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Cypress Semiconductor Corp CY7C1069AV33-10BAC

Part No.:
CY7C1069AV33-10BAC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixCY7C1069AV33-10BAC.pdf
Description:
IC SRAM 16MBIT PARALLEL 60FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,469

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Product details

Overview

CY7C1069AV33-10BAC from Cypress Semiconductor is a 2,097,152 × 8-bit (2 M × 8) asynchronous CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V operation, automatic CE-based power-down, and TTL-compatible I/O. It supports high-speed data buffering in embedded controllers and network packet memory where deterministic low-latency read/write cycles are required.

For engineers reviewing the CY7C1069AV33-10BAC datasheet, CY7C1069AV33-10BAC pinout, CY7C1069AV33-10BAC application, or CY7C1069AV33-10BAC equivalent, key selection criteria include tAA = 10 ns timing, dual chip enable (CE1/CE2) logic for hierarchical memory mapping, 2.0 V data retention voltage, FBGA-60 package thermal and density advantages, and ISB2 standby current of 50 µA at CMOS input conditions.

Technical Context

The CY7C1069AV33-10BAC implements a fully asynchronous SRAM architecture with independent address decoding, sense amplifier array, and bidirectional I/O drivers. Its dual CE architecture (CE1 active-low, CE2 active-high) enables selective bank enabling in multi-chip memory systems without external gating logic.

Power management is handled via automatic transition to low-power mode when CE1 is HIGH or CE2 is LOW, reducing ICC to 50 µA (ISB2) under CMOS input conditions. Data retention remains valid down to 2.0 V VCC, supporting graceful power-fail holdover in industrial control modules.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 2,097,152 words × 8 bits - provides 2 MB byte-addressable storage space for firmware caching or real-time data buffers.
Access Time (tAA) 10 ns - guarantees sub-100 MHz synchronous interface compatibility without wait states in FPGA or microcontroller glue logic.
VCC Operating Range 3.3 V ± 0.3 V - compatible with standard 3.3 V LVTTL and LVCMOS I/O domains; no level-shifting required.
Data Retention Voltage 2.0 V - enables battery-backed operation during main supply brownout, preserving critical state in telecom line cards.
Standby Current (ISB2) 50 µA - supports ultra-low-power sleep modes in portable instrumentation and remote sensor nodes.
Package 60-ball FBGA (8 mm × 20 mm × 1.2 mm) - offers improved thermal dissipation and board-area efficiency vs. TSOP II for high-density PCB layouts.
Input/Output Compatibility TTL-compatible - ensures direct interfacing with legacy microcontrollers and ASICs without bus transceivers.

Pinout & Package

The CY7C1069AV33-10BAC is housed in a 60-ball fine-pitch ball grid array (FBGA) package measuring 8 mm × 20 mm × 1.2 mm (package code 51-85162), with center power/ground distribution and DNU (do-not-use) balls requiring floating or VSS tie-down per datasheet guidance.

Pin/Terminal Circuit Role Design Meaning
CE1, CE2 Chip Enable Pair Active-low CE1 and active-high CE2 together form a two-signal enable gate; prevents partial selection glitches in multi-SRAM systems.
WE Write Enable Low-active signal controlling write cycle initiation; must be synchronized with CE1/CE2 assertion and address stability.
OE Output Enable Controls output driver activation; high-Z state on OE HIGH isolates bus during reads from other peripherals.
I/O0–I/O7 Bidirectional Data Bus 8-bit multiplexed data path; transitions to high-impedance during deselect, write, or OE disable - eliminates need for external bus transceivers.
A0–A20 Address Inputs 21-bit address bus supporting full 2 M-word addressing; A20 enables access to highest 1 MB block in linear map.
VCC, VSS Power & Ground Multiple VCC/VSS balls distributed across package corners and center - reduces IR drop and improves noise immunity in high-speed operation.

Key Features

Feature Design Value
Dual CE architecture (CE1/CE2) Enables hierarchical memory decoding without external logic, simplifying address decoding in multi-bank systems.
Automatic CE power-down Reduces ICC to 50 µA when deselected - eliminates need for external power-gating circuitry in battery-powered designs.
2.0 V data retention Maintains stored contents during brownout or backup battery operation - critical for nonvolatile state preservation in industrial PLCs.
TTL-compatible I/O Direct interface with 3.3 V microcontrollers and FPGAs - avoids level translators and associated timing skew or BOM cost.
60-ball FBGA package 0.8 mm ball pitch, 8 mm × 20 mm footprint - delivers superior thermal performance and routing density over 54-pin TSOP II alternatives.

Applications

Industrial PLC Data Buffering Network Packet Memory

Use Scenario: Storing transient Ethernet frame payloads in Layer 2 switch ASICs before forwarding decisions.

IC Role / Device Role / Timing Role: Asynchronous 2 M × 8 SRAM providing zero-wait-state read/write access for bursty packet ingress/egress.

Use Value: 10 ns tAA enables full 100 Mbps wire-speed buffering without pipeline stalls; FBGA thermal profile sustains continuous traffic load.

Use Scenario: Holding configuration registers and status flags in programmable logic controller backplanes.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding runtime parameters during hot-swappable module insertion/removal.

Use Value: 2.0 V data retention preserves critical I/O mapping during 3.3 V rail interruption; CE1/CE2 allows isolated bank access during diagnostics.

Medical Imaging Frame Store Automotive ADAS Preprocessing Buffer

Use Scenario: Temporary storage of digitized ultrasound scan lines prior to DSP-based beamforming.

IC Role / Device Role / Timing Role: High-reliability static RAM acting as line buffer between ADC interface and FPGA processing pipeline.

Use Value: TTL-compatible I/O ensures clean signal integrity at 50+ MHz sampling clocks; multiple VCC/VSS balls suppress switching noise in analog-sensitive environments.

Use Scenario: Caching radar point-cloud metadata in automotive forward collision warning ECUs.

IC Role / Device Role / Timing Role: Low-latency memory for timestamped object tracking vectors generated by vision processors.

Use Value: 50 µA ISB2 standby current extends ECU sleep-mode battery life; industrial-grade –40°C to +85°C operation validated per ordering code suffix.

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61LV20488AL-10MLI Same 2 M × 8 organization and 10 ns access, but uses single CE and lacks CE2; 48-pin TSOP II only. No dual-CE bank isolation; unsuitable for hierarchical memory maps requiring glitch-free chip select sequencing. Select when board space permits TSOP II and system design uses simple single-enable memory decoding.
Winbond W9825G6JH-10 DDR SDRAM (256 Mbit), not SRAM; requires clock, command bus, refresh; higher bandwidth but non-deterministic latency. Not pin- or functionally compatible; introduces complexity in timing-critical deterministic systems. Choose only if sustained throughput >200 MB/s is required and latency jitter is acceptable in the application layer.

Compared with IS61LV20488AL-10MLI and W9825G6JH-10, the CY7C1069AV33-10BAC uniquely delivers deterministic 10 ns access with dual CE control and 2.0 V data retention in an FBGA package-making it optimal for safety-critical, low-jitter, and power-interruption-resilient embedded memory roles.

Availability

CY7C1069AV33-10BAC is available at Aetrix Electronics and suitable for industrial PLC data buffering, network packet memory, and medical imaging frame store applications requiring stable component supply, long-lifecycle support, and Pb-free compliance.

Supply support for CY7C1069AV33-10BAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.

The CY7C1069AV33 belongs to Cypress's high-speed asynchronous SRAM product line, designed specifically for deterministic, low-latency memory applications in real-time embedded systems where refresh-free operation and precise timing control are mandatory.

FAQ

What is the maximum operating temperature range for CY7C1069AV33-10BAC?

The CY7C1069AV33-10BAC is rated for industrial operation from –40°C to +85°C ambient temperature. This rating is confirmed in the "Operating Range" table on page 4 of the official datasheet (Document #: 38-05255 Rev. *F), and applies to both DC and AC specifications including tAA = 10 ns and ISB2 = 50 µA.

Does CY7C1069AV33-10BAC require an external clock signal?

No. The CY7C1069AV33-10BAC is an asynchronous static RAM and operates without any clock input. All timing is controlled by edge-triggered control signals (CE1, CE2, WE, OE) and address setup/hold windows defined in the AC switching characteristics table (page 4).

Can CY7C1069AV33-10BAC be used with 2.5 V I/O interfaces?

No. The device requires VCC = 3.3 V ± 0.3 V and specifies VIH = 2.0 V minimum and VIL = 0.8 V maximum. Driving inputs below 2.0 V may cause unreliable logic recognition; interfacing with 2.5 V systems requires level translation per the Absolute Maximum Ratings section.

How many address lines does CY7C1069AV33-10BAC have?

The CY7C1069AV33-10BAC has 21 address inputs (A0 through A20), as confirmed by its 2,097,152-word (221) organization. This is explicitly stated in the Functional Description section (page 1) and verified in the TSOP II and FBGA pin configurations (pages 2–3).

CY7C1069AV33-10BAC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-FBGA (8x20)

CY7C1069AV33-10BAC FAQ

1.How can I place an order for CY7C1069AV33-10BAC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1069AV33-10BAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1069AV33-10BAC reliable?

The price and inventory of CY7C1069AV33-10BAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069AV33-10BAC is usually 5 days.

3.What payment methods are accepted for CY7C1069AV33-10BAC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069AV33-10BAC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1069AV33-10BAC?

CY7C1069AV33-10BAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1069AV33-10BAC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1069AV33-10BAC?

For technical support, including CY7C1069AV33-10BAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069AV33-10BAC requirements.

6.How does Aetrix verify that CY7C1069AV33-10BAC is sourced from the original manufacturer or authorized distributors?

All CY7C1069AV33-10BAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069AV33-10BAC meets industry standards.

7.What is the process for return or replacement of CY7C1069AV33-10BAC?

All CY7C1069AV33-10BAC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069AV33-10BAC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1069AV33-10BAC part is unused and in its original packaging.

Return procedure for CY7C1069AV33-10BAC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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