Infineon Technologies 1EDN7116GXTMA1
- Part No.:
- 1EDN7116GXTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Gate Drivers
- Package:
- 10-VFDFN Exposed Pad
- Datasheet:
-
1EDN7116GXTMA1.pdf
- Description:
- IC GATE DRVR HI/LOW SIDE 10VFDFN
- Quantity:
- Payment:

- Shipping:

Inventory:7,592
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Product details
Overview
1EDN7116GXTMA1 from Infineon is a single-channel, high-side-capable gate driver IC optimized for GaN Schottky Gate HEMTs and Si MOSFETs, featuring Truly Differential Input (TDI), ±200 V common-mode input range, 4 A peak source/sink current, active Miller clamp (5 A sink), and adjustable negative charge pump for VOFF. It enables robust high-frequency switching in resonant wireless power and BLDC motor drives.
For engineers reviewing the 1EDN7116GXTMA1 datasheet, 1EDN7116GXTMA1 pinout, 1EDN7116GXTMA1 application, or 1EDN7116GXTMA1 equivalent, key selection criteria include TDI noise immunity, bootstrap clamp functionality, Miller clamp strength, VOFF adjustability, and compatibility with 3.3 V/5 V logic inputs without external gate resistors.
Technical Context
The 1EDN7116GXTMA1 implements a fully differential amplifier + Schmitt-trigger input stage to reject common-mode transients up to ±200 V at dV/dt ≤ 100 V/ns, enabling direct high-side operation without isolators. Its TDI architecture uses matched external 33 kΩ resistors on IN+ and IN− to scale ±150 V static CMV into safe CMOS-level signals.
It integrates an active bootstrap clamp to prevent overcharging during dead-time, a 5 A active Miller clamp to suppress dv/dt-induced turn-on, and an adjustable charge pump (via VOFF_ADJ resistor) to generate programmable negative turn-off voltage (–2 V to –5 V), enhancing GaN HEMT reliability under fast switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Output Current | 4 A source/sink - drives GaN HEMT gates with minimal external components and no gate resistor needed for typical layouts. |
| Common-Mode Range | ±200 V dynamic - supports direct high-side gate driving in half-bridge topologies with fast-switching GaN devices. |
| Input Logic Compatibility | 3.3 V or 5 V - selects internal resistor divider ratio via external 33 kΩ (3.3 V) or 68 kΩ (5 V) input resistors. |
| Miller Clamp Sink | 5 A - actively pulls gate below threshold during high dv/dt, preventing false turn-on in GaN HEMTs. |
| VOFF Adjustability | –2 V to –5 V via VOFF_ADJ resistor - sets negative turn-off rail to improve noise margin and reduce gate oscillation. |
| Input Pulse Blanking | 50 ns - rejects narrow noise spikes while preserving PWM fidelity for >50 ns duty-cycle resolution. |
| UVLO Thresholds | VDD UVLO: 4.75 V (rising), 4.4 V (falling); charge pump UVLO latches after startup - ensures safe enablement only when supply and bias rails are stable. |
Pinout & Package
1EDN7116GXTMA1 is housed in a thermally enhanced PG-VSON-8 (3.0 × 3.0 mm, 0.5 mm pitch) package with exposed thermal pad (VSS-connected) for low-θJA performance in high-power density designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN+ | Differential input positive | Accepts scaled-down PWM signal; paired with IN− to reject ground bounce and CMV transients. |
| IN− | Differential input negative | Reference node for TDI; must match IN+ resistor value within ±0.1 % for full ±150 V CMV rejection. |
| OUT_SRC | Gate pull-up output | Drives gate to VDD with 4 A peak current; connects directly to GaN HEMT gate without series resistor. |
| OUT_SNK | Gate pull-down output | Active Miller clamp path; sinks 5 A to VOFF to force gate below threshold during high dv/dt events. |
| BST | Bootstrap diode anode | Supports high-side operation in half-bridge; internal clamp limits bootstrap capacitor voltage to safe level. |
| VDD | Driver supply input | 12–20 V gate drive rail; powers output stage and logic; UVLO protects against linear-mode conduction. |
| VOFF_ADJ | Charge pump adjustment | Resistor-to-VSS sets negative turn-off voltage (–2 V to –5 V); improves noise immunity for GaN gate control. |
| VSS | Power/thermal return | Ground reference for VDD and thermal pad; must be low-inductance connection to minimize switching noise coupling. |
| CF+ | Charge pump positive | Connects flying capacitor to generate negative VOFF; requires ceramic capacitor (100 nF typical). |
| CF− | Charge pump negative | Return path for charge pump; ties to VOFF node; critical for stable negative rail generation. |
Key Features
| Feature | Design Value |
|---|---|
| Truly Differential Input (TDI) | Rejects ±200 V dV/dt transients without isolators; eliminates false triggering in noisy motor or resonant converter environments. |
| Active Bootstrap Clamp | Prevents bootstrap capacitor overvoltage during dead-time, enabling reliable high-side operation without external Zener clamps. |
| 5 A Active Miller Clamp | Stronger than typical 1–2 A clamps; suppresses induced turn-on in GaN HEMTs even at >100 V/ns dv/dt rates. |
| Adjustable Negative Turn-Off Rail | VOFF set from –2 V to –5 V via single resistor; reduces gate oscillation and improves EMI margin in high-frequency GaN designs. |
| Input Pulse Blanking (50 ns) | Filters sub-50 ns noise spikes while preserving PWM timing integrity - essential for >1 MHz switching in Class-E wireless power. |
Applications
| Class-E Resonant Wireless Power | Synchronous Rectifier |
|---|---|
|
Use Scenario: High-efficiency 6.78 MHz wireless charging transmitter using GaN HEMT half-bridge. IC Role / Device Role / Timing Role: High-side gate driver with TDI and active Miller clamp ensures clean, jitter-free switching despite large CMV swings from resonant tank ringing. Use Value: Enables >95% system efficiency by minimizing gate losses and eliminating false turn-on during zero-voltage switching transitions. |
Use Scenario: Secondary-side synchronous rectification in isolated DC-DC converters using CoolGaN HEMTs. IC Role / Device Role / Timing Role: Low-side driver with 4 A drive strength and 50 ns blanking delivers precise, fast turn-on/turn-off aligned with primary-side timing. Use Value: Reduces conduction loss vs. silicon MOSFETs and avoids shoot-through risk due to ultra-fast, noise-immune edge detection. |
| BLDC Motor Drive (Half-Bridge) | Class-D Audio Amplifier |
|
Use Scenario: 3-phase BLDC inverter for e-bike or drone propulsion, operating at 100 kHz with GaN HEMTs. IC Role / Device Role / Timing Role: Single-channel high-side driver per phase leg; TDI rejects motor back-EMF-induced CMV spikes during commutation. Use Value: Eliminates need for optocouplers or digital isolators, reducing BOM cost and PCB area while maintaining functional safety margins. |
Use Scenario: High-fidelity Class-D amplifier output stage using GaN HEMTs for <1% THD+N at 20 kHz bandwidth. IC Role / Device Role / Timing Role: Low-side driver with adjustable VOFF minimizes gate ringing and crossover distortion during high-slew-rate switching. Use Value: Improves audio fidelity by suppressing parasitic oscillations and enabling clean 1 MHz carrier modulation without snubbers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side GaN gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1EDN7126GXTMA1 | Higher 6 A peak current; 70 ns input blanking; same package and pinout. | Better suited for >150 kW motor drives requiring faster GaN switching and higher noise immunity. | Select when gate charge exceeds 15 nC or dv/dt > 150 V/ns is expected. |
| UCC27611DR | Non-differential input; 10 A peak; no integrated Miller clamp or charge pump; requires external negative bias. | Requires external isolation and bias circuitry; less suitable for compact high-side GaN designs. | Choose only if cost sensitivity outweighs integration benefits and layout space allows added components. |
Compared with 1EDN7126GXTMA1, this part trades peak current and blanking time for tighter timing control and lower EMI in mid-power resonant systems; versus UCC27611DR, it delivers full GaN-optimized integration-eliminating six external components while improving noise immunity and reliability.
Availability
1EDN7116GXTMA1 is available at Aetrix Electronics and suitable for Class-E wireless power transmitters, BLDC motor inverters, synchronous rectifiers, and Class-D audio amplifiers requiring stable component supply across industrial and consumer production programs.
Supply support for 1EDN7116GXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and wide-bandgap solutions, with leadership in GaN and SiC device ecosystems.
This part belongs to the EiceDRIVER™ TDI family, designed specifically to simplify high-reliability GaN HEMT gate driving in high-frequency, high-efficiency power conversion systems without external isolation or bias circuitry.
FAQ
What logic voltage levels does 1EDN7116GXTMA1 support?
The device supports both 3.3 V and 5 V controller logic inputs. For 3.3 V, use 33 kΩ resistors on IN+ and IN−; for 5 V, use 68 kΩ. These values scale common-mode voltages to safe internal CMOS levels while maintaining ±0.1 % matching tolerance for full ±150 V static CMV rejection.
How does the active Miller clamp prevent false turn-on in GaN HEMTs?
The clamp provides a dedicated 5 A low-impedance path from the gate to VOFF during high dv/dt events, actively pulling the gate below threshold faster than parasitic Cgd can induce turn-on. This is significantly stronger than typical 1–2 A clamps and validated for >100 V/ns transients in CoolGaN applications.
Can 1EDN7116GXTMA1 be used in low-side-only configurations?
Yes - it operates reliably as a low-side driver with full TDI functionality. The differential input rejects ground bounce during fast GaN switching, and the active Miller clamp remains effective. No configuration change is needed; simply tie BST to VDD and omit bootstrap components.
What is the purpose of the CF+ and CF− pins?
CF+ and CF− connect an external flying capacitor to implement the adjustable negative charge pump. This generates the VOFF rail (–2 V to –5 V) used by OUT_SNK during turn-off. The VOFF_ADJ pin sets the target voltage via a resistor to VSS, enabling optimization for specific GaN gate threshold and layout parasitics.
1EDN7116GXTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EiceDRIVER™
- Package/Case:
- 10-VFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- High-Side or Low-Side
- Channel Type:
- Independent
- Number of Drivers:
- 1
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 4.2V ~ 11V
- Logic Voltage - VIL, VIH:
- -
- Current - Peak Output (Source, Sink):
- 2A, 2A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- 3ns, 3ns
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VSON-10-4
1EDN7116GXTMA1 FAQ
1.How can I place an order for 1EDN7116GXTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for 1EDN7116GXTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 1EDN7116GXTMA1 reliable?
The price and inventory of 1EDN7116GXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 1EDN7116GXTMA1 is usually 5 days.
3.What payment methods are accepted for 1EDN7116GXTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 1EDN7116GXTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 1EDN7116GXTMA1?
1EDN7116GXTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 1EDN7116GXTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 1EDN7116GXTMA1?
For technical support, including 1EDN7116GXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 1EDN7116GXTMA1 requirements.
6.How does Aetrix verify that 1EDN7116GXTMA1 is sourced from the original manufacturer or authorized distributors?
All 1EDN7116GXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 1EDN7116GXTMA1 meets industry standards.
7.What is the process for return or replacement of 1EDN7116GXTMA1?
All 1EDN7116GXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with 1EDN7116GXTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 1EDN7116GXTMA1 part is unused and in its original packaging.
Return procedure for 1EDN7116GXTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
1EDN7116GXTMA1 Tags

-
ZXGD3009E6TA
Diodes Incorporated

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1EDN7512BXTSA1
Infineon Technologies
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UCC27517DBVR
Texas Instruments

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MCP1416T-E/OT
Microchip Technology

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MCP1402T-E/OT
Microchip Technology

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MCP1415T-E/OT
Microchip Technology

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MCP1401T-E/OT
Microchip Technology

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IX4428NTR
Littelfuse Inc.

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IRS2005STRPBF
Infineon Technologies

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IRS2008STRPBF
Infineon Technologies

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IX4310TTR
Littelfuse Inc.

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2EDN7524RXTMA1
Infineon Technologies
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