Diodes Incorporated AP7348D-2825RS4-7

Overview

AP7348D-2825RS4-7 from Diodes Incorporated is a quad-channel, 300mA low-dropout linear regulator with independent enable control (EN1 for VOUT1/VOUT3; EN2 for VOUT2/VOUT4), ±1% output voltage accuracy, 75dB PSRR at 1kHz, and 60µV_rms output noise (10Hz–100kHz). It delivers fixed 2.8V on Channels 1 & 2 and 2.5V on Channels 3 & 4, targeting multi-rail power domains in compact RF and imaging subsystems.

For engineers reviewing the AP7348D-2825RS4-7 datasheet, AP7348D-2825RS4-7 pinout, AP7348D-2825RS4-7 application, or AP7348D-2825RS4-7 equivalent, this device supports simultaneous dual-voltage rail generation with channel-level thermal shutdown, foldback current limiting, and auto-discharge-critical for battery-powered IoT sensor nodes and camera modules requiring fast enable/disable sequencing and low-noise analog supply.

Technical Context

The AP7348D-2825RS4-7 integrates two independent CMOS-based LDO channels per enable input: EN1 controls VOUT1 (2.8V) and VOUT3 (2.5V); EN2 controls VOUT2 (2.8V) and VOUT4 (2.5V). Each channel features its own error amplifier, foldback current limit (~55mA short-circuit clamp), and dedicated discharge path.

Thermal protection operates per channel with independent overtemperature sensing; all four outputs disable simultaneously during fault. The device uses a single internal reference for all channels but maintains ±1% accuracy across -40°C to +85°C ambient via trimmed resistor networks and low-drift design.

Key Specifications

Pinout & Package

X1-DFN1612-8 (Type B) package: 1.6mm × 1.2mm footprint, 0.4mm pitch, thermally enhanced exposed pad (electrically isolated or tied to GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad-channel LDO applications.

Compared with XC6217D2825MR-G and RP512K2825-TR, the AP7348D-2825RS4-7 uniquely balances 300mA capability, 160µA IQ, per-channel thermal protection, and dual independent enable inputs - making it the only option supporting true multi-rail power state management in space- and power-constrained edge devices.

Availability

AP7348D-2825RS4-7 is available at Aetrix Electronics and suitable for smartphone camera modules, LPWAN sensor nodes, and Wi-Fi 6 access point SoCs requiring stable component supply, precise dual-voltage rail generation, and long-term lifecycle continuity.

Supply support for AP7348D-2825RS4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

The AP7348 series targets compact, multi-rail portable electronics - designed to replace multiple single-channel LDOs with integrated enable control, thermal safety, and ultra-low noise for next-generation imaging and wireless edge devices.

FAQ

What is the maximum allowable power dissipation for AP7348D-2825RS4-7?

The absolute maximum power dissipation is 600mW, as specified in the Absolute Maximum Ratings table. Exceeding this triggers thermal shutdown at +155°C. At 300mA per channel and 2.8V output, users must ensure VDD does not exceed ~4.0V to stay within the 600mW limit, especially in still-air conditions with θ_JA = 160°C/W.

Can AP7348D-2825RS4-7 be used with ceramic output capacitors smaller than 1µF?

Yes - the device is stable with 1µF ceramic capacitors, and the datasheet confirms stability down to 0.47µF for some configurations. However, using <1µF increases output voltage deviation under load transients; for 300mA step loads, 1µF is recommended to maintain <30mV load regulation and avoid instability per the ESR vs. I_OUT graph.

How does the foldback current limiting behave during a short circuit?

When any VOUT pin is shorted to GND, the corresponding channel limits output current to ~55mA (typical), as measured in the Electrical Characteristics table. This foldback action reduces power dissipation during fault, preventing thermal runaway and enabling safe recovery once the short is removed - no latch-up or manual reset required.

Is the thermal pad electrically connected internally?

No - the exposed thermal pad is electrically isolated from all internal circuitry. It may be left floating or connected to GND for improved thermal performance, but it does not replace the functional connection required at Pin 1 (GND). Per the Pin Descriptions, Pin 1 must be soldered to the PCB ground plane regardless of thermal pad treatment.