Alliance Memory, Inc. AS4C256M16D3LC-12BIN

Overview

AS4C256M16D3LC-12BIN from Alliance Memory, Inc. is a 4 Gb DDR3L SDRAM memory device designed for high-speed embedded memory applications requiring low-voltage operation, reliable data throughput, and compact system integration. The device supports high-bandwidth memory access and low-power consumption, making it suitable for industrial computing, networking equipment, embedded processors, automotive electronics, and multimedia systems.

As a DDR3L memory solution, AS4C256M16D3LC-12BIN provides efficient volatile storage capability for embedded processing systems requiring stable memory bandwidth and low operating power. For engineers reviewing the AS4C256M16D3LC-12BIN datasheet, AS4C256M16D3LC-12BIN pinout, AS4C256M16D3LC-12BIN application, or AS4C256M16D3LC-12BIN equivalent, this device is widely used in embedded computing and industrial digital system architectures.

Technical Context

In embedded computing systems, AS4C256M16D3LC-12BIN typically operates as the primary volatile memory connected to microprocessors, SoCs, FPGAs, or embedded controllers. The DDR3L architecture enables high-speed double-data-rate memory transfer while reducing operating voltage compared with standard DDR3 memory devices.

The memory device supports high-bandwidth data access for real-time operating systems, multimedia processing, industrial automation, and networking workloads. Low-voltage DDR3L operation helps reduce overall system power consumption in embedded and portable applications.

AS4C256M16D3LC-12BIN is commonly used in industrial embedded computers, communication equipment, networking devices, automotive infotainment systems, multimedia processing platforms, and FPGA-based embedded architectures.

Key Specifications

Pinout & Package

The AS4C256M16D3LC-12BIN pinout is optimized for high-speed memory-interface PCB layouts and includes address lines, bank-address signals, data buses, clock inputs, control pins, power rails, and grounding connections supporting DDR3L memory operation.

For PCB design, memory routing should maintain controlled impedance and matched trace lengths for clock and data lines. Proper decoupling placement, power-distribution stability, and signal-integrity optimization help maintain reliable DDR3L operation.

Key Features

• DDR3L low-voltage architecture improves embedded system power efficiency.
• 4 Gb memory density supports high-capacity embedded processing and multimedia applications.
• High-speed SDRAM interface enables real-time data access and bandwidth-intensive processing.
• Compact FBGA package supports dense embedded PCB integration.
• Optimized memory architecture supports FPGA, SoC, and processor connectivity.
• Stable industrial memory operation improves long-term embedded system reliability.

Applications

Equivalent & Alternatives

When evaluating an AS4C256M16D3LC-12BIN equivalent, engineers should compare memory density, operating voltage, data-transfer bandwidth, package type, and processor-interface compatibility.

Compared with MT41K256M16TW-107, AS4C256M16D3LC-12BIN is optimized for embedded DDR3L replacement and long-term industrial memory support. AS4C256M16D3LC-12BIN vs IS43TR16256BL selection depends on timing requirements, lifecycle considerations, memory-interface compatibility, and embedded system architecture.

Quality

AS4C256M16D3LC-12BIN should be sourced as original Alliance Memory, Inc. components through traceable and controlled supply channels. Quality verification procedures may include package inspection, marking validation, solderability testing, memory-interface characterization, and electrical verification according to industrial production requirements.

Because the device operates in high-speed digital memory systems, controlled impedance routing, stable power-distribution design, and proper handling procedures help maintain long-term operational reliability. Traceable sourcing supports industrial and embedded manufacturing quality.

Availability

AS4C256M16D3LC-12BIN available at Aetrix Electronics and is suitable for embedded computing and industrial memory platforms requiring stable component availability and repeatable production support.

Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial automation manufacturers, networking equipment developers, and embedded computing production programs.

For production builds, confirming package type, timing compatibility, memory-interface requirements, lead time, and sourcing continuity helps improve procurement stability and reduce manufacturing interruption risk.

Manufacturer

Alliance Memory, Inc. is a semiconductor manufacturer specializing in legacy and long-lifecycle memory solutions including SDRAM, DDR, DDR2, DDR3, SRAM, and Flash memory products for industrial, embedded, networking, and communication applications.

For embedded computing systems, Alliance Memory provides long-term memory supply support and compatible replacement solutions optimized for industrial lifecycle stability and scalable embedded integration.

FAQ

What is AS4C256M16D3LC-12BIN used for?

AS4C256M16D3LC-12BIN is used for industrial embedded computing, networking systems, multimedia processing, FPGA platforms, and high-speed SDRAM memory applications.

Where can I find the AS4C256M16D3LC-12BIN datasheet download?

The AS4C256M16D3LC-12BIN datasheet download is available from Alliance Memory, Inc. The datasheet includes memory timing information, electrical characteristics, package details, signal descriptions, and PCB routing recommendations.

What should be considered in AS4C256M16D3LC-12BIN pinout design?

AS4C256M16D3LC-12BIN pinout design should prioritize matched DDR routing lengths, controlled impedance traces, stable clock distribution, optimized decoupling placement, and low-noise power integrity.

Does AS4C256M16D3LC-12BIN support low-voltage DDR3L operation?

Yes. AS4C256M16D3LC-12BIN is designed as a DDR3L SDRAM device optimized for low-voltage embedded memory applications.

What are common AS4C256M16D3LC-12BIN equivalent solutions?

Common AS4C256M16D3LC-12BIN equivalent alternatives include MT41K256M16TW-107 and IS43TR16256BL depending on timing requirements, lifecycle preferences, processor compatibility, and embedded memory architecture.