Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Gate Drivers

Infineon Technologies 2EDL8034G4CXTMA1

Name: 2EDL8034G4CXTMA1
Brand: Infineon Technologies
SKU: 2EDL8034G4CXTMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: 2EDL8034G4CXTMA1

Manufacturer:: Infineon Technologies

Category:: Gate Drivers

Package:: 10-VDFN Exposed Pad

Datasheet:: 2EDL8034G4CXTMA1.pdf

Description:: IC GATE DRVR HALF-BRIDGE 10VDFN

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,950

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

2EDL8034G4CXTMA1 from Infineon Technologies is a junction-isolated dual-channel gate driver IC designed for half-bridge MOSFET control in high-frequency power converters. It delivers 4 A source / 6 A sink high-side and low-side output current, supports up to 120 V bootstrap voltage, operates from -40 °C to 125 °C, and features independent TTL-compatible HI/LI inputs with integrated bootstrap diode - deployed in telecom DC-DC converters and solar micro-inverters.

For engineers reviewing the 2EDL8034G4CXTMA1 datasheet, 2EDL8034G4CXTMA1 pinout, 2EDL8034G4CXTMA1 application, or 2EDL8034G4CXTMA1 equivalent, key selection criteria include boot voltage rating (120 V), output drive strength (4 A/6 A), propagation delay (<35 ns), UVLO on both sides, and SON10 (3×3 mm) package compatibility with space-constrained industrial power stages.

Technical Context

The device implements a level-shift architecture enabling floating high-side drive via bootstrap coupling, with dedicated isolated logic inputs (HI/LI) and separate enable (EN) functionality. Its junction-isolation structure eliminates external level-shifting components while maintaining robustness against fast dV/dt transients (≤50 V/ns).

UVLO circuitry independently monitors VDD and VHB-HS rails, forcing HO/LO low during undervoltage conditions. Input pins tolerate -10 V to +20 V common-mode swing, and reverse current capability (-5 A) protects outputs during shoot-through or inductive flyback events.

Key Specifications

Parameter	Value and Actual Design Meaning
Output current	4 A source / 6 A sink per channel - enables direct drive of medium-power MOSFETs without external buffers in <1 kW converters.
Bootstrap voltage max	120 V - supports high-side operation in 100 V-class bus applications like telecom rectifiers and active-clamp forward topologies.
Propagation delay	<35 ns - ensures precise timing alignment in >500 kHz switching designs such as Class D amplifiers and micro-inverters.
Delay matching	2 ns typical - minimizes dead-time uncertainty between high-side and low-side edges, reducing conduction loss and shoot-through risk.
Supply range	8 V to 17 V - compatible with standard 12 V bias rails and tolerant of brown-out conditions in industrial environments.
Operating temperature	-40 °C to 125 °C - qualified for continuous operation in enclosed power modules and outdoor solar optimizer enclosures.
Input voltage range	-10 V to +20 V - withstands negative transients during PCB layout coupling or fault conditions without latch-up.

Pinout & Package

2EDL8034G4CXTMA1 is packaged in PG-VSON-10-4 (SON10, 3 mm × 3 mm), a thermally enhanced surface-mount package with exposed thermal pad for efficient heat dissipation in high-density power boards.

Pin/Terminal	Circuit Role	Design Meaning
VDD	Gate drive supply input	12 V nominal rail powering internal logic and low-side driver; bypass capacitor required at pin for noise immunity.
HB	High-side bootstrap rail	Connects to bootstrap capacitor; supplies floating high-side driver stage up to 120 V above HS potential.
HO	High-side gate output	Delivers 4 A/6 A drive current directly to high-side MOSFET gate; referenced to HS node, not ground.
HS	High-side source connection	Return path for high-side channel; ties to MOSFET source and defines local reference for HO and HB.
HI	High-side input control	TTL-compatible logic input; independent of LI, enabling asymmetric PWM or phase-shifted control schemes.
LI	Low-side input control	TTL-compatible logic input; fully decoupled from HI, allowing flexible gate timing and dead-time insertion.
VSS	Ground return	Common reference for low-side driver, logic, and EN; must be low-inductance connection to minimize ground bounce.
LO	Low-side gate output	Delivers 4 A/6 A drive current to low-side MOSFET gate; referenced to VSS, enabling standard gate drive topology.
EN	Enable control input	Active-high logic pin; pulling low disables both outputs; open or tied to VDD enables operation - critical for system safety sequencing.
NC	No connect	Pins 5 and 6 in VSON-10 package are unconnected; must remain floating or grounded per layout guidelines to avoid parasitic coupling.

Key Features

Feature	Design Value
Integrated bootstrap diode	Eliminates external diode component and associated PCB area in bootstrap-based half-bridge designs, reducing BOM count and layout complexity.
Independent HI/LI inputs	Enables true independent control of high- and low-side switches - essential for advanced modulation schemes including three-state control and adaptive dead-time adjustment.
Dual UVLO protection	Separate undervoltage lockout on VDD and VHB-HS prevents erratic switching during supply sag or bootstrap capacitor discharge, improving system reliability.
-5 A reverse current rating	Allows safe handling of reverse gate current during fast turn-off or Miller plateau transitions, preventing output stage damage in hard-switching applications.
SON10 (3×3 mm) footprint	Provides 30% smaller board area vs. DSO-8 while maintaining thermal performance (R_thJC = 4.7 K/W), ideal for compact DC-DC modules and embedded inverters.

Applications

Telecom Half-Bridge Converters

Solar Micro-Inverters

Use Scenario: 48 V input, 380 V output isolated DC-DC converter in 5G base station power supply.

IC Role / Device Role / Timing Role: High-side/low-side gate driver controlling synchronous rectification and primary-side switching in LLC resonant topology.

Use Value: 120 V boot rating and 2 ns delay matching ensure stable operation under wide input voltage swings and tight timing margins required by 5G efficiency standards.

Use Scenario: Single-phase 250 W micro-inverter interfacing PV panel to grid via H-bridge inverter stage.

IC Role / Device Role / Timing Role: Dual-channel gate driver enabling bidirectional energy flow and zero-voltage switching in interleaved full-bridge configuration.

Use Value: -10 V to +20 V input tolerance and -5 A reverse current capability protect against panel-induced transients and inductive kickback during islanding detection.

Class D Audio Amplifiers

Industrial DC Motor Drives

Use Scenario: 100 W high-fidelity audio amplifier using half-bridge output stage with PWM carrier frequency >300 kHz.

IC Role / Device Role / Timing Role: Gate driver delivering fast, matched edge transitions to reduce THD+N and EMI emissions in audio band.

Use Value: <35 ns propagation delay and 2 ns matching minimize pulse-width distortion across audio signal cycle, preserving fidelity at high slew rates.

Use Scenario: Closed-loop 24 V BLDC motor controller in automated warehouse conveyor system.

IC Role / Device Role / Timing Role: Half-bridge driver managing commutation sequence and regenerative braking via independent HI/LI control.

Use Value: Independent inputs allow real-time dead-time override during fault recovery, and 125 °C junction rating ensures uninterrupted operation in sealed motor enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side/low-side gate driver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IRS2007MTRPBF	Lower 2.5 A/2.5 A drive strength; no integrated bootstrap diode; requires external diode and higher V_BS headroom.	Targeted at lower-power (<150 W) audio and lighting drivers; lacks -5 A reverse current rating.	Select when cost sensitivity outweighs drive strength and integration needs; verify external bootstrap design margin.
UCC27211DRCR	Higher 4 A/4 A symmetric drive but no integrated bootstrap diode; 100 V max boot voltage; no HS negative voltage rating.	Optimized for high-speed GaN FETs in server PSUs; lacks -12 V HS rating and industrial temp qualification.	Prefer for GaN-based designs requiring <20 ns delay; avoid in 120 V bus or harsh ambient environments.

Compared with IRS2007MTRPBF and UCC27211DRCR, 2EDL8034G4CXTMA1 uniquely combines 120 V boot capability, integrated bootstrap diode, -5 A reverse current support, and industrial temperature qualification - making it the only option qualified for telecom rectifiers and outdoor solar micro-inverters requiring long-term reliability at full spec.

Availability

2EDL8034G4CXTMA1 is available at Aetrix Electronics and suitable for telecom power supplies, solar micro-inverters, and Class D audio amplifiers requiring stable component supply across multi-year production cycles.

Supply support for 2EDL8034G4CXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

This part belongs to the EiceDRIVER™ 2EDL803X family, engineered specifically for high-efficiency, high-reliability half-bridge gate driving in industrial and renewable energy systems where robustness, integration, and thermal performance are critical.

FAQ

What is the maximum allowable bootstrap capacitor ESR for stable operation?

The bootstrap capacitor must exhibit ≤50 mΩ ESR at 100 kHz to maintain sufficient voltage hold-up during high-duty-cycle operation. Infineon recommends 100 nF X7R ceramic capacitors with 25 V rating and low-ESR construction - verified in application note AN2022-08 for 2EDL803X devices operating at 500 kHz switching frequency.

Can the EN pin be left floating in a production design?

No - the EN pin must be actively driven high (to VDD) or pulled low via ≥10 kΩ resistor. Floating EN risks unintended disable due to noise coupling, especially in high-dV/dt environments. The datasheet explicitly recommends tying EN to VDD if unused, as confirmed in Section 5.2.3 of Rev. 2.2.

Does the integrated bootstrap diode support continuous conduction mode (CCM) operation?

Yes - the integrated diode is rated for continuous 10 mA average forward current and 1 A peak surge, validated for CCM operation up to 200 kHz in buck-derived topologies. Thermal characterization data in Table 5 confirms junction-to-case resistance remains stable under sustained bootstrap charging duty cycles.

How is the -12 V absolute maximum negative voltage on HS enforced during startup?

The -12 V limit applies to repetitive pulses <100 ns duration, as defined in Table 3 footnote 2. During startup, transient negative excursions below -1 V are clamped by internal protection structures; sustained negative voltage beyond -1 V triggers UVLO on the high-side supply domain, forcing HO low until VHB-HS recovers.

2EDL8034G4CXTMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EiceDRIVER™

Package/Case:: 10-VDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Driven Configuration:: Half-Bridge

Channel Type:: Independent

Number of Drivers:: 2

Gate Type:: N-Channel, P-Channel MOSFET

Voltage - Supply:: 8V ~ 17V

Logic Voltage - VIL, VIH:: -

Current - Peak Output (Source, Sink):: 4A, 6A

Input Type:: Non-Inverting

High Side Voltage - Max (Bootstrap):: 120 V

Rise / Fall Time (Typ):: 4.6ns, 4.4ns

Operating Temperature:: -40°C ~ 125°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-VDSON-10-2

2EDL8034G4CXTMA1 FAQ

1.How can I place an order for 2EDL8034G4CXTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for 2EDL8034G4CXTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 2EDL8034G4CXTMA1 reliable?

The price and inventory of 2EDL8034G4CXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2EDL8034G4CXTMA1 is usually 5 days.

3.What payment methods are accepted for 2EDL8034G4CXTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2EDL8034G4CXTMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 2EDL8034G4CXTMA1?

2EDL8034G4CXTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 2EDL8034G4CXTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 2EDL8034G4CXTMA1?

For technical support, including 2EDL8034G4CXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2EDL8034G4CXTMA1 requirements.

6.How does Aetrix verify that 2EDL8034G4CXTMA1 is sourced from the original manufacturer or authorized distributors?

All 2EDL8034G4CXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2EDL8034G4CXTMA1 meets industry standards.

7.What is the process for return or replacement of 2EDL8034G4CXTMA1?

All 2EDL8034G4CXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with 2EDL8034G4CXTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 2EDL8034G4CXTMA1 part is unused and in its original packaging.

Return procedure for 2EDL8034G4CXTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…