Diodes Incorporated AP7345D-3018RH4-7

Overview

AP7345D-3018RH4-7 from Diodes Incorporated is a dual-channel, CMOS-based low-dropout linear regulator delivering fixed 3.0V and 1.8V outputs with ±1% accuracy, 300mA per channel, 75dB PSRR at 1kHz, and 60µVrms output noise (10Hz–100kHz). It operates from 1.7V to 5.25V input and supports independent enable control for each channel-ideal for powering RF circuitry and baseband processors in compact portable devices.

For engineers reviewing the AP7345D-3018RH4-7 datasheet, AP7345D-3018RH4-7 pinout, AP7345D-3018RH4-7 application, or AP7345D-3018RH4-7 equivalent, key selection criteria include dual-rail voltage accuracy, simultaneous low-noise/low-PSRR performance, thermal shutdown threshold (+150°C), and X2-DFN1612-8 footprint constraints in space-constrained PCB layouts.

Technical Context

The AP7345D-3018RH4-7 integrates two independent LDO regulators sharing a common ground but with separate VIN, VOUT, and EN pins-enabling asymmetric rail generation and independent power sequencing. Each channel uses a precision voltage reference, error amplifier, and current-limit circuit with built-in thermal shutdown (+150°C) and fold-back short-circuit protection (~55mA).

Its CMOS architecture enables ultra-low quiescent current (50µA per active channel, 0.1µA in full shutdown), while the 0.22–0.30V dropout (at 300mA, VOUT = 3.0V) and 0.35–0.44V dropout (VOUT = 1.8V) support operation near battery end-of-life in single-cell Li-ion or Li-poly systems.

Key Specifications

Pinout & Package

The AP7345D-3018RH4-7 is housed in an X2-DFN1612-8 package (1.6mm × 1.2mm, 0.4mm height) with exposed thermal pad for enhanced heat dissipation. Recommended PCB layout uses large copper area connected to GND under the thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-LDO applications.

Compared with XC6216D3018MR-G and RP512K3018-TR, the AP7345D-3018RH4-7 uniquely combines 300mA/channel delivery, 75dB PSRR, 60µVrms noise, thermal hysteresis, and integrated discharge-making it optimal for next-gen mobile RF and high-speed digital subsystems where noise, sequencing, and thermal reliability are co-constrained.

Availability

AP7345D-3018RH4-7 is available at Aetrix Electronics and suitable for RF transceiver power, mobile baseband core supply, camera sensor bias, and wireless adapter module designs requiring stable component supply with tight voltage accuracy and ultra-low noise.

Supply support for AP7345D-3018RH4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

The AP7345D belongs to Diodes' high-PSRR, low-noise LDO portfolio designed specifically for noise-sensitive portable electronics-emphasizing small-footprint dual-rail regulation with robust transient response and thermal safety.

FAQ

What is the minimum input voltage required for stable 3.0V/1.8V output regulation?

The AP7345D-3018RH4-7 requires a minimum input voltage of 1.7V across both VIN1 and VIN2. For full 300mA output at 3.0V, input must be ≥3.22V (3.0V + 0.22V dropout); for 1.8V output at 300mA, input must be ≥2.15V (1.8V + 0.35V dropout). Operation below these values results in dropout mode with unregulated output.

Does the device support independent input supplies for each channel?

Yes-VIN1 and VIN2 are electrically isolated pins, allowing separate power sources (e.g., buck converter for 3.0V rail, battery for 1.8V rail). This isolation prevents noise coupling between supply domains and supports flexible power architecture design in multi-rail systems.

How does the auto-discharge function operate during shutdown?

When either EN1 or EN2 is pulled low, the corresponding channel's internal 30Ω N-channel FET connects VOUT to GND, discharging output capacitance within microseconds. This prevents floating outputs that could cause latch-up or undefined logic states in downstream circuits during power sequencing.

What PCB layout practices maximize thermal performance?

Maximize thermal performance by connecting the exposed thermal pad to a ≥25mm² GND copper pour using ≥4 thermal vias (0.3mm diameter). Place 1µF ceramic input/output capacitors within 2mm of respective VIN/VOUT/GND pins, and route wide (≥0.3mm) traces for VIN and VOUT paths to minimize IR drop and inductance.