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Infineon Technologies XMC7200-F176K8384AA
- Part No.:
- XMC7200-F176K8384AA
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
XMC7200-F176K8384AA.pdf
- Description:
- IC MCU 32BIT 8.18MB 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,133
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Product details
Overview
XMC7200-F176K8384AA from Infineon is a dual-core 32-bit Arm® Cortex®-M7 microcontroller with an auxiliary Arm® Cortex®-M0+ security core, 8384 KB code-flash, 1024 KB SRAM, and integrated CAN FD (up to 8 Mbps), Gigabit Ethernet MAC, and hardware cryptography (AES-128/192/256, ECC, SHA-512, TRNG). It targets industrial motor control, factory automation, and secure edge gateway applications requiring real-time determinism and FOTA-capable dual-bank flash.
For engineers reviewing the XMC7200-F176K8384AA datasheet, XMC7200-F176K8384AA pinout, XMC7200-F176K8384AA application, or XMC7200-F176K8384AA equivalent, key selection criteria include dual-M7 clock speed (350 MHz), on-chip HSM/eSHE support, 220 GPIO count, RGMII/MII/RMII PHY interface options, and 176-pin TEQFP package with 0.5 mm pitch for high-density industrial PCB layouts.
Technical Context
The device implements a tightly coupled heterogeneous multicore architecture: two independent 350-MHz Cortex-M7 cores each with 16 KB I-cache, 16 KB D-cache, and 16 KB TCM, plus a dedicated 100-MHz Cortex-M0+ for peripheral offload and secure boot verification. Inter-processor communication is handled via hardware mailbox and shared memory with SMPU enforcement.
Peripheral subsystems are clocked independently via programmable dividers and protected by PPU; safety-critical memories (SRAM, flash, TCM) employ SECDED ECC, while BOD thresholds are configurable at 2.7 V / 3.0 V (VDDD/VDDA) and 1.1 V (VCCD) for robust brownout resilience in harsh industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual 350-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for secure peripheral management |
| Flash Memory | 8384 KB code-flash with Read-While-Write, dual-bank mode for atomic FOTA updates |
| SRAM | 1024 KB with selectable retention granularity per memory region |
| CAN FD Channels | Up to 10 channels compliant with ISO 11898-1:2015 and Bosch CAN FD v1.0, supporting up to 8 Mbps data rate |
| Ethernet MAC | Two 10/100/1000 Mbps IEEE-802.3az-compliant MACs with MII/RMII/RGMII PHY interface support |
| Cryptography | HSM with AES-128/192/256, ECC, RSA, SHA-1/2/3 (up to SHA-512), TRNG, and Galois/Counter Mode (GCM) |
| Analog Peripherals | Three 12-bit SAR ADCs (99 external channels total, 1 Msps max sample rate, synchronized sampling) |
| I/O Count | 220 programmable GPIOs across three types: GPIO_STD, GPIO_ENH, HSIO_STD |
Pinout & Package
Package: 176-pin TEQFP (24 × 24 × 1.7 mm, 0.5 mm lead pitch), RoHS-compliant, industrial temperature grade (–40°C to +105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog power supply | 2.7–5.5 V analog domain supply with dedicated BOD threshold (2.7 V / 3.0 V) |
| VDDD | Digital core power supply | 2.7–5.5 V digital domain supply with dual-level BOD detection |
| VCCD | Core regulator input | Input to internal 1.1 V core regulator; monitored by 1.1 V BOD |
| XTAL_IN / XTAL_OUT | External crystal oscillator connection | Supports 1–50 MHz crystals for precise clock source; used with ECO block |
| TCK / TMS / TDI / TDO | JTAG debug interface | IEEE-1149.1-compliant boundary scan and debug access; SWD also supported |
| RMII_RXD0 / RMII_RXD1 / RMII_TXD0 / RMII_TXD1 | Gigabit Ethernet RMII interface | Direct connection to RMII PHY; enables compact 5-pin Ethernet interface at 100 Mbps |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential pair | Physical layer interface for first CAN FD bus; supports bit rates up to 8 Mbps |
| SDHC_CLK / SDHC_CMD / SDHC_DATA[0:3] | Secure Digital High Capacity interface | Compliant with SD 6.0 / eMMC 5.1 / SDIO 4.10; supports 50 MHz high-speed mode |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables zero-downtime firmware updates via atomic bank swap during runtime execution |
| Hardware Security Module (HSM) | Offloads secure boot, key provisioning, and cryptographic operations from application cores to dedicated secure enclave |
| Synchronized multi-ADC sampling | Simultaneous capture across all three 12-bit SAR ADCs for motor phase current sensing without software coordination |
| Smart I/O logic blocks | Five configurable Boolean logic units enable real-time signal conditioning (AND/OR/XOR) directly at GPIO level, reducing CPU load |
| Multi-counter watchdog (MCWDT) | Independent watchdog timers per CPU domain with configurable timeout and reset propagation paths for ASIL-B compliance |
| Runtime-reconfigurable SCB | Eleven serial communication blocks dynamically assignable as UART, SPI, or I²C - no fixed peripheral pinout constraints |
Applications
| Industrial Motor Drive | Factory Automation Gateway |
|---|---|
Use Scenario: Closed-loop vector control of 3-phase PMSM/BLDC motors with field-oriented control (FOC) and space-vector PWM. IC Role / Device Role / Timing Role: Primary real-time controller executing FOC algorithm at 20 kHz PWM frequency; synchronizes ADC sampling, PWM generation, and CAN FD status reporting. Use Value: Dual M7 cores allow separation of safety-critical motor control (core 0) and non-safety diagnostics (core 1); 15 dedicated motor-control TCPWM counters enable precise dead-time insertion and phase alignment. | Use Scenario: Edge node aggregating sensor data from PLCs, HMIs, and robotic cells over CAN FD and Ethernet, then forwarding to cloud via TLS-secured MQTT. IC Role / Device Role / Timing Role: Secure protocol gateway with concurrent CAN FD (10 channels) and dual Gigabit Ethernet MACs handling time-sensitive AVB/PTP traffic. Use Value: Hardware-accelerated TLS handshake using HSM reduces latency by >70% vs. software stack; IEEE-1588 PTP support enables sub-microsecond time synchronization across distributed I/O nodes. |
| Energy Management System | Smart Building Controller |
Use Scenario: Real-time monitoring and predictive load balancing across solar inverters, battery storage, and grid-tie interfaces in commercial microgrids. IC Role / Device Role / Timing Role: Central energy scheduler coordinating modbus-TCP, CAN FD, and SDHC-based local logging; performs cryptographic signing of energy transaction records. Use Value: On-chip eSHE validates firmware integrity before each boot; AES-GCM encrypts stored energy logs on external HYPERBUS™ flash with authenticated encryption. | Use Scenario: HVAC, lighting, and access control integration platform managing 200+ BACnet/IP and KNX devices via wired/wireless gateways. IC Role / Device Role / Timing Role: Multi-protocol convergence engine running BACnet stack on M7 core and KNX transceiver logic on M0+ core with isolated memory domains. Use Value: Smart I/O blocks perform real-time occupancy sensor debouncing and relay contact bounce suppression without CPU intervention; 220 GPIOs support direct wiring to legacy 24 V DC sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar industrial multicore microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K398 | Single 320-MHz Arm® Cortex®-M7 core; no secondary M0+ security core; 6 MB flash; supports CAN XL but not Gigabit Ethernet | Targeted at automotive body electronics; lacks IEEE-1588 PTP and AVB support required for industrial time-sensitive networking | Select when automotive ASIL-D certification is mandatory and Gigabit Ethernet is unnecessary |
| Renesas RA8T1 | Dual 480-MHz Cortex®-M85 cores; 4 MB flash; no integrated HSM; relies on external secure element for crypto acceleration | Optimized for motor control with 24-channel PWM and encoder interfaces; no CAN FD or Ethernet MAC on-chip | Select when ultra-high PWM resolution and encoder timing precision outweigh need for integrated networking and security |
Compared with NXP S32K398 and Renesas RA8T1, XMC7200-F176K8384AA uniquely integrates dual M7 performance, on-die HSM, dual Gigabit Ethernet with PTP/AVB, and 10 CAN FD channels - making it the only option for industrial gateways requiring concurrent high-bandwidth deterministic networking and certified secure boot in a single chip.
Availability
XMC7200-F176K8384AA is available at Aetrix Electronics and suitable for industrial motor drive, factory automation gateway, and smart building controller applications requiring stable component supply, long-term lifecycle commitment, and traceable sourcing for production programs.
Supply support for XMC7200-F176K8384AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial microcontrollers with global manufacturing and quality certification to IATF 16949 and ISO 9001.
The XMC7000 product line delivers scalable, secure, real-time multicore MCUs for industrial automation, motion control, and edge intelligence - designed to replace FPGA+MPU combinations with integrated hardware safety and cryptography.
FAQ
What is the maximum operating frequency of the Cortex-M7 cores in XMC7200-F176K8384AA?
The dual Arm® Cortex®-M7 cores operate at up to 350 MHz each, with independent instruction and data caches (16 KB each), tightly coupled memories (16 KB ITCM + 16 KB DTCM), and single-cycle multiply/FPU support. This frequency is guaranteed across the full industrial temperature range (–40°C to +105°C) under specified voltage conditions (VDDD ≥ 2.7 V).
Does XMC7200-F176K8384AA support IEEE-1588 Precision Time Protocol?
Yes - both integrated Gigabit Ethernet MACs fully support IEEE-1588-2008 (PTPv2) with hardware timestamping at the MAC layer, enabling sub-microsecond synchronization accuracy. The device includes dedicated PTP registers, event message filtering, and transparent clock functionality required for industrial time-sensitive networks.
How many CAN FD channels does this MCU support, and what is the maximum data rate?
XMC7200-F176K8384AA supports up to ten CAN FD channels, each compliant with ISO 11898-1:2015 and Bosch CAN FD Specification v1.0. Physical-layer data rates reach up to 8 Mbps in FD mode, subject to transceiver and topology limitations; classical CAN operates up to 1 Mbps.
Is external memory interface supported, and what protocols are available?
Yes - the device includes a flexible external memory interface supporting either SPI (single/dual/quad/octal) or HYPERBUS™ protocols. It enables execute-in-place (XIP) operation with on-the-fly AES-256 encryption/decryption, allowing secure boot from external flash while maintaining real-time performance for code execution.
XMC7200-F176K8384AA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- XMC7000
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 350MHz
- Connectivity:
- CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 148
- Program Memory Size:
- 8.188MB (8.188M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 81x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
XMC7200-F176K8384AA FAQ
1.How can I place an order for XMC7200-F176K8384AA through Aetrix?
Please submit a Request for Quotation (RFQ) for XMC7200-F176K8384AA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XMC7200-F176K8384AA reliable?
The price and inventory of XMC7200-F176K8384AA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XMC7200-F176K8384AA is usually 5 days.
3.What payment methods are accepted for XMC7200-F176K8384AA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XMC7200-F176K8384AA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XMC7200-F176K8384AA?
XMC7200-F176K8384AA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XMC7200-F176K8384AA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XMC7200-F176K8384AA?
For technical support, including XMC7200-F176K8384AA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XMC7200-F176K8384AA requirements.
6.How does Aetrix verify that XMC7200-F176K8384AA is sourced from the original manufacturer or authorized distributors?
All XMC7200-F176K8384AA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XMC7200-F176K8384AA meets industry standards.
7.What is the process for return or replacement of XMC7200-F176K8384AA?
All XMC7200-F176K8384AA units undergo pre-shipment inspection (PSI). If there is an issue with XMC7200-F176K8384AA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XMC7200-F176K8384AA part is unused and in its original packaging.
Return procedure for XMC7200-F176K8384AA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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