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Silicon Labs C8051F332-GMR

Part No.:
C8051F332-GMR
Manufacturer:
Silicon Labs
Category:
Microcontrollers
Package:
20-VFQFN Exposed Pad
Datasheet:
AetrixC8051F332-GMR.pdf
Description:
IC MCU 8BIT 4KB FLASH 20QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,033

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Product details

Overview

C8051F332-GMR from Silicon Laboratories is a mixed-signal ISP Flash MCU featuring an 8051-compatible CIP-51 core delivering 25 MIPS at 25 MHz, 4 kB flash memory, 768 B SRAM, and integrated 10-bit ADC (200 ksps, 16-channel), voltage comparator, and hardware UART/SMBus/SPI serial interfaces - deployed in low-power sensor interface and industrial control nodes.

For engineers reviewing the C8051F332-GMR datasheet, C8051F332-GMR pinout, C8051F332-GMR application, or C8051F332-GMR equivalent, key selection criteria include its 20-pin QFN package, 2.7–3.6 V supply range, sub-µA stop-mode current (0.1 µA), on-chip debug via C2 interface, and analog-peripheral integration for embedded measurement systems requiring minimal external components.

Technical Context

The C8051F332-GMR implements a pipelined 8051 core (CIP-51) executing 70% of instructions in 1–2 system clocks, with dual internal oscillators: a 24.5 MHz ±2% precision oscillator enabling crystal-less UART operation and an 80/40/20/10 kHz low-power oscillator for sleep-mode timing. Its analog subsystem includes a 10-bit ADC with programmable input mux, internal temperature sensor, and reference selection (VREF pin, internal VREF, or VDD).

Digital peripherals are routed through a flexible crossbar switch to 17 GPIO pins (all 5 V tolerant), supporting hardware UART, SMBus, and enhanced SPI. Power management includes Idle and Stop modes, with typical stop current of 0.1 µA and wake-up capability from comparator, PCA, or external interrupt sources.

Key Specifications

Parameter Value and Actual Design Meaning
Core 8051-compatible CIP-51 CPU, 25 MIPS @ 25 MHz - enables real-time deterministic control without external co-processor
Flash / RAM 4 kB ISP flash (512-byte sectors), 768 B SRAM (256 + 512) - supports field firmware updates and local data buffering
ADC 10-bit SAR ADC, 200 ksps max, 16-channel single-ended/differential - sufficient for multi-sensor sampling at ≤100 Hz per channel
Supply & Power 2.7–3.6 V operation; 6.4 mA @ 25 MHz, 9 µA @ 32 kHz, 0.1 µA stop mode - enables battery-powered operation >5 years on coin cell
Package 20-pin QFN (4 × 4 mm, 0.5 mm pitch) - compact footprint compatible with automated SMT assembly and thermal pad grounding
Oscillators Internal 24.5 MHz ±2% HF oscillator + 80/40/20/10 kHz LF oscillator - eliminates external crystal for UART timing and reduces BOM count
Debug Interface C2 two-wire interface - enables non-intrusive full-speed in-system debug without ICE hardware or target socket

Pinout & Package

20-pin QFN package (4 × 4 mm body, 0.5 mm pitch, exposed thermal pad). Pin assignments are validated per Silicon Labs' Rev. 1.7 datasheet Table 4.1 and Figure 4.1.

Pin/Terminal Circuit Role Design Meaning
VDD Power supply Primary 2.7–3.6 V supply rail; requires local 0.1 µF decoupling adjacent to pin
GND Ground reference System ground plane connection; thermal pad must be soldered to PCB ground for thermal and EMI performance
P0.0 / C2D C2 debug data / Port 0.0 Two-wire debug I/O; shares with GPIO; requires pull-up for C2 communication
P0.1 / C2CK C2 debug clock / Port 0.1 C2 interface clock input; shares with GPIO; no external pull required
P0.2 / TX0 UART0 transmit / Port 0.2 Asynchronous serial output; 5 V tolerant; connects directly to RS-232 level shifter or TTL logic
P0.3 / RX0 UART0 receive / Port 0.3 Asynchronous serial input; 5 V tolerant; accepts standard TTL-level signals
P0.4 / SCL SMBus clock / Port 0.4 Open-drain SMBus clock line; requires external pull-up to VDD
P0.5 / SDA SMBus data / Port 0.5 Open-drain SMBus data line; requires external pull-up to VDD
P0.6 / MOSI SPI0 master-out/slave-in / Port 0.6 Full-duplex SPI data output in master mode; high-drive strength supports driving multiple slaves
P0.7 / MISO SPI0 master-in/slave-out / Port 0.7 Full-duplex SPI data input in master mode; sampled on SCK edge per CKPHA setting
P1.0 / SCK SPI0 serial clock / Port 1.0 Generated by master or received from slave; determines bit rate and sampling edge
P1.1 / NSS SPI0 slave select / Port 1.1 Active-low chip select; asserted to enable SPI peripheral communication
P1.2 / INT0 External interrupt 0 / Port 1.2 Edge-triggered interrupt input; configurable polarity; used for wake-up or event capture
P1.3 / INT1 External interrupt 1 / Port 1.3 Edge-triggered interrupt input; independent priority level; supports asynchronous sensor alerts
P1.4 / T0 Timer 0 external input / Port 1.4 Capture/counter input for Timer 0; accepts TTL or CMOS pulses up to system clock frequency
P1.5 / T1 Timer 1 external input / Port 1.5 Capture/counter input for Timer 1; supports quadrature decoding or pulse-width measurement
P1.6 / CEX0 PCA module 0 capture/compare / Port 1.6 Input capture or PWM output pin for PCA channel 0; supports high-speed timing functions
P1.7 / CEX1 PCA module 1 capture/compare / Port 1.7 Input capture or PWM output pin for PCA channel 1; enables dual independent PWM outputs
AV+ / VREF Analog reference / ADC positive input Selectable ADC reference source: internal 2.4 V, external voltage, or VDD - sets full-scale range
TEMP Internal temperature sensor output Connects to ADC input channel; provides calibrated die temperature reading (±3°C accuracy)

Key Features

Feature Design Value
Crystal-less UART operation 24.5 MHz internal oscillator with ±2% accuracy eliminates external crystal while maintaining <2% UART baud error
Low-power stop mode 0.1 µA typical current draw with RAM retention and wake-up capability from comparator or external interrupt
5 V tolerant I/O All 17 GPIO pins withstand 5.5 V inputs - simplifies interfacing with legacy 5 V logic and sensors without level shifters
On-chip temperature sensor Integrated calibrated sensor connected to ADC0 - enables system thermal monitoring without external components
Hardware serial interfaces Dedicated UART, SMBus, and SPI peripherals - offload bit-banging, reduce CPU overhead, and ensure protocol compliance
C2 two-wire debug Single-pin debug clock + single-pin debug data - minimizes footprint impact vs. JTAG and supports production programming

Applications

Industrial Sensor Node Smart Thermostat Interface

Use Scenario: Remote environmental monitoring using thermistor, humidity, and pressure sensors in factory-floor enclosures.

IC Role / Device Role / Timing Role: Central mixed-signal controller performing ADC sampling, digital filtering, SMBus sensor polling, and UART-based telemetry reporting.

Use Value: Integrated 10-bit ADC, temperature sensor, and 5 V tolerant I/O eliminate signal conditioning ICs and simplify analog front-end design.

Use Scenario: Residential HVAC control unit requiring precise temperature sensing, user interface button scanning, and wireless module communication.

IC Role / Device Role / Timing Role: Primary MCU managing RTD/thermistor readings, LCD segment drive (via GPIO), and UART command parsing for Wi-Fi/BLE modules.

Use Value: Sub-µA stop mode extends battery life in battery-backed units; internal 24.5 MHz oscillator ensures reliable UART comms without crystal BOM cost.

Portable Data Logger Motor Control Feedback Unit

Use Scenario: Battery-powered field logger capturing vibration, temperature, and voltage waveforms over days using microSD storage.

IC Role / Device Role / Timing Role: Low-power acquisition engine triggering ADC conversions on timer or external interrupt, buffering data in SRAM, and transferring via SPI to SD card.

Use Value: 768 B SRAM + 4 kB flash enables local pre-processing and burst logging; 9 µA active current at 32 kHz extends runtime on CR2032 cells.

Use Scenario: Brushless DC motor driver board needing real-time current sensing, hall-effect commutation timing, and fault reporting.

IC Role / Device Role / Timing Role: Auxiliary timing and protection monitor interfacing with main motor controller via SMBus or GPIO, sampling current sense amplifiers via ADC.

Use Value: PCA-based PWM generation and high-speed capture on P1.4/P1.5 support precise commutation edge detection and dead-time control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixed-signal MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
C8051F330-GMR 8 kB flash, 10-bit DAC (IDA0), same ADC/peripherals - larger code space but adds current-output DAC not present in C8051F332-GMR Required where analog actuation (e.g., bias current control) is needed alongside sensing Select when DAC functionality is mandatory; otherwise C8051F332-GMR offers optimal balance of flash size and feature set
C8051F331-GMR 8 kB flash, no ADC or DAC - lacks analog peripherals entirely; identical core, timers, and serial interfaces Suitable only for purely digital control tasks with no analog sensing or generation Choose only if analog functions are fully externalized; C8051F332-GMR integrates ADC for reduced system complexity

Compared with C8051F330-GMR and C8051F331-GMR, the C8051F332-GMR provides the optimal trade-off: sufficient 4 kB flash for compact firmware, full analog sensing capability (10-bit ADC, temp sensor, comparator), and no redundant DAC - making it ideal for cost-sensitive, sensor-rich embedded designs where analog integration reduces component count.

Availability

C8051F332-GMR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart building controllers, and portable instrumentation requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for C8051F332-GMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Silicon Laboratories is a fabless semiconductor company specializing in mixed-signal ICs for timing, IoT, and embedded control applications, with design centers in Austin, Munich, and Taipei.

The C8051F33x family was engineered for cost-sensitive, low-power embedded systems requiring integrated analog peripherals and robust in-system debug - targeting sensor fusion, industrial automation, and consumer electronics.

FAQ

What is the maximum ADC sampling rate supported by the C8051F332-GMR?

The C8051F332-GMR supports a maximum ADC conversion rate of 200 ksps (kilo-samples per second) in its 10-bit successive approximation register (SAR) architecture. This rate applies when using the internal 24.5 MHz system clock and optimized tracking/conversion timing. Real-world sustained throughput depends on channel count, reference settling, and software overhead - typically achieving ~150 ksps in multi-channel polled mode. The C8051F332-GMR ADC includes built-in temperature sensor and programmable window compare for autonomous threshold detection.

Does the C8051F332-GMR include an internal voltage reference for the ADC?

Yes, the C8051F332-GMR includes an internal 2.4 V voltage reference that can be selected as the ADC reference source via configuration registers. It also supports external reference input on the VREF pin or direct use of VDD as reference. The internal reference is factory-calibrated and stable across temperature and supply voltage, enabling consistent 10-bit ADC measurements without external reference ICs. This capability is confirmed in the "Voltage Reference" section (page 61) of the C8051F330/1/2/3/4/5 Rev. 1.7 datasheet.

Can the C8051F332-GMR operate without an external crystal?

Yes, the C8051F332-GMR can operate fully without an external crystal thanks to its dual internal oscillators: a 24.5 MHz high-frequency oscillator with ±2% accuracy and an 80/40/20/10 kHz low-frequency oscillator. The 24.5 MHz oscillator supports crystal-less UART operation with baud rate error under 2%, eliminating the need for external timing components in many applications. System clock source can be switched dynamically between internal and external options, enabling flexible power management strategies in the C8051F332-GMR.

What debug interface does the C8051F332-GMR use, and how many pins are required?

The C8051F332-GMR uses the C2 two-wire debug interface, requiring only two dedicated pins: C2D (P0.0) for bidirectional data and C2CK (P0.1) for clock. This interface enables full-speed, non-intrusive in-system debugging - including breakpoints, single-stepping, and memory/register inspection - without emulator hardware or target socket. The C2 interface is electrically compatible with standard 3.3 V logic levels and supports both development and production programming of the C8051F332-GMR.

Is the C8051F332-GMR pin-compatible with other devices in the C8051F33x family?

Yes, the C8051F332-GMR is pin-compatible with all members of the C8051F33x family (C8051F330/1/2/3/4/5) in the 20-pin QFN package, sharing identical pin definitions and electrical characteristics per Table 4.1 of the Rev. 1.7 datasheet. However, functional differences exist: only C8051F330/2/4 include the 10-bit ADC; only C8051F330 includes the 10-bit current DAC; and flash sizes vary (8/4/2 kB). PCBs designed for C8051F332-GMR can accommodate C8051F330-GMR or C8051F331-GMR without layout changes, but firmware must match the specific peripheral set of the installed C8051F332-GMR.

C8051F332-GMR Specifications

Product attributes
Attribute value
Manufacturer:
Silicon Labs
Package/Case:
20-VFQFN Exposed Pad
Series:
C8051F33x
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
768 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

C8051F332-GMR FAQ

1.How can I place an order for C8051F332-GMR through Aetrix?

Please submit a Request for Quotation (RFQ) for C8051F332-GMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for C8051F332-GMR reliable?

The price and inventory of C8051F332-GMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for C8051F332-GMR is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for C8051F332-GMR transactions.

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C8051F332-GMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your C8051F332-GMR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for C8051F332-GMR?

For technical support, including C8051F332-GMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your C8051F332-GMR requirements.

6.How does Aetrix verify that C8051F332-GMR is sourced from the original manufacturer or authorized distributors?

All C8051F332-GMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that C8051F332-GMR meets industry standards.

7.What is the process for return or replacement of C8051F332-GMR?

All C8051F332-GMR units undergo pre-shipment inspection (PSI). If there is an issue with C8051F332-GMR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The C8051F332-GMR part is unused and in its original packaging.

Return procedure for C8051F332-GMR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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