Infineon Technologies 2EDF7275KXUMA2

Overview

2EDF7275KXUMA2 from Infineon Technologies is a dual-channel functional-isolated MOSFET gate driver IC in LGA-13 (5 mm × 5 mm) package, delivering 4 A source / 8 A sink peak output current per channel, 37 ns typical propagation delay with ±3 ns channel-to-channel mismatch, and CMTI >150 V/ns. It drives CoolMOS™ and OptiMOS™ power switches in half-bridge topologies for industrial SMPS and UPS systems.

For engineers reviewing the 2EDF7275KXUMA2 datasheet, 2EDF7275KXUMA2 pinout, 2EDF7275KXUMA2 application, or 2EDF7275KXUMA2 equivalent, key selection criteria include functional isolation rating (1.5 kVDC), output-side UVLO threshold (4 V), dual independent channel timing accuracy, and compatibility with bootstrapped high-side supply configurations in fast-switching power converters.

Technical Context

This IC implements coreless transformer (CT) isolation between input and output sides, enabling galvanic separation without optocoupler latency or aging. Its two fully independent channels support asymmetric drive configurations-e.g., high-side bootstrapped and low-side grounded-without shared reference constraints.

The device integrates input-side SLDO (3.3 V regulator), programmable disable control, and robust noise filtering (18 ns input pulse rejection). Output-side supplies (VDDA/VDDB) are externally sourced, supporting 4.5–20 V operation with 4 V UVLO threshold and safety self-lockdown on input-side undervoltage.

Key Specifications

Pinout & Package

2EDF7275KXUMA2 uses the PG-TFLGA-13-4 package: 5 mm × 5 mm body, 13-terminal land-grid array with 0.5 mm pitch, exposed thermal pad (connected to GNDA), and no leads - optimized for automated assembly and thermal performance in high-density power boards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel functional-isolated gate driver applications.

Compared with 2EDF7275FXUMA2, the 2EDF7275KXUMA2 offers superior thermal performance and smaller footprint; versus UCC5390SCDR, it delivers tighter timing control and higher noise immunity critical for high-efficiency, high-reliability industrial converters.

Availability

2EDF7275KXUMA2 is available at Aetrix Electronics and suitable for industrial SMPS, UPS systems, and synchronous rectification applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for 2EDF7275KXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon carbide and gallium nitride power devices.

The EiceDRIVER™ 2EDi family targets high-efficiency, high-reliability power conversion systems - specifically engineered to replace optocouplers and discrete isolation solutions in fast-switching MOSFET and SiC/GaN gate drive applications.

FAQ

What is the maximum recommended switching frequency for 2EDF7275KXUMA2?

The device supports up to 10 MHz PWM switching frequency, verified under load with 4 A/8 A output drive and 37 ns propagation delay. This rating assumes proper PCB layout (short gate traces, local decoupling), thermal management (≤150°C junction), and matched gate resistors (Rg1/Rg2) to maintain timing symmetry.

Can 2EDF7275KXUMA2 drive SiC MOSFETs directly?

Yes - its 4 A/8 A peak output current and 5 A reverse current capability support direct drive of low-to-medium Qg SiC MOSFETs (e.g., IMW120R045M1H, Qg ≈ 35 nC). For high-Qg devices (>60 nC), external gate buffers are recommended to maintain <50 ns rise/fall times and avoid excessive power loss in the driver itself.

Does 2EDF7275KXUMA2 require external isolation for input-side logic signals?

No - the IC integrates coreless transformer isolation between input (INA/INB/DISABLE/VDDI/GNDI) and output (OUTA/OUTB/VDDA/VDDB/GNDA/GNDB) domains. Controller-side logic signals connect directly to INA/INB; no optocouplers, capacitors, or transformers are needed for basic isolation compliance.

How is the thermal pad on the LGA-13 package connected?

The exposed thermal pad (pin 0) is internally connected to GNDA and must be soldered to a dedicated copper pour tied to GNDA on the PCB. A minimum 4×4 mm thermal pad with ≥4 thermal vias (0.3 mm diameter, spaced ≤1 mm apart) is required to achieve RthJA ≤ 42 K/W and sustain full 8 A sink current at +105°C ambient.