Diodes Incorporated AP2115M-1.8TRG1

Overview

AP2115M-1.8TRG1 from BCD Semiconductor is a 1.8V fixed-output, 1A CMOS low-dropout linear regulator with enable control, ±1.5% output accuracy, 450mV typical dropout at 1A, and 30µV_RMS output noise - deployed in LCD monitor power rails requiring stable low-noise bias for display driver ICs.

For engineers reviewing the AP2115M-1.8TRG1 datasheet, AP2115M-1.8TRG1 pinout, AP2115M-1.8TRG1 application, or AP2115M-1.8TRG1 equivalent, key selection criteria include dropout voltage under full load, PSRR at 1kHz (68dB), thermal shutdown threshold (160°C), and compatibility with 4.7µF ceramic output capacitors.

Technical Context

The AP2115M-1.8TRG1 implements a CMOS-based LDO architecture with internal P-channel pass transistor, fold-back short-circuit protection (50mA limit), and thermal shutdown with 25°C hysteresis. It operates across -40°C to +85°C ambient temperature with input voltage range 2.8V–6.0V.

Enable logic is active-high (VIH ≥1.5V), with 3.0MΩ internal pull-down resistor and 60Ω VOUT discharge path when disabled. Quiescent current remains stable at 60µA across 1.8V/2.5V/1.2V variants and varies only slightly with temperature and input voltage.

Key Specifications

Pinout & Package

AP2115M-1.8TRG1 uses the SOIC-8 package (M suffix), with exposed pad thermal performance (θ_JC = 74.6°C/W). Pin assignments are validated per Figure 2 and Table on page 2 of the datasheet.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1703T-1802E/MB and XC6219B182MR-G, AP2115M-1.8TRG1 delivers optimal balance of low dropout (450mV), industry-standard PSRR (68dB), integrated VOUT discharge, and SOIC-8 thermal performance - making it ideal for cost-sensitive, thermally constrained display power designs.

Availability

AP2115M-1.8TRG1 is available at Aetrix Electronics and suitable for LCD monitor power rails, LCD TV timing controller supplies, and set-top box SoC core rails requiring stable component supply, RoHS-compliant packaging, and tape-and-reel delivery for SMT production.

Supply support for AP2115M-1.8TRG1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

BCD Semiconductor Manufacturing Limited is a Shanghai-based fabless analog IC designer specializing in high-performance power management, LED drivers, and mixed-signal solutions for consumer, industrial, and automotive markets.

The AP2115 product line targets cost-effective, low-noise LDO regulation for display electronics - emphasizing ceramic-cap stability, fast enable response, and robust thermal protection in standard SOIC-8 and SOT-89-5 packages.

FAQ

What input voltage range is supported by AP2115M-1.8TRG1?

The AP2115M-1.8TRG1 operates with input voltages from 2.8V to 6.0V. Minimum input is defined by dropout requirements: at 1A load, ≥2.25V input is needed to sustain 1.8V output, but datasheet specifies 2.8V as minimum recommended for guaranteed 1A operation and stability with 4.7µF ceramic output capacitance.

Does AP2115M-1.8TRG1 require an external pull-up on the EN pin?

No. The EN pin includes a built-in 3.0MΩ pull-down resistor, ensuring default shutdown at power-up. An external pull-up is unnecessary unless system-level sequencing requires forced assertion before input stabilization - in which case a weak pull-up (≥100kΩ) may be added without violating VIH/VIL thresholds (1.5V/0.4V).

Can AP2115M-1.8TRG1 be used with aluminum electrolytic output capacitors?

Yes - the datasheet explicitly states stability with 4.7µF aluminum electrolytic, tantalum, and ceramic capacitors. However, ceramic is preferred for lowest ESR, smallest footprint, and best high-frequency PSRR; aluminum electrolytics should be selected with ≥100mΩ ESR to ensure phase margin, and derated for temperature life in high-ambient applications.

How does thermal shutdown behave during sustained overload?

Thermal shutdown activates at 160°C junction temperature and latches off until junction cools by 25°C (to ~135°C), at which point regulation resumes automatically. During overload, fold-back current limiting (50mA) reduces power dissipation first; if heat accumulation continues, OTSD triggers - verified in thermal simulation with SOIC-8 θ_JA ≈ 120°C/W on 2-layer 1oz copper.