Infineon Technologies BAS4002S-02LRHE6327
- Part No.:
- BAS4002S-02LRHE6327
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- SOD-882
- Datasheet:
-
BAS4002S-02LRHE6327.pdf
- Description:
- DIODE SCHOTT 40V 200MA TSLP-2-17
- Quantity:
- Payment:

- Shipping:

Inventory:9,920
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Product details
Overview
BAS4002S-02LRHE6327 from Infineon Technologies is a low-forward-voltage Schottky diode in TSLP-2-17 package, rated for 40 V reverse voltage and 200 mA continuous forward current. It features VF = 420 mV at IF = 100 mA, CT = 7–12 pF at VR = 5 V / 1 MHz, and RthJS ≤ 60 K/W - optimized for space-constrained mobile phone battery charger circuits.
For engineers reviewing the BAS4002S-02LRHE6327 datasheet, BAS4002S-02LRHE6327 pinout, BAS4002S-02LRHE6327 application, or BAS4002S-02LRHE6327 equivalent, key selection criteria include ultra-low VF at low IF, sub-0.4 mm height, thermal resistance under 60 K/W, and RoHS-compliant lead-free packaging for portable power management.
Technical Context
This Schottky diode uses a planar silicon structure with metal-semiconductor junction to achieve fast switching (no minority-carrier storage) and low conduction loss. Its TSLP-2-17 package integrates a cathode-marked top-side terminal and solderable bottom pads aligned to JEDEC MS-012-compatible footprints.
Thermal performance is defined by junction-to-soldering-point resistance ≤60 K/W, enabling operation up to 150 °C junction temperature. Reverse leakage remains ≤10 µA at VR = 40 V and TA = 25 °C, supporting stable blocking in DC-DC output rectification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 40 V - maximum DC blocking capability without breakdown in battery-input protection paths |
| Forward Current (IF) | 200 mA - continuous DC current handling at TA ≤ 25 °C, derated above ambient |
| Forward Voltage (VF) | 420 mV @ IF = 100 mA - reduces conduction loss and self-heating in compact chargers |
| Diode Capacitance (CT) | 7–12 pF @ VR = 5 V, f = 1 MHz - minimizes high-frequency switching noise in boost converter catch diodes |
| Junction Temperature (Tj) | 150 °C - enables reliable operation in sealed handheld enclosures with limited airflow |
| Thermal Resistance (RthJS) | ≤60 K/W - allows direct thermal path from die to PCB copper, critical for 0.2 A power dissipation |
Pinout & Package
TSLP-2-17 is a 2-terminal surface-mount package measuring 1.0 × 0.6 × <0.4 mm (L×W×H), with exposed copper pad for thermal conduction and cathode marking on top surface. Footprint matches JEDEC MS-012 outline with 0.35 mm pad width and 0.925 mm center-to-center pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1) | Current entry point during forward bias | Connected to input rail (e.g., USB VBUS or battery anode) in reverse-polarity protection |
| Cathode (Pin 2) | Current exit point during forward bias; marked side | Connected to load or regulator input; polarity-sensitive placement required for correct rectification |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low forward voltage | VF = 420 mV @ 100 mA - cuts I²R losses by >30% vs. standard silicon diodes in 5 V charging paths |
| Miniature TSLP-2-17 footprint | 1.0 × 0.6 mm area - fits within 1.5 mm² board space, enabling dual-diode layouts in slim smartphones |
| Low junction-to-solder thermal resistance | RthJS ≤ 60 K/W - sustains 200 mA operation with <12 °C rise above PCB temperature |
| Controlled reverse leakage | IR ≤ 10 µA @ VR = 40 V - prevents standby current drain in always-on battery monitoring circuits |
Applications
| USB Power Path Management | Smartphone Battery Protection |
|---|---|
Use Scenario: Isolating USB input from battery during charging to prevent backfeed and enable simultaneous power delivery. IC Role / Device Role / Timing Role: Low-VF Schottky OR-ing diode placed between VBUS and PMIC input rail. Use Value: 420 mV VF at 100 mA limits voltage drop to <0.5% of 5 V supply, preserving PMIC regulation margin. | Use Scenario: Blocking reverse current from battery into failed or disconnected USB source. IC Role / Device Role / Timing Role: Unidirectional isolation element in battery feed path with no control logic required. Use Value: IR ≤ 10 µA at 40 V ensures <1 µA standby leakage, extending shelf life of sealed devices. |
| Wireless Charging Receiver Output | Portable Medical Device Power Rail |
Use Scenario: Rectifying AC output from resonant wireless power receiver before LDO input. IC Role / Device Role / Timing Role: High-frequency catch diode operating at 100–200 kHz switching frequency. Use Value: 7–12 pF capacitance minimizes switching node ringing and EMI in compact coil-integrated modules. | Use Scenario: Providing reverse-polarity protection on primary Li-ion battery input of wearable monitors. IC Role / Device Role / Timing Role: Passive safety component in Class II medical device power stage. Use Value: 150 °C max junction temperature supports sterilization cycles and extended field operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB521S-40T1G | VF = 370 mV @ 100 mA; same 40 V VR but SOD-523 package (1.2 × 0.8 mm) | Larger footprint increases board area by 60%; higher RthJA due to smaller thermal pad | Prefer when lower VF outweighs size constraint and thermal budget permits |
| NSR0240HT1G | VF = 450 mV @ 100 mA; same TSLP-2-17 footprint but 120 °C Tj rating | Lower max junction temperature reduces usable derating margin in enclosed designs | Acceptable where ambient stays below 85 °C and thermal headroom is available |
Compared with RB521S-40T1G and NSR0240HT1G, BAS4002S-02LRHE6327 uniquely balances ultra-low profile (<0.4 mm), 150 °C Tj, and 420 mV VF - making it optimal for thermally dense, height-limited smartphone power rails where long-term reliability under thermal cycling is critical.
Availability
BAS4002S-02LRHE6327 is available at Aetrix Electronics and suitable for USB power path management, smartphone battery protection, wireless charging receiver output, and portable medical device power rail applications requiring stable component supply and RoHS-compliant sourcing.
Supply support for BAS4002S-02LRHE6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and discrete power devices, with global manufacturing and R&D centers.
The BAS4002S-02LRHE6327 belongs to Infineon's Trench Schottky diode product line, engineered specifically for ultra-compact, high-efficiency DC-DC and battery interface applications in mobile and wearables.
FAQ
What is the maximum allowable soldering temperature for BAS4002S-02LRHE6327?
The TSLP-2-17 package is qualified for standard lead-free reflow per J-STD-020, with peak temperature up to 260 °C for ≤30 seconds. Preheat ramp rate must not exceed 3 °C/s, and time above 217 °C shall be 60–150 seconds. Thermal shock testing confirms integrity after three reflow cycles.
Does BAS4002S-02LRHE6327 support bidirectional current flow?
No - it is a unidirectional Schottky diode. Forward conduction occurs only from anode to cathode; reverse bias blocks current up to 40 V. It cannot function as a bidirectional switch or TVS device. For reverse overvoltage protection, a separate TVS or Zener clamp is required.
How does the 60 K/W RthJS value translate to real-world PCB layout?
With RthJS ≤60 K/W and 200 mA at 420 mV (84 mW dissipation), junction-to-solder-point rise is ≤5 °C. To achieve this, use ≥10 mm² of 1 oz copper connected to both terminals, avoid thermal relief on cathode pad, and ensure full-solder coverage on the exposed thermal pad per Infineon's recommended footprint.
Is BAS4002S-02LRHE6327 suitable for automotive infotainment power supplies?
It meets AEC-Q101 stress test requirements for discrete semiconductors and operates across –55 °C to +150 °C. However, its 40 V VR rating makes it unsuitable for 12 V automotive battery transients (which exceed 40 V). Use only in post-regulated 5 V/3.3 V subsystems, not direct battery-connected rails.
BAS4002S-02LRHE6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- SOD-882
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 200mA
- Voltage - Forward (Vf) (Max) @ If:
- 550 mV @ 200 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 10 µA @ 40 V
- Capacitance @ Vr, F:
- 7pF @ 5V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSLP-2-17
- Operating Temperature - Junction:
- 150°C
BAS4002S-02LRHE6327 FAQ
1.How can I place an order for BAS4002S-02LRHE6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAS4002S-02LRHE6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAS4002S-02LRHE6327 reliable?
The price and inventory of BAS4002S-02LRHE6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAS4002S-02LRHE6327 is usually 5 days.
3.What payment methods are accepted for BAS4002S-02LRHE6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAS4002S-02LRHE6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAS4002S-02LRHE6327?
BAS4002S-02LRHE6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAS4002S-02LRHE6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAS4002S-02LRHE6327?
For technical support, including BAS4002S-02LRHE6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAS4002S-02LRHE6327 requirements.
6.How does Aetrix verify that BAS4002S-02LRHE6327 is sourced from the original manufacturer or authorized distributors?
All BAS4002S-02LRHE6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAS4002S-02LRHE6327 meets industry standards.
7.What is the process for return or replacement of BAS4002S-02LRHE6327?
All BAS4002S-02LRHE6327 units undergo pre-shipment inspection (PSI). If there is an issue with BAS4002S-02LRHE6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAS4002S-02LRHE6327 part is unused and in its original packaging.
Return procedure for BAS4002S-02LRHE6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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