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Silicon Labs C8051F557-IM

Part No.:
C8051F557-IM
Manufacturer:
Silicon Labs
Category:
Microcontrollers
Package:
24-WFQFN Exposed Pad
Datasheet:
AetrixC8051F557-IM.pdf
Description:
IC MCU 8BIT 16KB FLASH 24QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,361

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Product details

Overview

C8051F557-IM from Silicon Laboratories is a mixed-signal, automotive-qualified 8051-based microcontroller with integrated 12-bit ADC (200 ksps), dual comparators, CAN 2.0 controller, LIN 2.1 controller, and hardware UART/SMBus/SPI. It operates from 1.8–5.25 V, delivers 50 MIPS at 50 MHz, and targets engine control units and body electronics requiring AEC-Q100 compliance.

For engineers reviewing the C8051F557-IM datasheet, C8051F557-IM pinout, C8051F557-IM application, or C8051F557-IM equivalent, key selection criteria include its crystal-free CAN/LIN operation, on-chip 24 MHz ±0.5% oscillator, 1 μA stop-mode current, 5 V-tolerant I/O, and QFN-24 package compatibility with space-constrained automotive modules.

Technical Context

The C8051F557-IM implements a pipelined CIP-51 core executing 70% of instructions in 1–2 system clocks, enabling deterministic real-time response in safety-critical vehicle networks. Its clock system supports dynamic switching between internal 24 MHz oscillator (CAN/LIN-qualified) and external sources, enabling low-power wake-up and high-accuracy bus timing.

Digital peripherals include a 16-bit programmable counter array (PCA) with six capture/compare modules, four 16-bit timers, and a priority crossbar for flexible peripheral-to-pin routing. Analog resources comprise a 32-channel 12-bit ADC with internal temperature sensor and two programmable hysteresis comparators usable as interrupt or reset sources.

Key Specifications

Parameter Value and Actual Design Meaning
Core High-speed 8051 (CIP-51); executes 70% of instructions in 1–2 clocks for deterministic timing
Max Clock Speed 50 MHz; enables 50 MIPS throughput for real-time CAN message handling and sensor processing
ADC Resolution & Rate 12-bit, up to 200 ksps; supports high-fidelity analog monitoring of throttle position, coolant temp, and battery voltage
Flash / RAM 16 kB Flash (512-byte sectors), 2304 B RAM (256 + 2048 XRAM); supports field firmware updates and multi-task data buffering
Supply Range 1.8–5.25 V; accommodates wide automotive battery transients without external regulators
Stop Mode Current 1 μA typical; enables ultra-low-power sleep in LIN node wake-on-message applications
Operating Temp –40°C to +125°C; qualified per AEC-Q100 Grade 1 for under-hood deployment

Pinout & Package

Package: 24-pin QFN (5 × 5 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad (EP). Pin count and layout match C8051F550–F557 family variants; compatible with standard reflow profiles for automotive PCB assembly.

Pin/Terminal Circuit Role Design Meaning
VDD Power supply input Primary 1.8–5.25 V supply; decoupling required per datasheet Figure 9.1 for regulator stability
GND Ground reference System ground; connects to EP for thermal dissipation and noise reduction
P0.0–P0.7 Port 0 I/O 8-bit bidirectional, 5 V-tolerant digital I/O; configurable as analog inputs for ADC0 channel selection
P1.0–P1.7 Port 1 I/O 8-bit bidirectional, 5 V-tolerant digital I/O; includes C2CK/C2D debug pins and LIN/CAN signal routing
P2.0–P2.7 Port 2 I/O 8-bit bidirectional, 5 V-tolerant digital I/O; supports PCA, timer, and UART functions via crossbar
XTAL1/XTAL2 Oscillator interface Optional external crystal connection; not required for CAN/LIN due to internal 24 MHz oscillator
CANRX / CANTX CAN physical layer interface Dedicated differential pair for ISO 11898-2 compliant CAN bus communication
LINRX / LINTX LIN physical layer interface Single-wire bidirectional interface supporting LIN 2.1 master/slave operation without external transceiver

Key Features

Feature Design Value
CAN 2.0 Controller Integrated Bosch-compliant CAN controller with message objects and FIFO; eliminates need for external CAN transceiver in basic nodes
LIN 2.1 Controller Hardware LIN master/slave with autobaud and sleep/wake support; enables single-chip LIN slave nodes in door modules or sensors
Crystal-Free Operation Internal 24 MHz ±0.5% oscillator meets CAN/LIN timing accuracy requirements; removes external crystal cost and board space
On-Chip Debug (C2) 2-pin JTAG-compatible interface enabling full-speed, non-intrusive in-system debug without emulator hardware or socket footprint
5 V-Tolerant I/O All 18 port pins tolerate 5 V regardless of VDD level; simplifies interfacing with legacy 5 V sensors and actuators in mixed-voltage systems
Temperature Sensor Built-in calibrated silicon temperature sensor (±3°C accuracy); provides die temperature monitoring for thermal management without external components

Applications

Engine Control Unit (ECU) Body Control Module (BCM)

Use Scenario: Real-time acquisition of crankshaft position, throttle angle, and coolant temperature in gasoline engine management.

IC Role / Device Role / Timing Role: Primary MCU executing closed-loop fuel injection and spark timing algorithms with sub-microsecond interrupt latency.

Use Value: Internal 24 MHz oscillator ensures CAN message timing compliance while 12-bit ADC resolves sensor signals to ≤1 mV resolution for precise air-fuel ratio control.

Use Scenario: Centralized control of lighting, window lift, and door lock functions in passenger compartment.

IC Role / Device Role / Timing Role: LIN master coordinating slave nodes (mirror controls, seat motors) and managing local PWM dimming.

Use Value: Integrated LIN 2.1 controller and 16-bit PCA enable synchronized PWM generation and guaranteed message scheduling without software overhead.

Transmission Control Module (TCM) Advanced Driver Assistance System (ADAS) Sensor Node

Use Scenario: Monitoring transmission fluid temperature, pressure, and solenoid status in automatic gearbox control.

IC Role / Device Role / Timing Role: Safety-relevant node communicating over CAN bus with ECU and dashboard cluster using ISO 11898-2 protocol.

Use Value: AEC-Q100 qualification and 1 μA stop mode support fail-safe behavior and battery conservation during vehicle idle states.

Use Scenario: Low-cost radar or ultrasonic parking sensor node reporting object distance via LIN to central processor.

IC Role / Device Role / Timing Role: LIN slave with wake-on-message capability, converting analog echo signals to digital distance values.

Use Value: On-chip 12-bit ADC and temperature sensor allow direct analog front-end processing-eliminating external signal conditioning ICs and reducing BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixed-signal automotive MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S9S12G128F0MLH 16-bit HCS12 core, 128 kB Flash, no integrated CAN/LIN PHY; requires external transceivers Higher Flash capacity but larger code footprint; suited for complex diagnostics and flash-over-air updates Select when >64 kB program memory or ASAM-compliant diagnostics stack is required
Renesas RL78/F13 16-bit RL78 core, 128 kB Flash, integrated LIN PHY only; no CAN controller Lower power (0.35 μA stop mode) but lacks CAN-requires companion CAN MCU or external controller Select for LIN-only body electronics where CAN integration is unnecessary and ultra-low power dominates

Compared with NXP S9S12G128F0MLH and Renesas RL78/F13, the C8051F557-IM uniquely combines CAN + LIN controllers, crystal-free operation, and AEC-Q100 qualification in a 24-pin QFN-reducing component count and PCB area for compact dual-bus automotive nodes.

Availability

C8051F557-IM is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control systems requiring stable component supply across extended automotive lifecycles.

Supply support for C8051F557-IM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Silicon Laboratories is a fabless semiconductor company specializing in mixed-signal ICs for timing, MCU, wireless, and sensor applications, with deep expertise in low-power and automotive-grade design.

The C8051F55x family was designed for cost-sensitive, space-constrained automotive subsystems requiring integrated CAN/LIN communication, high-precision analog sensing, and AEC-Q100 reliability-without external timing crystals or transceivers.

FAQ

Is the C8051F557-IM pin-compatible with other C8051F55x devices?

Yes, the C8051F557-IM shares identical 24-pin QFN packaging and pinout with all C8051F550–F557 variants. Function mapping across P0–P2 ports, CAN/LIN I/O, and debug pins is consistent-enabling hardware reuse across flash size variants (16 kB vs. 32 kB) without PCB redesign.

Does the C8051F557-IM require an external crystal for CAN operation?

No, the C8051F557-IM uses its internal 24 MHz oscillator with ±0.5% accuracy, which meets the timing tolerance requirements for CAN 2.0 high-speed (1 Mbps) and LIN 2.1 communication-eliminating the need for an external crystal, associated load capacitors, and board space.

What is the maximum number of ADC input channels supported by the C8051F557-IM?

The C8051F557-IM supports up to 32 external single-ended ADC inputs via its analog multiplexer. All 18 port pins (P0.0–P1.7, P2.0–P2.1) can be configured as ADC inputs, and internal sources-including the on-chip temperature sensor-are also selectable through ADC0 configuration registers.

How does the C8051F557-IM handle LIN bus wake-up events?

The C8051F557-IM supports LIN sleep mode with wake-on-break detection. When in stop mode, the LIN controller monitors the bus for dominant-level break fields; upon detection, it wakes the core and triggers LIN interrupt service-enabling <100 μs response time while maintaining 1 μA quiescent current.

Can the C8051F557-IM operate reliably at 125°C junction temperature?

Yes, the C8051F557-IM is AEC-Q100 qualified for Grade 1 (–40°C to +125°C ambient), and its electrical characteristics-including ADC linearity, oscillator accuracy, and I/O drive strength-are fully specified and tested across this range. Thermal pad (EP) soldering is mandatory to ensure safe junction temperature under continuous 50 MHz operation.

C8051F557-IM Specifications

Product attributes
Attribute value
Manufacturer:
Silicon Labs
Package/Case:
24-WFQFN Exposed Pad
Series:
C8051F55x
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
18
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2.25K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 18x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

C8051F557-IM FAQ

1.How can I place an order for C8051F557-IM through Aetrix?

Please submit a Request for Quotation (RFQ) for C8051F557-IM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for C8051F557-IM reliable?

The price and inventory of C8051F557-IM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for C8051F557-IM is usually 5 days.

3.What payment methods are accepted for C8051F557-IM?

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Note: Certain payment methods may incur a processing fee.

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C8051F557-IM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your C8051F557-IM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for C8051F557-IM?

For technical support, including C8051F557-IM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your C8051F557-IM requirements.

6.How does Aetrix verify that C8051F557-IM is sourced from the original manufacturer or authorized distributors?

All C8051F557-IM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that C8051F557-IM meets industry standards.

7.What is the process for return or replacement of C8051F557-IM?

All C8051F557-IM units undergo pre-shipment inspection (PSI). If there is an issue with C8051F557-IM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The C8051F557-IM part is unused and in its original packaging.

Return procedure for C8051F557-IM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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