Diodes Incorporated AP7345D-2825RH4-7

Overview

AP7345D-2825RH4-7 from Diodes Incorporated is a dual-channel CMOS low-dropout regulator delivering fixed 2.8V and 2.5V outputs, each rated for 300mA continuous current, ±1% output voltage accuracy over temperature, 75dB PSRR at 1kHz, and 60µV_rms output noise (10Hz–100kHz). It serves as a precision dual-power rail for RF transceivers and image sensor biasing in compact portable electronics.

For engineers reviewing the AP7345D-2825RH4-7 datasheet, AP7345D-2825RH4-7 pinout, AP7345D-2825RH4-7 application, or AP7345D-2825RH4-7 equivalent, key selection criteria include independent enable control per channel, thermal shutdown at +150°C with 20°C hysteresis, ultra-low 50µA quiescent current in single-channel active mode, and X2-DFN1612-8 package compatibility with high-density PCB layouts.

Technical Context

The AP7345D-2825RH4-7 integrates two independent LDO regulators on a single CMOS die, each with dedicated error amplifiers, voltage references, current-limit circuits, and enable inputs-enabling asynchronous power sequencing and channel-specific shutdown. Its architecture supports simultaneous regulation of disparate rails without cross-coupling.

Each channel features built-in short-circuit protection (fold-back current limit ~55mA), thermal shutdown with hysteresis, and auto-discharge functionality via integrated N-channel MOSFETs (30Ω typical on-resistance when disabled). Input voltage range spans 1.7V to 5.25V, supporting direct Li-ion or USB-powered operation.

Key Specifications

Pinout & Package

X2-DFN1612-8 package: 1.6mm × 1.2mm footprint, 0.4mm pitch, 0.39mm nominal height, thermal pad exposed on bottom for enhanced heat dissipation. Requires solder connection of thermal pad to GND plane for optimal thermal performance (θ_JA ≈ 220°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-LDO applications.

Compared with TPS7A202825DQNR and NCP114AMX2825TBG, the AP7345D-2825RH4-7 uniquely combines 300mA per channel, integrated discharge, halogen-free construction, and thermal hysteresis-making it the only option qualified for space-constrained, battery-powered RF and imaging systems requiring guaranteed safe shutdown behavior and zero-additional-component discharge.

Availability

AP7345D-2825RH4-7 is available at Aetrix Electronics and suitable for smartphone camera modules, RF transceiver power supplies, and portable medical imaging sensors requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support.

Supply support for AP7345D-2825RH4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

The AP7345D belongs to Diodes' high-PSRR dual-LDO product line, engineered specifically for noise-sensitive portable RF and imaging applications where board space, thermal constraints, and power sequencing flexibility are critical design parameters.

FAQ

What is the maximum allowable input voltage for AP7345D-2825RH4-7?

The absolute maximum input voltage is 6.0V, but the recommended operating range is 1.7V to 5.25V. Operation above 5.25V risks permanent damage, while below 1.7V fails to maintain regulation-especially critical for the 2.8V output, which requires ≥3.06V input at 300mA due to its 260mV dropout.

Does AP7345D-2825RH4-7 require external capacitors, and what values are recommended?

Yes: 1.0µF ceramic input (CIN1/CIN2) and output (COUT1/COUT2) capacitors are mandatory for stability and transient response. These must be placed within 2mm of their respective VIN/VOUT/GND pins. X5R/X7R dielectrics with ≤100mΩ ESR are specified; tantalum or aluminum electrolytics are not recommended due to ESR and reliability concerns.

How does the thermal pad on the X2-DFN1612-8 package function, and how should it be connected?

The exposed thermal pad is not electrically functional as a ground terminal but must be soldered to a dedicated GND copper pour for thermal conduction. Diodes Incorporated specifies connecting it to PCB ground-not leaving it floating-to achieve θ_JA ≤ 220°C/W. Using it solely as a thermal slug without GND connection degrades thermal performance by >35%.

Can EN1 and EN2 be tied together, and what happens if one enable pin is left floating?

EN1 and EN2 may be tied together only if identical sequencing is acceptable for both channels; otherwise, independent control is lost. A floating enable pin violates Absolute Maximum Ratings-causing unpredictable channel behavior, potential shoot-through current, or latch-up. Each EN pin must be actively driven to VIN or GND; pull-up/pull-down resistors ≥100kΩ are acceptable if GPIO control is unavailable.