Infineon Technologies 2EDL8023GXUMA1

Overview

2EDL8023GXUMA1 from Infineon is a junction-isolated dual-channel gate driver IC for high-side/low-side MOSFET control in synchronous buck, half-bridge, and isolated DC-DC converters. It delivers 3 A source / 5 A sink on high side and 3 A source / 6 A sink on low side, features integrated 120 V bootstrap diode, supports up to 1 MHz switching, and operates from 8–17 V supply voltage.

For engineers reviewing the 2EDL8023GXUMA1 datasheet, 2EDL8023GXUMA1 pinout, 2EDL8023GXUMA1 application, or 2EDL8023GXUMA1 equivalent, key selection criteria include independent TTL-compatible HI/LI inputs with –10 V to 20 V tolerance, <6 ns propagation delay matching, UVLO thresholds (VDD: 7.0 V typ., VHB: 5.75 V typ.), and VDSON-8 package thermal performance for industrial power stages.

Technical Context

This driver implements level-shifted high-side operation via an on-chip 120 V bootstrap diode and external capacitor, eliminating need for external high-voltage level-shifting circuitry. Its independently controlled HI/LI inputs accept TTL logic regardless of VDD level and include built-in hysteresis for noise immunity.

The device integrates synchronous UVLO for both VDD and VHB rails, with 0.5 V hysteresis on VDD and 0.25 V on VHB, plus 5 µs delay and PWM synchronization to prevent HO activation during marginal boot voltage conditions. Output impedances are ultra-low: 0.5 Ω (HS pull-down) and 0.35 Ω (LS pull-down), minimizing dv/dt-induced false turn-on.

Key Specifications

Pinout & Package

2EDL8023GXUMA1 is housed in a lead-free, RoHS-compliant PG-VDSON-8-4 package (4 mm × 4 mm, 0.85 mm height), featuring an exposed thermal pad for enhanced power dissipation in continuous industrial operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side/low-side gate driver applications.

Compared with IRS2007PBF and UCC27211DR, 2EDL8023GXUMA1 offers superior integration (120 V diode), tighter delay matching (<6 ns), and broader input voltage tolerance (–10 V to +20 V), making it optimal for high-density, high-reliability telecom and industrial DC-DC modules.

Availability

2EDL8023GXUMA1 is available at Aetrix Electronics and suitable for telecom DC-DC converters, isolated bus converters, and synchronous rectification circuits requiring stable component supply, long-term industrial lifecycle support, and consistent parametric performance across temperature and voltage ranges.

Supply support for 2EDL8023GXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in high-voltage gate drivers and silicon carbide solutions.

2EDL8x2x belongs to Infineon's EiceDRIVER™ family, engineered specifically for high-efficiency, high-frequency switching power supplies in telecom, datacom, and industrial SMPS where integration, robustness, and precision timing are critical.

FAQ

What is the maximum recommended switching frequency for 2EDL8023GXUMA1?

The device supports operation up to 1 MHz, as confirmed by Infineon's characterization under recommended conditions. This limit accounts for propagation delay matching (<6 ns), output drive strength, and internal UVLO synchronization timing. At frequencies above 800 kHz, careful attention to PCB layout, gate resistor selection, and bootstrap capacitor sizing is required to maintain reliable high-side operation.

Does 2EDL8023GXUMA1 require an external bootstrap diode?

No. The part integrates a 120 V rated bootstrap diode within the die, eliminating the need for an external component. This reduces bill-of-materials count, saves PCB area, and improves reliability by removing reverse recovery variability associated with discrete diodes in high-dV/dt half-bridge nodes.

Can HI and LI inputs be driven from different ground domains?

No - HI and LI share the same VSS reference. While each input tolerates –10 V to +20 V relative to VSS, they are not isolated from one another. For differential or isolated control, use the 2EDL812x variant (e.g., 2EDL8123GXUMA1), which provides true differential inputs with inherent shoot-through protection and ±8 V common-mode rejection.

What thermal considerations apply to the VDSON-8 package?

The PG-VDSON-8-4 package uses an exposed thermal pad soldered to a dedicated copper pour on the PCB. To achieve the rated 1.5 W power dissipation at 100°C ambient, a minimum 100 mm² 2-oz copper area with ≥4 thermal vias (0.3 mm diameter) to inner ground planes is required. Junction-to-board thermal resistance is 25°C/W under these conditions.