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Infineon Technologies BGT60TR13CSWXUMA1

Part No.:
BGT60TR13CSWXUMA1
Manufacturer:
Infineon Technologies
Category:
Specialized Sensors
Package:
Datasheet:
AetrixBGT60TR13CSWXUMA1.pdf
Description:
SENSOR - RADAR SENSOR DIGITAL
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,222

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Product details

Overview

BGT60TR13CSWXUMA1 from Infineon is a fully integrated 60 GHz FMCW radar transceiver IC with monolithic antenna-in-package (6.5 × 5.0 × 0.9 mm³), three 12-bit RX ADC channels (4 MSps), integrated PLL ramp generator, and on-chip FSM for autonomous frame execution-designed for ultra-low-power gesture sensing behind radomes in consumer electronics.

For engineers reviewing the BGT60TR13CSWXUMA1 datasheet, BGT60TR13CSWXUMA1 pinout, BGT60TR13CSWXUMA1 application, or BGT60TR13CSWXUMA1 equivalent, key selection considerations include its 5.5 GHz RF bandwidth (58–63.5 GHz), dual-domain clocking (80 MHz system / 50 MHz SPI), 196 kbit FIFO buffer, and dedicated VDDLF (3.3 V) supply for PLL loop filter level-shifting.

Technical Context

The device implements a sigma-delta-based 3rd-order RF-PLL with integrated ramp generator to synthesize precise linear FMCW chirps across 58–63.5 GHz, supporting high-resolution range/velocity estimation. Its analog baseband includes per-channel HPF, VGA, and anti-aliasing filters prior to 12-bit differential SAR ADCs.

Digital operation is managed by an embedded finite state machine (FSM) that autonomously sequences radar frames without host intervention after initial trigger-enabling low-duty-cycle operation. Data flow uses a full-duplex 8192 × 24-bit FIFO buffered via standard SPI (≤50 MHz), with dedicated IRQ signaling and hardware reset (DIO3) for deterministic system integration.

Key Specifications

Parameter Value and Actual Design Meaning
RF Frequency Range 58.0–63.5 GHz: Enables 5.5 GHz instantaneous bandwidth for ~2.7 cm range resolution in FMCW mode.
RX ADC Resolution & Rate 12-bit differential SAR, 4 MSps per channel: Supports high-SNR IF sampling across three independent receive paths.
FIFO Depth 196 kbit (8192 × 24-bit words): Buffers full-frame radar data for burst transfer, reducing host polling overhead.
Supply Voltages VDDD/VDDA = 1.8 V; VDDLF = 3.3 V; VDDRF/VDDVCO/VDDPLL = 1.8 V: Separated domains enable noise isolation and optimized PLL loop filter drive.
Integrated Antenna On-package Tx1 + Rx1/Rx2/Rx3: Eliminates external RF routing, enabling compact 6.5 × 5.0 × 0.9 mm³ form factor with repeatable radiation pattern.
System Clock Input 80 MHz OSC_CLK (external crystal): Serves as reference for PLL, MADC, SADC, and FIFO timing-ensuring coherent sampling and ramp generation.

Pinout & Package

Package: 36-ball laminate WLCSP (6.5 × 5.0 × 0.9 mm³), RoHS-compliant, JEDEC J-STD-020 qualified.

Pin/Terminal Circuit Role Design Meaning
CLK SPI clock input Accepts up to 50 MHz SPI clock; synchronous interface for register access and FIFO readout.
CS_N SPI chip select (active low) Enables SPI transaction; must be asserted before CLK edge to initiate communication.
DI / DO SPI data in / out Half-duplex serial interface for configuration writes and radar data reads via FIFO.
IRQ Interrupt output Active-low signal indicating FIFO full, frame completion, or error condition-enables event-driven host response.
RST / DIO3 Hardware reset input Asynchronous reset pin; drives internal FSM and digital logic into known state on falling edge.
VDDLF 3.3 V supply for PLL loop filter Provides level-shifted voltage to drive external loop filter components-critical for PLL stability and phase noise performance.
VDDRF / VSSRF RF domain supply / ground Dedicated 1.8 V rail and ground plane isolate sensitive RF frontend from digital noise.
VDDD / VSSD Digital supply / ground 1.8 V digital core power with separate ground minimizes switching noise coupling into analog/RF sections.

Key Features

Feature Design Value
Antenna-in-Package (AiP) Monolithic 60 GHz Tx1 + Rx1/Rx2/Rx3 radiators integrated into redistribution layers-eliminates RF connector loss and assembly variability.
Autonomous FSM Operation On-chip finite state machine executes complete radar frame sequences (chirp generation, sampling, buffering) without host CPU involvement after trigger.
Dual-Domain Clock Architecture 80 MHz system clock (PLL/MADC/FIFO) synchronized with configurable SPI clock (≤50 MHz)-enables deterministic timing across RF/digital boundaries.
Multi-Channel IF Digitization Three independent 12-bit, 4 MSps ADCs digitize baseband outputs from each RX path-preserving phase coherence for beamforming and Doppler processing.
Configurable Power Modes Multiple low-power states (standby, idle, active) controlled via registers-reducing average current to <10 mA in gesture-sensing duty cycles.

Applications

Gesture Sensing Interface Smart Appliance Presence Detection

Use Scenario: Contactless hand-motion control of displays, lighting, or audio systems in ambient-lit indoor environments.

IC Role / Device Role / Timing Role: Radar frontend generating FMCW chirps and digitizing echo IF signals from three spatially separated receivers for real-time Doppler and angle-of-arrival estimation.

Use Value: Enables sub-centimeter motion resolution and robust false-trigger rejection behind plastic/glass surfaces using integrated antennas and on-chip FSM timing control.

Use Scenario: Occupancy-aware activation of kitchen appliances (microwaves, ovens) when user approaches within 1 m.

IC Role / Device Role / Timing Role: Short-range FMCW radar sensor detecting micro-Doppler signatures of human gait and posture changes via synchronized triple-RX sampling.

Use Value: Delivers reliable detection through cabinet doors or panels using 60 GHz penetration and 5.5 GHz bandwidth-no optical line-of-sight required.

Automotive Cabin Monitoring IoT Smart Home Occupancy Mapping

Use Scenario: Driver drowsiness and passenger presence detection in vehicle cabins under varying thermal and lighting conditions.

IC Role / Device Role / Timing Role: Integrated radar transceiver performing continuous frame acquisition with autonomous FSM sequencing and low-latency IRQ notification of motion events.

Use Value: Achieves <100 ms detection latency and immunity to cabin glare/sunlight using coherent 60 GHz sensing and on-chip 196 kbit FIFO buffering.

Use Scenario: Room-level occupancy tracking and activity classification (sitting, walking, stationary) in residential HVAC or security systems.

IC Role / Device Role / Timing Role: Compact radar node acquiring multi-channel IF data for FFT-based range-Doppler processing on edge MCU, leveraging SPI-burst FIFO readout.

Use Value: Reduces system BOM by eliminating external RF components and enables firmware-upgradable sensing algorithms via register-based configuration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 60 GHz FMCW radar frontend applications.

Alternative Part Technical Difference Application Difference Selection Advice
TI IWR6843ISK 45 nm RFCMOS process; 3 TX / 4 RX channels; integrated DSP; requires external antenna; larger 161-pin BGA package (10.4 × 10.4 mm). Targets higher-complexity applications requiring onboard point-cloud generation and real-time tracking-not suitable for ultra-compact AiP designs. Select when on-device signal processing and multi-target resolution are required; avoid when board space or radome-integration is constrained.
NXP RW612 24 GHz ISM band; single TX / two RX; no integrated antenna; 12-bit ADC at 2 MSps; supports BLE coexistence but lacks 60 GHz resolution. Designed for cost-sensitive industrial presence detection-not viable for fine-grained gesture recognition or sub-5 cm ranging. Choose for legacy 24 GHz compliance or Bluetooth-integrated systems; reject for high-resolution short-range radar where bandwidth and integration are critical.

Compared with IWR6843ISK and RW612, BGT60TR13CSWXUMA1 uniquely delivers 60 GHz bandwidth, monolithic AiP, and autonomous FSM in a 6.5 mm × 5.0 mm footprint-making it optimal for space-constrained, low-power gesture interfaces where external RF components and large packages are prohibitive.

Availability

BGT60TR13CSWXUMA1 is available at Aetrix Electronics and suitable for gesture sensing interfaces, smart appliance presence detection, and automotive cabin monitoring requiring stable component supply and qualified automotive-grade packaging.

Supply support for BGT60TR13CSWXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensors, and automotive ICs, with leadership in radar and RF silicon.

BGT60TR13CSWXUMA1 belongs to Infineon's XENSIV™ 60 GHz radar sensor family, engineered specifically for compact, low-power, antenna-integrated FMCW sensing in consumer and automotive interiors.

FAQ

What reference clock frequency is required for BGT60TR13CSWXUMA1 operation?

The device requires an external 80 MHz clock applied to the OSC_CLK pin (Ball M2). This clock serves as the primary reference for the RF-PLL, MADC, SADC, and FIFO timing domains. It must meet ±50 ppm stability over temperature and supply variations to maintain FMCW chirp linearity and ADC sampling accuracy.

How is radar data transferred from BGT60TR13CSWXUMA1 to the host processor?

Radar IF samples are stored in the on-chip 196 kbit FIFO and read out via standard SPI interface using DI/DO lines. The IRQ pin asserts low upon FIFO fill threshold or frame completion, enabling interrupt-driven burst reads. SPI clock supports up to 50 MHz, allowing full-frame transfer in under 4 ms at maximum rate.

Does BGT60TR13CSWXUMA1 support independent operation without host intervention?

Yes-the integrated finite state machine (FSM) can execute complete radar frames autonomously after initial configuration and trigger. It controls chirp generation, ADC sampling, FIFO write, and power state transitions without host CPU involvement, reducing system-level power consumption during idle periods.

What is the role of the VDDLF pin and why is it supplied at 3.3 V?

VDDLF supplies 3.3 V to the internal level shifter driving the external passive loop filter of the RF-PLL. This higher voltage ensures sufficient drive strength and noise margin for the analog filter components, directly impacting PLL phase noise and FMCW ramp fidelity-critical for sub-centimeter ranging accuracy.

BGT60TR13CSWXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
Sensor Type:
Radar Sensor
Output Type:
Digital
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-

BGT60TR13CSWXUMA1 FAQ

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Please submit a Request for Quotation (RFQ) for BGT60TR13CSWXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of BGT60TR13CSWXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BGT60TR13CSWXUMA1 is usually 5 days.

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BGT60TR13CSWXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BGT60TR13CSWXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

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5.How can I obtain technical support or documentation for BGT60TR13CSWXUMA1?

For technical support, including BGT60TR13CSWXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BGT60TR13CSWXUMA1 requirements.

6.How does Aetrix verify that BGT60TR13CSWXUMA1 is sourced from the original manufacturer or authorized distributors?

All BGT60TR13CSWXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BGT60TR13CSWXUMA1 meets industry standards.

7.What is the process for return or replacement of BGT60TR13CSWXUMA1?

All BGT60TR13CSWXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BGT60TR13CSWXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BGT60TR13CSWXUMA1 part is unused and in its original packaging.

Return procedure for BGT60TR13CSWXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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