Diodes Incorporated AP7348D-3028RS4-7

Overview

AP7348D-3028RS4-7 from Diodes Incorporated is a quad-channel low-dropout linear regulator IC with independent enable control for dual channel pairs, ±1% output voltage accuracy, 75dB PSRR at 1kHz, and 60µV_rms output noise (10Hz–100kHz). It delivers 300mA per channel across a 1.7V–5.25V input range and supports fixed outputs of 3.0V on CH1/CH3 and 2.8V on CH2/CH4 - optimized for multi-rail power in compact RF and imaging subsystems.

For engineers reviewing the AP7348D-3028RS4-7 datasheet, AP7348D-3028RS4-7 pinout, AP7348D-3028RS4-7 application, or AP7348D-3028RS4-7 equivalent, this device offers verified quad-rail sequencing capability, thermal shutdown per channel, foldback current limiting, and auto-discharge functionality - critical for battery-powered IoT sensor nodes and camera modules requiring clean, independently controlled supply rails.

Technical Context

The AP7348D-3028RS4-7 integrates two independent enable inputs (EN1 for VOUT1/VOUT3; EN2 for VOUT2/VOUT4), four error amplifiers, per-channel overtemperature sensing, and dedicated discharge FETs. Each channel features CMOS-based regulation with low R_DS(ON), enabling stable operation down to 1.7V input while maintaining 2.8V/3.0V outputs under full 300mA load.

Its architecture supports simultaneous or staggered channel activation, with thermal shutdown disabling all four channels upon any single-channel overtemperature event. The X1-DFN1612-8 (Type B) package includes an exposed thermal pad electrically isolated but thermally coupled to enhance power dissipation up to 600mW.

Key Specifications

Pinout & Package

AP7348D-3028RS4-7 is housed in the X1-DFN1612-8 (Type B) 1.6mm × 1.2mm, 0.4mm pitch, 8-pin DFN package with exposed thermal pad. The package supports high-density PCB layouts and requires soldering of the thermal pad for thermal performance compliance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad-channel LDO applications.

Compared with XC6217D3028MR-G and RP517K3028-AE, AP7348D-3028RS4-7 uniquely combines per-channel thermal protection, dual independent enables, and 300mA capability in a 1.6mm × 1.2mm footprint - making it the only option supporting fault-isolated, low-noise, space-constrained multi-rail designs.

Availability

AP7348D-3028RS4-7 is available at Aetrix Electronics and suitable for smartphone camera modules, LPWAN sensor nodes, and Wi-Fi 6 system-on-modules requiring stable component supply, long-lifecycle availability, and RoHS-compliant packaging.

Supply support for AP7348D-3028RS4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and communications markets.

The AP7348 series belongs to Diodes' high-PSRR, low-noise LDO portfolio designed specifically for multi-rail portable electronics - emphasizing small-footprint integration, rail independence, and robust fault handling in space- and power-constrained systems.

FAQ

What is the maximum allowable power dissipation for AP7348D-3028RS4-7?

The absolute maximum power dissipation is 600mW, as specified in the Absolute Maximum Ratings table. Exceeding this limit triggers thermal shutdown at +155°C, causing all four channels to disable. To stay within this limit, ensure the sum of (VDD − VOUT) × IOUT across active channels remains ≤600mW, and use the exposed thermal pad with adequate PCB copper area for θ_JA = 160°C/W.

Can EN1 and EN2 be tied together for single-enable operation?

Yes, EN1 and EN2 may be connected to the same control signal, enabling all four channels simultaneously. However, doing so forfeits independent sequencing capability - such as powering VOUT1/VOUT3 before VOUT2/VOUT4 during system boot. If rail sequencing is required, separate EN routing is mandatory per the functional block diagram.

Is external compensation required for stability with ceramic output capacitors?

No external compensation is needed. The AP7348D-3028RS4-7 is internally compensated and stable with 1µF ceramic output capacitors (as validated in Typical Performance Characteristics). For improved transient response under large load steps, low-ESR bulk capacitance may be added in parallel, but the 1µF ceramic cap must remain directly at the VOUT/GND pins.

Does the thermal pad need to be electrically connected to GND?

No - the thermal pad is electrically isolated and may be left floating or connected to GND based on thermal and layout requirements. However, it must be soldered to a PCB thermal plane for effective heat dissipation. Pin 1 (GND) remains the sole electrical ground connection; the thermal pad serves only thermal conduction, not circuit return.