Infineon Technologies 2EDS7165HXUMA1
- Part No.:
- 2EDS7165HXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Gate Drivers
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
2EDS7165HXUMA1.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:574
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Product details
Overview
2EDS7165HXUMA1 from Infineon Technologies is a reinforced-isolated dual-channel MOSFET gate driver IC designed for high-reliability half-bridge and synchronous rectifier topologies in industrial SMPS, EV charging, and UPS systems. It delivers 1 A source / 2 A sink output current per channel, features 37 ns typical propagation delay with ±3 ns channel-to-channel mismatch, and supports output supply voltages from 4.5 V to 20 V with 4 V UVLO threshold.
For engineers reviewing the 2EDS7165HXUMA1 datasheet, 2EDS7165HXUMA1 pinout, 2EDS7165HXUMA1 application, or 2EDS7165HXUMA1 equivalent, key selection criteria include reinforced isolation certification (VDE 0884-10 VIOTM = 8 kVpk), CMTI >150 V/ns, dual independent channel timing accuracy, and compatibility with CoolMOS™/CoolSIC™ power switches in fast-switching (>10 MHz PWM) systems.
Technical Context
The 2EDS7165HXUMA1 implements coreless transformer (CT) technology for input-to-output reinforced isolation and separate galvanic isolation between channels. Its timing architecture ensures stable 37 ns propagation delay across –40°C to +150°C junction temperature, with <3 ns inter-channel skew critical for precise dead-time control in high-frequency LLC and phase-shifted full-bridge converters.
It integrates dual independent UVLO monitoring: input-side lockout below 3 V triggers safety self-lockdown of outputs, while output-side UVLO thresholds (4 V) protect against insufficient gate drive voltage. The device accepts CMOS/TTL inputs and supports bootstrapped high-side supply generation via external diode/capacitor networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Type | Reinforced isolation per DIN V VDE V 0884-10 (VIOTM = 8 kVpk, VIOSM = 6.25 kVpk tested at 10 kVpk) |
| Output Drive Strength | 1 A source / 2 A sink per channel - sufficient to rapidly charge/discharge gate capacitance of medium-Ron Si/SiC MOSFETs up to 100 nC Qg |
| Propagation Delay | Typ. 37 ns - enables sub-100 ns dead-time implementation without external timing compensation |
| CMTI | >150 V/ns - maintains signal integrity during fast dV/dt transients in 650 V–1200 V power stages |
| UVLO Threshold (Output) | 4 V - prevents partial turn-on of power devices under marginal VDDA/VDDB conditions, ensuring robust gate drive |
| Operating Temperature | –40°C to +150°C TJ - qualified for industrial and automotive-grade thermal environments without derating |
| PWM Frequency Support | Up to 10 MHz - compatible with GaN-based resonant topologies requiring ultra-fast switching control |
Pinout & Package
2EDS7165HXUMA1 is housed in a wide-body PG-DSO-16-30 package (10.3 mm × 10.3 mm, 1.27 mm pitch), optimized for creepage/clearance compliance in reinforced isolation applications. Thermal pad on underside enhances PCB heat dissipation.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | INA | CMOS/TTL input for channel A; internal pull-down ensures safe low state when unused |
| 2 | INB | CMOS/TTL input for channel B; independent logic control enables asymmetric PWM or enable/disable sequencing |
| 3 | VDDI | 3.3 V input-side supply; supports SLDO activation for higher VDDI if SLDON grounded |
| 4 | GNDI | Input-side reference ground - must be isolated from output-side grounds to maintain reinforcement barrier |
| 5 | DISABLE | Active-high global disable for both channels; overrides all inputs to force high-impedance output state |
| 6,7 | N.C. | No-connect pins - must remain floating per datasheet; no internal connection or function |
| 8 | SLDON | SLDO enable control: tied to GNDI activates internal regulator for VDDI >3.5 V operation |
| 9–12 | VDDA, OUTA, GNDA, VDDB | Channel A high-side supply, output, ground, and Channel B high-side supply - support independent bootstrap or auxiliary supply routing |
| 13–16 | OUTB, GNDB, N.C., N.C. | Channel B output and ground; two no-connect pins ensure isolation barrier integrity in WB-DSO layout |
Key Features
| Feature | Design Value |
|---|---|
| Reinforced Isolation Certification | VDE 0884-10 (VIOTM = 8 kVpk), UL 1577 (VISO = 5700 VRMS), EN IEC 62368-1 - meets safety requirements for mains-connected industrial equipment |
| Timing Accuracy Over Temperature | ±3 ns channel-to-channel mismatch maintained across –40°C to +150°C - eliminates need for external delay matching networks |
| Integrated Safety Lockdown | Input-side UVLO <3 V forces immediate output shutdown and latches until reset - prevents erratic switching during brown-out |
| Noise Immunity | 18 ns digital input filter + >150 V/ns CMTI - rejects EMI from adjacent power stages without external RC filtering |
| Flexible Power Architecture | Dual independent output supplies (VDDA/VDDB) allow asymmetric rail configurations (e.g., 12 V high-side, 5 V low-side) for optimal Rds(on) and switching loss trade-offs |
Applications
| Server & Telecom SMPS | Synchronous Rectification |
|---|---|
|
Use Scenario: 48 V–54 V input, 12 V/100 A output LLC resonant converter in AI server power supply. IC Role / Device Role / Timing Role: Dual-channel gate driver controlling high-side CoolGaN™ and low-side OptiMOS™ in half-bridge configuration with precise dead-time management. Use Value: 37 ns propagation delay and ±3 ns skew enable <100 ns dead-time, minimizing shoot-through losses while maintaining ZVS over full load range. |
Use Scenario: Secondary-side synchronous rectification in isolated DC–DC brick converters for data center PDUs. IC Role / Device Role / Timing Role: Reinforced-isolated driver enabling direct control of low-side MOSFETs referenced to floating secondary ground, eliminating optocoupler latency. Use Value: CMTI >150 V/ns prevents false triggering during rapid bus voltage transitions (dV/dt >100 V/ns), improving efficiency by >1.2% vs. opto-coupled solutions. |
| EV Onboard Charger (OBC) | Industrial UPS Inverter Stage |
|
Use Scenario: Bidirectional AC–DC/DC–AC stage in 11 kW OBC using SiC MOSFETs in totem-pole PFC and dual-active-bridge isolation. IC Role / Device Role / Timing Role: Gate driver for high-side SiC switches in totem-pole bridge, requiring reinforced isolation to meet IEC 62109 and UL 62368-1 system-level safety. Use Value: VIOTM = 8 kVpk and certified VDE/UL isolation eliminate need for external isolation barriers, reducing BOM count and PCB area by 22%. |
Use Scenario: Three-phase 400 V inverter stage in 10 kVA industrial UPS with active front-end and battery backup. IC Role / Device Role / Timing Role: Dual-channel driver for IGBTs in three-level NPC topology, where channel-to-channel isolation prevents cross-conduction during fault events. Use Value: Independent UVLO per output channel (4 V threshold) ensures reliable turn-off even during partial auxiliary supply failure, preventing destructive shoot-through. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel reinforced-isolated gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si827x (Silicon Labs) | Higher 4 A/4 A drive strength; 40 ns propagation delay; CMTI = 200 V/ns; SOIC-16 package | Better suited for high-current SiC modules requiring >3 A peak drive; lacks VDE 0884-10 certification (only UL1577) | Select when higher drive current and superior noise immunity are prioritized over regulatory certification for industrial mains-connected systems |
| ADuM4223 (Analog Devices) | 2 A/2 A drive; 55 ns propagation delay; CMTI = 150 V/ns; SOIC-16 with integrated Miller clamp | Includes active Miller clamp for improved short-circuit protection; lower timing precision limits use in >500 kHz resonant topologies | Prefer for motor drives requiring enhanced fault handling, but avoid in high-frequency LLC or GaN-based designs demanding <40 ns timing accuracy |
Compared with Si827x and ADuM4223, 2EDS7165HXUMA1 offers the only combination of VDE 0884-10 reinforced certification, 37 ns timing, and 1 A/2 A drive optimized for thermally constrained industrial SMPS - making it the sole choice where regulatory compliance and high-frequency precision are jointly required.
Availability
2EDS7165HXUMA1 is available at Aetrix Electronics and suitable for server power supplies, EV onboard chargers, and industrial UPS systems requiring stable component supply, long-term lifecycle assurance, and reinforced isolation compliance.
Supply support for 2EDS7165HXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with leadership in silicon carbide and gallium nitride technologies.
The EiceDRIVER™ 2EDi family targets high-efficiency, high-reliability power conversion systems - specifically engineered to replace optocouplers and pulse transformers in industrial, telecom, and EV infrastructure where reinforced isolation and nanosecond timing accuracy are mandatory.
FAQ
What is the maximum allowable dV/dt transient the 2EDS7165HXUMA1 can withstand without malfunction?
The device guarantees functional integrity under common-mode transients exceeding 150 V/ns, validated per VDE 0884-10 test methodology. This rating applies across its full operating temperature range and ensures reliable operation in 650 V–1200 V SiC/GaN half-bridge circuits where dV/dt peaks exceed 100 V/ns during switching transitions.
Can the 2EDS7165HXUMA1 drive both high-side and low-side switches in a single half-bridge without external level-shifting components?
Yes - its dual independent isolated channels provide fully separated output supplies (VDDA/VDDA and VDDB/GNDB), enabling direct connection to high-side and low-side MOSFET gates in standard half-bridge configurations. No external level shifters or bootstrap diodes are needed for the gate drive path itself, though bootstrap circuitry may still be used for high-side VDDA generation.
Does the 2EDS7165HXUMA1 support independent enable/disable control for each channel?
No - it provides only a single global DISABLE pin that simultaneously disables both output channels. Individual channel control is not supported; separate enable signals require external logic or a second driver IC. This design prioritizes safety-critical simultaneous shutdown over per-channel flexibility.
What is the purpose of the SLDON pin, and how does it affect VDDI operation?
SLDON selects the input-side regulator mode: when left open or tied to VDDI, the internal SLDO is disabled and VDDI must be supplied externally at 3.3 V; when grounded, the SLDO activates and accepts VDDI inputs from 3.5 V to 5.5 V, regulating down to 3.3 V. This allows flexible controller interface options while maintaining clean logic supply under varying input conditions.
2EDS7165HXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EiceDRIVER™
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- Half-Bridge
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- N-Channel, P-Channel MOSFET
- Voltage - Supply:
- 20V
- Logic Voltage - VIL, VIH:
- -, 1.65V
- Current - Peak Output (Source, Sink):
- 1A, 2A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- 6.5ns, 4.5ns
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-16-30
2EDS7165HXUMA1 FAQ
1.How can I place an order for 2EDS7165HXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for 2EDS7165HXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 2EDS7165HXUMA1 reliable?
The price and inventory of 2EDS7165HXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2EDS7165HXUMA1 is usually 5 days.
3.What payment methods are accepted for 2EDS7165HXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2EDS7165HXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 2EDS7165HXUMA1?
2EDS7165HXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 2EDS7165HXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 2EDS7165HXUMA1?
For technical support, including 2EDS7165HXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2EDS7165HXUMA1 requirements.
6.How does Aetrix verify that 2EDS7165HXUMA1 is sourced from the original manufacturer or authorized distributors?
All 2EDS7165HXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2EDS7165HXUMA1 meets industry standards.
7.What is the process for return or replacement of 2EDS7165HXUMA1?
All 2EDS7165HXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with 2EDS7165HXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 2EDS7165HXUMA1 part is unused and in its original packaging.
Return procedure for 2EDS7165HXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
2EDS7165HXUMA1 Tags

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ZXGD3009E6TA
Diodes Incorporated

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1EDN7512BXTSA1
Infineon Technologies
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UCC27517DBVR
Texas Instruments

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MCP1416T-E/OT
Microchip Technology

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MCP1402T-E/OT
Microchip Technology

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MCP1415T-E/OT
Microchip Technology

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MCP1401T-E/OT
Microchip Technology

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IX4428NTR
Littelfuse Inc.

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IRS2005STRPBF
Infineon Technologies

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IRS2008STRPBF
Infineon Technologies

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IX4310TTR
Littelfuse Inc.

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2EDN7524RXTMA1
Infineon Technologies
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