Infineon Technologies 2EDN8524RXUMA1

Overview

2EDN8524RXUMA1 from Infineon Technologies is a dual-channel, non-inverting, 8 V UVLO gate driver IC for high-speed MOSFET and GaN power devices, featuring 5 A peak source/sink current per channel, 17 ns propagation delay, 1 ns channel-to-channel matching, and rail-to-rail output stage with 0.7 Ω high-side and 0.55 Ω low-side on-resistance - deployed in server SMPS and LLC resonant converters.

For engineers reviewing the 2EDN8524RXUMA1 datasheet, 2EDN8524RXUMA1 pinout, 2EDN8524RXUMA1 application, or 2EDN8524RXUMA1 equivalent, key selection criteria include UVLO threshold (8 V), input logic type (direct/non-inverting), package (PG-TSSOP-8), thermal robustness (-10 V input tolerance), and parallel-channel timing accuracy (1 ns skew).

Technical Context

This driver implements two independent, LV-TTL/CMOS-compatible (3.3 V) control channels with separate enable inputs (ENA/ENB), supporting both synchronous rectification and interleaved PFC topologies. Each channel delivers true rail-to-rail drive with matched 17 ns propagation delay and sub-nanosecond inter-channel skew.

The architecture integrates dual UVLO stages (8 V threshold), -10 V tolerant control pins to suppress latch-up from ground bounce, and 5 A reverse current capability eliminating external Schottky protection diodes - enabling direct connection to high-dV/dt power switches in ZVS and pulse-transformer-driven circuits.

Key Specifications

Pinout & Package

2EDN8524RXUMA1 uses the PG-TSSOP-8 package (8-pin, 3 × 3 mm, 0.65 mm pitch, exposed thermal pad). The exposed pad must be soldered to GND for thermal and electrical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel gate driver applications.

Compared with UCC27524ADR and ADP3418ARZ, 2EDN8524RXUMA1 delivers higher drive strength, tighter timing control, and enhanced system-level robustness - making it uniquely suited for high-frequency, high-reliability GaN and CoolMOS™ applications where timing accuracy and fault resilience are design-critical.

Availability

2EDN8524RXUMA1 is available at Aetrix Electronics and suitable for server SMPS, telecom DC-DC converters, and solar auxiliary supplies requiring stable component supply, long-term lifecycle support, and automotive-grade traceability.

Supply support for 2EDN8524RXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-performance analog ICs, with over 30 years of power device innovation.

The EiceDRIVER™ 2EDN family targets high-efficiency, high-reliability power conversion systems - designed specifically for fast-switching GaN, SiC, and advanced silicon MOSFETs in datacenter, telecom, and industrial SMPS.

FAQ

What is the UVLO threshold for 2EDN8524RXUMA1, and how does it behave during startup?

The 2EDN8524RXUMA1 features an 8 V undervoltage lockout (UVLO) with hysteresis. When VDD rises above 8 V, the driver enables after a brief internal release delay (~100 ns); if VDD drops below ~7.4 V, outputs are immediately forced low. This ensures MOSFETs or GaN devices remain fully off during brown-out conditions, preventing partial turn-on and thermal runaway.

Can both output channels be used in parallel to drive a single high-capacitance device?

Yes - the 1 ns typical channel-to-channel propagation delay matching enables safe parallel operation of OUTA and OUTB. Combined, they deliver up to 10 A peak source/sink current, reducing gate resistance requirements and improving slew rate for devices with >20 nF total gate charge, such as 650 V GaN HEMTs in LLC converters.

Is the PG-TSSOP-8 package thermally adequate for continuous 5 A output operation?

Yes - the PG-TSSOP-8 package includes an exposed thermal pad that must be soldered to a minimum 100 mm² copper pour connected to GND. With proper PCB layout (2 oz Cu, 4 thermal vias), junction-to-ambient thermal resistance is ≤65 °C/W, allowing continuous 5 A operation at ambient ≤70 °C with <10 W total dissipation.

Does 2EDN8524RXUMA1 support inverting logic configuration?

No - the "4" in the part number denotes non-inverting (direct) logic. For inverting logic, Infineon offers the 2EDN8523RXUMA1 variant. Input behavior is fixed per part number; logic inversion cannot be configured via external components or pins on the 2EDN8524RXUMA1.