200 kB on-chip flash, 16 kB SRAM, and integrated peripherals including VADC (12-bit, 16-channel), CCU4/CCU8 timer units, USIC serial interfaces, and ERU event routing. It operates at up to 48 MHz and targets real-time industrial control applications such as motor drive commutation and digital power supply regulation.
For engineers reviewing the XMC1302T038X0200AAXUMA1 datasheet, XMC1302T038X0200AAXUMA1 pinout, XMC1302T038X0200AAXUMA1 application, or XMC1302T038X0200AAXUMA1 equivalent, key selection criteria include flash/SRAM size, VADC resolution and channel count, CCU8 dead-time configurable PWM capability, USIC flexibility for SPI/I²C/I²S, and TSSOP-38 package compatibility with space-constrained PCB layouts.
Technical Context
The device implements a deterministic real-time subsystem centered on dual capture/compare units (CCU4 and CCU8) supporting center-aligned PWM, complementary outputs with programmable dead time, and position interface (POSIF) for encoder feedback. Its VADC features hardware-accelerated sequencing, window comparison, and post-processing via DAVE™-generated drivers.
System-level timing is managed by an on-chip 48 MHz high-speed internal oscillator (HSI), supplemented by a 32 kHz low-power oscillator (LSI) for RTC operation. Debug and programming use Serial Wire Debug (SWD) over two pins, with no JTAG support in this variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit, up to 48 MHz - enables deterministic interrupt latency & RTOS compatibility |
| Flash Memory | 200 kB + 0.5 kB read-only sector - sufficient for complex motor control algorithms with firmware update partitioning |
| SRAM | 16 kB - supports real-time stack, DMA buffers, and sensor data caching without external memory |
| VADC | 12-bit, 16-channel, 1.2 MSPS max - meets resolution/speed requirements for current sensing and voltage monitoring in inverters |
| CCU8 Unit | 4-channel, 32-bit, dead-time configurable - enables precise gate driving for 3-phase IGBT/MOSFET bridges |
| Package | TSSOP-38, 0.65 mm pitch - surface-mount compatible with automated assembly and thermal performance suitable for <2W dissipation |
| Operating Voltage | 1.62–5.5 V - supports direct connection to 3.3 V or 5 V industrial rails without level-shifting |
Pinout & Package
TSSOP-38 (Thin Shrink Small Outline Package), 38-pin, 0.65 mm pitch, body width 4.4 mm, JEDEC MO-153 compliant. Thermal pad not present; recommended PCB land pattern per Infineon document AP32279.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Core Power Supply | 1.62–5.5 V input for CPU, flash, and SRAM; requires local 100 nF decoupling |
| VSS | Digital Ground | Reference return for all digital I/O and core logic; must be connected to system GND plane |
| P0.0 / SWDIO | Debug Data I/O | Serial Wire Debug bidirectional data line; also usable as general-purpose GPIO after debug detachment |
| P0.1 / SWCLK | Debug Clock Input | Serial Wire Debug clock input; driven by debugger; not software-controllable as GPIO |
| P1.0 / CCU80.OUT00 | PWM Output Channel 0 | Hardware-generated PWM signal from CCU8 unit; supports dead-time insertion and fault protection |
| P1.2 / VADC0.CH0 | Analog Input Channel 0 | Dedicated ADC input with internal sample-and-hold; routed directly to VADC0 multiplexer |
| P2.0 / USIC0.CH0.SCLK | USIC Clock Output | Configurable serial clock for SPI master or I²S bit clock generation; phase/polarity programmable |
Key Features
| Feature | Design Value |
|---|---|
| Integrated POSIF | Hardware position interface supporting quadrature decoding and index pulse capture for BLDC/PMSM rotor position tracking |
| ERU Event Router | Configurable crossbar switching of 16 digital events (e.g., ADC EOC, CCU8 period match) to 8 destinations without CPU intervention |
| Hardware Math Accelerator | CORDIC engine for sin/cos/arctan and magnitude calculation - offloads trigonometric computation from Cortex-M0 core |
| Temperature Sensor | On-die sensor with ±3°C accuracy over -40°C to +125°C - enables thermal derating in motor driver MOSFETs |
| Power Management | Four low-power modes (Sleep, Standby, Power-down, Deep Power-down) with wake-up via GPIO, timer, or ADC event |
Applications
| Motor Control | Digital Power Supply |
|---|---|
Use Scenario: Field-oriented control (FOC) of 3-phase BLDC motors in HVAC blowers and industrial pumps. IC Role / Device Role / Timing Role: Real-time execution of FOC loop (current sampling → Clarke/Park transforms → PI regulation → SVM PWM generation) within 50 µs cycle time. Use Value: CCU8's hardware dead-time insertion and POSIF-based rotor position tracking eliminate CPU overhead and timing jitter in gate drive signals. | Use Scenario: Digital AC-DC PFC and LLC resonant converter control in server PSUs and telecom rectifiers. IC Role / Device Role / Timing Role: Simultaneous sampling of input voltage/current and output voltage, plus closed-loop regulation using dual VADC sequencers and CCU4-based variable-frequency PWM. Use Value: VADC hardware window comparison triggers immediate CCU4 reload to prevent overvoltage/overcurrent faults within <1 µs response. |
| LED Lighting | Industrial I/O Module |
Use Scenario: Multi-channel constant-current LED driver with DALI/DMX512 interface and thermal foldback. IC Role / Device Role / Timing Role: USIC0 configured as DMX512 receiver + CCU4 generating multi-channel dimming PWM with synchronized fade curves. Use Value: ERU routes DMX frame end event to CCU4 reset, ensuring zero-jitter synchronization across 16+ LED channels. | Use Scenario: DIN-rail mounted analog input module converting 4–20 mA sensor signals to Modbus RTU over RS-485. IC Role / Device Role / Timing Role: VADC oversampling (16x) for 16-bit effective resolution on current loop inputs; USIC1 as RS-485 half-duplex UART with automatic direction control. Use Value: Integrated temperature sensor enables automatic gain calibration drift compensation across -25°C to +70°C operating range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XMC1302T038X0128AAXUMA1 | 128 kB flash, same 16 kB SRAM, identical peripheral set and pinout | Insufficient flash for full FOC + communication stack (e.g., CANopen + safety monitor) | Select when firmware footprint is ≤110 kB and no field upgrade partitioning is required |
| XMC1402F048X0200AAXUMA1 | Same flash/SRAM, but QFN-48 package, added USB 2.0 FS controller and enhanced CCU8 with shadow registers | Requires PCB redesign; USB enables firmware updates via host, not supported in TSSOP-38 variant | Select when USB-based field updates or higher I/O count (>32 pins) is mandatory |
Compared with XMC1302T038X0200AAXUMA1, the 128 kB variant trades flash headroom for identical cost and footprint, while the XMC1402 adds USB and package size at higher BOM and layout complexity - choice depends strictly on firmware size and connectivity requirements.
Availability
XMC1302T038X0200AAXUMA1 is available at Aetrix Electronics and suitable for motor control, digital power conversion, and industrial lighting applications requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.
Supply support for XMC1302T038X0200AAXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial microcontrollers, with global R&D and manufacturing infrastructure.
This part belongs to the XMC1000 family - a line of ARM Cortex-M0-based MCUs engineered specifically for deterministic real-time control in motor drives, digital power, and intelligent lighting systems.
FAQ
Does XMC1302T038X0200AAXUMA1 support CAN bus communication?
No. This device lacks a CAN controller or physical transceiver interface. It provides USIC modules configurable for UART, SPI, I²C, and I²S only. For CAN-enabled variants, consider the XMC4000 family or XMC1400 series with dedicated CIC peripheral.
What debug interface does XMC1302T038X0200AAXUMA1 use?
It uses Serial Wire Debug (SWD) with two dedicated pins: SWDIO (P0.0) and SWCLK (P0.1). JTAG is not implemented. Debug access requires an SWD-compliant probe (e.g., Segger J-Link, ST-LINK/V2-1) and supports full halt-mode debugging, flash programming, and real-time memory inspection.
Is the 0.5 kB read-only flash sector accessible for bootloader storage?
Yes. Sector 0 (0x0000_0000–0x0000_01FF) is readable but write-protected at silicon level. It is commonly used to store immutable bootloader code or cryptographic keys. Access requires no special unlock sequence - reads succeed, writes always fail with BUSFAULT.
Can the VADC operate simultaneously with CCU8 PWM generation without CPU intervention?
Yes. The VADC supports hardware trigger sources including CCU8 period-match and CCU4 capture events. When configured for hardware-triggered conversion, the ADC starts sampling automatically on PWM edge, stores results to RAM via DMA, and asserts interrupt only on sequence completion - enabling fully autonomous current/voltage sampling synchronized to switching cycles.
XMC1302T038X0200AAXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 38-TFSOP (0.173", 4.40mm Width)
- Series:
- XMC1000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, I2S, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 200KB (200K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XMC1302T038X0200AAXUMA1 FAQ
1.How can I place an order for XMC1302T038X0200AAXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for XMC1302T038X0200AAXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XMC1302T038X0200AAXUMA1 reliable?
The price and inventory of XMC1302T038X0200AAXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XMC1302T038X0200AAXUMA1 is usually 5 days.
3.What payment methods are accepted for XMC1302T038X0200AAXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XMC1302T038X0200AAXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XMC1302T038X0200AAXUMA1?
XMC1302T038X0200AAXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XMC1302T038X0200AAXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XMC1302T038X0200AAXUMA1?
For technical support, including XMC1302T038X0200AAXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XMC1302T038X0200AAXUMA1 requirements.
6.How does Aetrix verify that XMC1302T038X0200AAXUMA1 is sourced from the original manufacturer or authorized distributors?
All XMC1302T038X0200AAXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC1302T038X0200AAXUMA1 meets industry standards.
7.What is the process for return or replacement of XMC1302T038X0200AAXUMA1?
All XMC1302T038X0200AAXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with XMC1302T038X0200AAXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XMC1302T038X0200AAXUMA1 part is unused and in its original packaging.
Return procedure for XMC1302T038X0200AAXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XMC1302T038X0200AAXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
