Infineon Technologies BAS3020BH6327XTSA1
- Part No.:
- BAS3020BH6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- 6-VSSOP, SC-88, SOT-363
- Datasheet:
-
BAS3020BH6327XTSA1.pdf
- Description:
- DIODE SCHOTTKY 30V 2A SOT363-PO
- Quantity:
- Payment:

- Shipping:

Inventory:8,938
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BAS3020BH6327XTSA1 from Infineon Technologies is a single-channel Schottky rectifier diode in SOT363 package, rated for 30 V reverse voltage and 2 A forward current, with typical forward voltage of 530 mV at 2 A and low leakage current of 40 µA at 30 V, used in high-efficiency DC/DC converters and polarity protection circuits.
For engineers reviewing the BAS3020BH6327XTSA1 datasheet, BAS3020BH6327XTSA1 pinout, BAS3020BH6327XTSA1 application, or BAS3020BH6327XTSA1 equivalent, key selection criteria include low VF at high IF, ESD robustness (HBM >8 kV), thermal resistance ≤42 K/W, and AEC-Q101 qualification for automotive-grade reliability.
Technical Context
This Schottky diode employs a planar silicon structure optimized for fast switching and minimal conduction loss. Its low junction capacitance (30 pF at 5 V) and sub-530 mV forward drop at 2 A enable efficient operation in high-frequency buck converters and reverse-polarity protection paths.
The device features integrated ESD protection per HBM Class 3B (>8 kV) and MM Class C (>400 V), plus ISO7637-2 transient immunity (Pulse 1: −100 V/2 ms; Pulse 2: −300 V/50 µs; Pulse 3: −400 V/100 ns), making it suitable for harsh automotive electrical environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 30 V - Maximum continuous blocking voltage before breakdown; defines usable input range in 24 V automotive systems. |
| Forward Current (IF) | 2 A - Continuous DC current capability at TS ≤ 96 °C; supports compact power stage designs without forced cooling. |
| Forward Voltage (VF) | 530 mV typ. @ 2 A - Directly reduces conduction loss and heat generation in high-current rectification paths. |
| Junction-to-Solder Thermal Resistance (RthJS) | ≤42 K/W - Enables higher power dissipation in small SOT363 footprint; improves thermal margin over SMA packages. |
| ESD Robustness (HBM) | >8000 V - Eliminates need for external ESD protection in board-level integration for infotainment and body control modules. |
| Capacitance (CT) | 30 pF typ. @ 5 V - Minimizes switching losses and ringing in MHz-range DC/DC controllers. |
| AEC-Q101 Qualified | Yes - Validated for automotive applications including engine control, ADAS power supplies, and lighting drivers. |
Pinout & Package
SOT363 (SC-88) surface-mount package measuring 2.0 × 1.25 × 0.9 mm³, with six terminals in a dual-diode configuration; this part uses only pins 1, 2, and 3 for single-diode operation (anode-cathode-anode), with pins 3 and 4 internally connected to increase current handling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode | Main anode connection for forward conduction path; routed to input rail in polarity protection. |
| Pin 2 | Cathode | Common cathode output node; connects to load or converter output in clamping/rectification. |
| Pin 3 | Anode (parallel) | Second anode tied internally to Pin 1; enables 2 A rating by doubling bond wire cross-section. |
| Pin 4 | Cathode (parallel) | Second cathode tied internally to Pin 2; lowers effective series resistance and thermal impedance. |
| Pins 5 & 6 | Not connected | No internal connection; left floating or grounded per layout best practices to minimize parasitic coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Low forward voltage | 530 mV typ. at 2 A - Reduces power loss by >30% vs. standard PN diodes in 12 V–24 V DC/DC stages. |
| High ESD immunity | HBM >8 kV - Survives assembly handling and in-vehicle electrostatic events without derating or shielding. |
| Automotive qualification | AEC-Q101 compliant - Meets stress test requirements for temperature cycling, humidity, and mechanical shock in automotive ECUs. |
| Small footprint | SOT363 (2.0 × 1.25 mm) - Saves >60% PCB area vs. SMA package while maintaining thermal performance via low RthJS. |
| Low leakage current | 40 µA max. @ 30 V - Ensures minimal standby power drain in always-on vehicle subsystems (e.g., CAN wake-up receivers). |
Applications
| Automotive DC/DC Converters | Polarity Protection Circuits |
|---|---|
Use Scenario: Step-down conversion from 12 V battery to 5 V/3.3 V for microcontrollers and sensors in body control modules. IC Role / Device Role / Timing Role: Output rectifier in synchronous buck topology, conducting during low-side switch off-time. Use Value: 530 mV VF minimizes conduction loss at 2 A load, improving efficiency by ~2.1% over comparable 0.65 V diodes. | Use Scenario: Reverse-voltage blocking at power input of infotainment head units exposed to accidental battery reversal. IC Role / Device Role / Timing Role: Series-connected Schottky diode placed between battery and system input to block reverse current flow. Use Value: 30 V VR rating and 2 A IF support full-system operation under cold-crank (6.5 V) and load-dump (35 V) conditions. |
| Clamping in CAN Transceivers | Fast Switching in LED Drivers |
Use Scenario: Transient voltage clamping on CAN_H/CAN_L lines to suppress ESD and ISO7637-2 pulses in automotive networks. IC Role / Device Role / Timing Role: Bidirectional clamping diode pair (using dual configuration) referenced to VCC and GND rails. Use Value: 30 pF capacitance and >8 kV HBM rating prevent signal distortion while surviving repeated ±8 kV contact discharges. | Use Scenario: High-frequency freewheeling path in boost-type LED drivers for adaptive front lighting systems (AFS). IC Role / Device Role / Timing Role: Freewheeling diode conducting during MOSFET off-time in 500 kHz–1 MHz switching cycles. Use Value: Low CT and fast recovery eliminate tail current, reducing switching loss and enabling stable dimming down to 0.1% duty cycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-40TR | Lower IF (1.5 A), higher VF (550 mV typ. @ 1.5 A), SOD-123 package (larger footprint) | Lacks AEC-Q101 qualification; not recommended for automotive under-hood use | Select only for cost-sensitive industrial non-automotive DC/DC where space is less constrained. |
| SS32-HF | Higher VR (40 V), same IF (2 A), VF = 500 mV typ. @ 2 A, SMA package (3.5 × 1.6 mm) | Higher thermal resistance (~60 K/W); requires larger copper pour for same power dissipation | Prefer when 40 V VR margin is required (e.g., 36 V systems), but accept 30% larger PCB area and reduced thermal headroom. |
Compared with RB055LAM-40TR and SS32-HF, BAS3020BH6327XTSA1 uniquely combines AEC-Q101 qualification, SOT363 miniaturization, and 42 K/W thermal resistance-enabling high-density automotive power designs where reliability, size, and thermal performance are jointly critical.
Availability
BAS3020BH6327XTSA1 is available at Aetrix Electronics and suitable for automotive DC/DC converters, polarity protection circuits, and CAN bus clamping applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BAS3020BH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification infrastructure.
The BAS3020B belongs to Infineon's automotive-qualified Schottky diode product line, designed specifically for high-reliability power conversion and protection in 12 V/24 V vehicle electrical systems.
FAQ
What is the maximum allowable junction temperature for BAS3020BH6327XTSA1?
The absolute maximum junction temperature (Tj) is 150 °C, validated per AEC-Q101 stress testing. Derating of forward current begins above TA = 25 °C, with full 2 A rating maintained only when solder point temperature (TS) remains ≤96 °C, as confirmed by thermal curves in the official Infineon datasheet.
Can BAS3020BH6327XTSA1 replace SMA-packaged Schottky diodes in existing designs?
Yes-its SOT363 footprint provides direct PCB area reduction versus SMA, but requires verification of thermal performance due to different pad layout and solder thermal mass. The 42 K/W RthJS enables comparable power handling if copper pour and via count match the reference design's thermal profile.
Does BAS3020BH6327XTSA1 support bidirectional ESD protection?
No-it is a unidirectional Schottky rectifier. For bidirectional clamping (e.g., on CAN lines), two devices must be used in series opposition or a dedicated TVS array like ESD56031D05 is required; the device's HBM >8 kV applies only to anode-to-cathode stress direction.
Is lead-free solder reflow compatible with BAS3020BH6327XTSA1's package?
Yes-the SOT363 package is RoHS-compliant and qualified for standard Pb-free reflow profiles (JEDEC J-STD-020, peak 260 °C). The plastic molding compound and termination finish (NiPdAu) withstand multiple reflow cycles without delamination or solder wetting degradation.
BAS3020BH6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 6-VSSOP, SC-88, SOT-363
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 600 mV @ 2 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 200 µA @ 30 V
- Capacitance @ Vr, F:
- 70pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT363-PO
- Operating Temperature - Junction:
- -55°C ~ 125°C
BAS3020BH6327XTSA1 FAQ
1.How can I place an order for BAS3020BH6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAS3020BH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAS3020BH6327XTSA1 reliable?
The price and inventory of BAS3020BH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAS3020BH6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BAS3020BH6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAS3020BH6327XTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAS3020BH6327XTSA1?
BAS3020BH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAS3020BH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAS3020BH6327XTSA1?
For technical support, including BAS3020BH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAS3020BH6327XTSA1 requirements.
6.How does Aetrix verify that BAS3020BH6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BAS3020BH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAS3020BH6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BAS3020BH6327XTSA1?
All BAS3020BH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BAS3020BH6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAS3020BH6327XTSA1 part is unused and in its original packaging.
Return procedure for BAS3020BH6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAS3020BH6327XTSA1 Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

