Infineon Technologies 2EDL8123G3CXTMA1
- Part No.:
- 2EDL8123G3CXTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Gate Drivers
- Package:
- 10-VFDFN Exposed Pad
- Datasheet:
-
2EDL8123G3CXTMA1.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 10VFDFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,324
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Product details
Overview
2EDL8123G3CXTMA1 from Infineon Technologies is a junction-isolated dual-channel gate driver IC for high-side/low-side MOSFET control in synchronous buck, half-bridge, and isolated DC-DC converters. It features differential input with inherent shoot-through protection, 3 A source / 5 A sink (HS) and 3 A source / 6 A sink (LS) drive capability, 120 V on-chip bootstrap diode, and <6 ns propagation delay matching. Used in telecom bus converters and Class-D audio amplifiers.
For engineers reviewing the 2EDL8123G3CXTMA1 datasheet, 2EDL8123G3CXTMA1 pinout, 2EDL8123G3CXTMA1 application, or 2EDL8123G3CXTMA1 equivalent, key selection criteria include differential input robustness against ground bounce (–8 V to +15 V common-mode), UVLO thresholds (VDD: 7.0 V typ., VHB: 5.75 V typ.), and VSON-10 package thermal performance for high-frequency (≤1 MHz) switching.
Technical Context
The 2EDL8123G3CXTMA1 implements a level-shift architecture using an integrated 120 V bootstrap diode and external capacitor to bias the high-side driver. Its differential input stage enforces complementary output behavior via truth-table logic (LI/HI = H/L → LO=H, HO=L), eliminating concurrent conduction.
UVLO is implemented synchronously for both VDD and VHB rails, with 0.5 V hysteresis on VDD and 0.25 V on VHB; a 5 µs delay and PWM synchronization ensure HO only propagates when HI is low at UVLO release - preventing marginal gate drive during startup transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Drive Strength | 3 A source / 5 A sink (HS); 3 A source / 6 A sink (LS) - enables fast Miller plateau crossing for 600 V+ MOSFETs at ≤1 MHz. |
| Propagation Delay Matching | <6 ns max - ensures volt-second balance across transformer windings and prevents core saturation in isolated topologies. |
| Input Common-Mode Range | –8 V to +15 V - tolerates ground bounce in high-dI/dt SMPS layouts without false triggering. |
| VDD Operating Range | 8 V to 17 V - supports wide-input industrial DC supplies while maintaining stable gate drive voltage. |
| VHB UVLO Threshold | 5.75 V (rising), 5.5 V (falling) - protects high-side FET from partial turn-on during bootstrap capacitor discharge. |
| Bootstrap Diode Rating | 120 V - eliminates need for external high-voltage bootstrap diode in 100 V-class half-bridge designs. |
| Package Thermal Resistance | RθJA = 45 °C/W (VSON-10) - enables 2.5 W continuous power dissipation at TA = 85 °C without forced airflow. |
Pinout & Package
2EDL8123G3CXTMA1 is housed in a RoHS-compliant PG-VSON-10-4 package (3 mm × 3 mm, 0.4 mm pitch), featuring an exposed thermal pad for enhanced heat dissipation and optimized high-frequency layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Low-side supply rail | Primary 8–17 V gate drive supply; powers internal LDO, logic, and low-side driver. |
| HB | High-side bootstrap rail | Connects to external bootstrap capacitor; referenced to HS node for floating high-side bias. |
| HO | High-side gate output | Drives gate of high-side N-channel MOSFET; rated for 3 A source / 5 A sink. |
| HS | High-side source connection | Switching node return; must be routed with minimal inductance to reduce dv/dt-induced shoot-through risk. |
| HI | Differential high-side input | One leg of true differential pair; requires matched trace length with LI for noise rejection. |
| LI | Differential low-side input | Second leg of differential pair; logic state relative to HI determines output state per truth table. |
| VSS | Ground reference | Internal connection to exposed thermal pad; serves as return for all low-side current paths. |
| LO | Low-side gate output | Drives gate of low-side N-channel MOSFET; rated for 3 A source / 6 A sink. |
| N/C | No connect | Pins 2 and 6 are unconnected die pads - must remain floating per Infineon layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Differential input with shoot-through prevention | Enforces mutually exclusive HO/LO states via hardware logic - eliminates need for external dead-time control circuitry. |
| Integrated 120 V bootstrap diode | Reduces BOM count and PCB area vs. discrete diode solutions; rated for ≥100 kcycles at 1 A peak reverse recovery. |
| Synchronous dual-rail UVLO | VDD and VHB UVLO release synchronized with PWM edge - prevents HO activation during bootstrap recharge phase. |
| Ultra-low output impedance | 0.5 Ω (HS pull-down), 0.35 Ω (LS pull-down) - suppresses dv/dt-induced re-turn-on during hard-switching transitions. |
| Robust input voltage tolerance | Withstands –10 V to +20 V on HI/LI pins - enables direct interface with analog controllers, FPGA I/O, and isolated gate drivers. |
Applications
| Telecom Isolated Bus Converter | Synchronous Rectification in LLC Resonant Converter |
|---|---|
Use Scenario: 48 V input to 12 V/50 A isolated DC-DC module in 5G base station power shelf. IC Role / Device Role / Timing Role: Dual-channel gate driver controlling high-side and low-side GaN FETs in active-clamp forward topology with 300 kHz switching. Use Value: Differential inputs reject ground bounce from paralleled output rectifiers; <6 ns delay matching maintains transformer flux balance across load steps. | Use Scenario: Secondary-side synchronous rectification in 1 kW server PSU using LLC resonant converter with SiC MOSFETs. IC Role / Device Role / Timing Role: High-side/low-side driver for two parallel 100 V SiC FETs per channel, operating at 500 kHz with ZVS. Use Value: 120 V integrated bootstrap diode withstands reflected transient spikes during light-load ZVS transitions; 3 A drive sustains fast turn-on under high capacitive gate charge. |
| Class-D Audio Amplifier Half-Bridge | Industrial Motor Control Inverter Stage |
Use Scenario: 200 W digital audio amplifier with 1 MHz PWM carrier and 20 kHz audio bandwidth. IC Role / Device Role / Timing Role: Gate driver for half-bridge output stage driving 100 V lateral DMOS devices. Use Value: –10 V to +20 V input tolerance accommodates PWM controller offset drift; 5 A HS sink current ensures clean turn-off during high-current clipping events. | Use Scenario: 3-phase inverter for 750 W servo drive with field-oriented control and 20 kHz PWM. IC Role / Device Role / Timing Role: One 2EDL8123G3CXTMA1 per phase driving 120 V trench MOSFETs in 6-pack configuration. Use Value: VSON-10 package enables compact gate driver layout adjacent to power stage; exposed pad reduces junction-to-ambient thermal resistance by 35% vs. SOIC-8 alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side/low-side gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRS2007MTRPBF | Dual independent TTL inputs; no differential logic or inherent shoot-through protection; 600 V bootstrap rating. | Requires external dead-time generation; suited for cost-sensitive non-critical SMPS where ground bounce is minimal. | Select when system-level timing control is already implemented and bootstrap voltage exceeds 100 V. |
| UCC27211D | Single-ended inputs; 4 A/4 A drive; no integrated bootstrap diode; 125 V max VBS. | Needs external 120 V bootstrap diode; higher board area and BOM cost but offers adjustable dead time via external RC. | Choose when design requires programmable dead time or operates above 1 MHz with ultra-low propagation delay variation. |
Compared with IRS2007MTRPBF and UCC27211D, 2EDL8123G3CXTMA1 delivers superior noise immunity via differential inputs and eliminates one BOM item with its 120 V integrated bootstrap diode - reducing layout sensitivity and improving reliability in high-dI/dt telecom and audio applications.
Availability
2EDL8123G3CXTMA1 is available at Aetrix Electronics and suitable for telecom power supplies, Class-D audio amplifiers, and industrial motor drives requiring stable component supply, JEDEC-qualified industrial temperature operation (–40 °C to +125 °C), and long-term production continuity.
Supply support for 2EDL8123G3CXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and industrial gate drivers, with global manufacturing and qualification to AEC-Q100 and JEDEC standards.
The EiceDRIVER™ 2EDL8x2x product line targets high-efficiency, high-frequency switching topologies in datacom, telecom, and audio applications - emphasizing integration (e.g., 120 V bootstrap diode), noise immunity (differential inputs), and precise timing (sub-6 ns delay matching).
FAQ
What is the maximum recommended switching frequency for 2EDL8123G3CXTMA1?
The device supports operation up to 1 MHz, as confirmed by Infineon's dynamic characterization (Section 4.5, Datasheet Rev. 2.9). At 1 MHz, propagation delay matching remains <6 ns, and thermal performance stays within limits when mounted on a 2-layer PCB with 1-in² copper pour under the exposed pad.
Can 2EDL8123G3CXTMA1 drive SiC or GaN FETs?
Yes - its 3 A source / 5–6 A sink capability, <6 ns delay matching, and 120 V bootstrap diode rating make it suitable for driving 100 V-class SiC and GaN FETs in hard-switched and resonant topologies, provided gate resistors are selected to limit dV/dt per FET datasheet requirements.
Is an external bootstrap diode required with this part?
No - the 2EDL8123G3CXTMA1 integrates a 120 V rated bootstrap diode, eliminating the need for an external diode in most 100 V-class half-bridge applications. External diodes are only recommended if reverse recovery stress exceeds 1 A peak or if >120 V bootstrap voltage is needed.
How does the differential input prevent shoot-through in practice?
The HI/LI differential pair implements hardware-enforced logic: only HI=H/LI=L yields HO=H/LO=L, and HI=L/LI=H yields HO=L/LO=H. Concurrent HI/LI high or low forces both outputs low - physically preventing simultaneous conduction regardless of controller timing errors or noise glitches.
2EDL8123G3CXTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 10-VFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- High-Side and Low-Side
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 8V ~ 17V
- Logic Voltage - VIL, VIH:
- -
- Current - Peak Output (Source, Sink):
- 3A, 5A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- 120 V
- Rise / Fall Time (Typ):
- 45ns, 45ns
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VSON-10-4
2EDL8123G3CXTMA1 FAQ
1.How can I place an order for 2EDL8123G3CXTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for 2EDL8123G3CXTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 2EDL8123G3CXTMA1 reliable?
The price and inventory of 2EDL8123G3CXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2EDL8123G3CXTMA1 is usually 5 days.
3.What payment methods are accepted for 2EDL8123G3CXTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2EDL8123G3CXTMA1 transactions.
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2EDL8123G3CXTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 2EDL8123G3CXTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 2EDL8123G3CXTMA1?
For technical support, including 2EDL8123G3CXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2EDL8123G3CXTMA1 requirements.
6.How does Aetrix verify that 2EDL8123G3CXTMA1 is sourced from the original manufacturer or authorized distributors?
All 2EDL8123G3CXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2EDL8123G3CXTMA1 meets industry standards.
7.What is the process for return or replacement of 2EDL8123G3CXTMA1?
All 2EDL8123G3CXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with 2EDL8123G3CXTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 2EDL8123G3CXTMA1 part is unused and in its original packaging.
Return procedure for 2EDL8123G3CXTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
2EDL8123G3CXTMA1 Tags

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ZXGD3009E6TA
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1EDN7512BXTSA1
Infineon Technologies
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UCC27517DBVR
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MCP1416T-E/OT
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MCP1402T-E/OT
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MCP1401T-E/OT
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IX4428NTR
Littelfuse Inc.

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IRS2005STRPBF
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IRS2008STRPBF
Infineon Technologies

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IX4310TTR
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