Cypress Semiconductor Corp CY7C1069AV33-10BAC
- Part No.:
- CY7C1069AV33-10BAC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
CY7C1069AV33-10BAC.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 60FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,469
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Product details
Overview
CY7C1069AV33-10BAC from Cypress Semiconductor is a 2,097,152 × 8-bit (2 M × 8) asynchronous CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V operation, automatic CE-based power-down, and TTL-compatible I/O. It supports high-speed data buffering in embedded controllers and network packet memory where deterministic low-latency read/write cycles are required.
For engineers reviewing the CY7C1069AV33-10BAC datasheet, CY7C1069AV33-10BAC pinout, CY7C1069AV33-10BAC application, or CY7C1069AV33-10BAC equivalent, key selection criteria include tAA = 10 ns timing, dual chip enable (CE1/CE2) logic for hierarchical memory mapping, 2.0 V data retention voltage, FBGA-60 package thermal and density advantages, and ISB2 standby current of 50 µA at CMOS input conditions.
Technical Context
The CY7C1069AV33-10BAC implements a fully asynchronous SRAM architecture with independent address decoding, sense amplifier array, and bidirectional I/O drivers. Its dual CE architecture (CE1 active-low, CE2 active-high) enables selective bank enabling in multi-chip memory systems without external gating logic.
Power management is handled via automatic transition to low-power mode when CE1 is HIGH or CE2 is LOW, reducing ICC to 50 µA (ISB2) under CMOS input conditions. Data retention remains valid down to 2.0 V VCC, supporting graceful power-fail holdover in industrial control modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 8 bits - provides 2 MB byte-addressable storage space for firmware caching or real-time data buffers. |
| Access Time (tAA) | 10 ns - guarantees sub-100 MHz synchronous interface compatibility without wait states in FPGA or microcontroller glue logic. |
| VCC Operating Range | 3.3 V ± 0.3 V - compatible with standard 3.3 V LVTTL and LVCMOS I/O domains; no level-shifting required. |
| Data Retention Voltage | 2.0 V - enables battery-backed operation during main supply brownout, preserving critical state in telecom line cards. |
| Standby Current (ISB2) | 50 µA - supports ultra-low-power sleep modes in portable instrumentation and remote sensor nodes. |
| Package | 60-ball FBGA (8 mm × 20 mm × 1.2 mm) - offers improved thermal dissipation and board-area efficiency vs. TSOP II for high-density PCB layouts. |
| Input/Output Compatibility | TTL-compatible - ensures direct interfacing with legacy microcontrollers and ASICs without bus transceivers. |
Pinout & Package
The CY7C1069AV33-10BAC is housed in a 60-ball fine-pitch ball grid array (FBGA) package measuring 8 mm × 20 mm × 1.2 mm (package code 51-85162), with center power/ground distribution and DNU (do-not-use) balls requiring floating or VSS tie-down per datasheet guidance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1, CE2 | Chip Enable Pair | Active-low CE1 and active-high CE2 together form a two-signal enable gate; prevents partial selection glitches in multi-SRAM systems. |
| WE | Write Enable | Low-active signal controlling write cycle initiation; must be synchronized with CE1/CE2 assertion and address stability. |
| OE | Output Enable | Controls output driver activation; high-Z state on OE HIGH isolates bus during reads from other peripherals. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit multiplexed data path; transitions to high-impedance during deselect, write, or OE disable - eliminates need for external bus transceivers. |
| A0–A20 | Address Inputs | 21-bit address bus supporting full 2 M-word addressing; A20 enables access to highest 1 MB block in linear map. |
| VCC, VSS | Power & Ground | Multiple VCC/VSS balls distributed across package corners and center - reduces IR drop and improves noise immunity in high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual CE architecture (CE1/CE2) | Enables hierarchical memory decoding without external logic, simplifying address decoding in multi-bank systems. |
| Automatic CE power-down | Reduces ICC to 50 µA when deselected - eliminates need for external power-gating circuitry in battery-powered designs. |
| 2.0 V data retention | Maintains stored contents during brownout or backup battery operation - critical for nonvolatile state preservation in industrial PLCs. |
| TTL-compatible I/O | Direct interface with 3.3 V microcontrollers and FPGAs - avoids level translators and associated timing skew or BOM cost. |
| 60-ball FBGA package | 0.8 mm ball pitch, 8 mm × 20 mm footprint - delivers superior thermal performance and routing density over 54-pin TSOP II alternatives. |
Applications
| Industrial PLC Data Buffering | Network Packet Memory |
|---|---|
|
Use Scenario: Storing transient Ethernet frame payloads in Layer 2 switch ASICs before forwarding decisions. IC Role / Device Role / Timing Role: Asynchronous 2 M × 8 SRAM providing zero-wait-state read/write access for bursty packet ingress/egress. Use Value: 10 ns tAA enables full 100 Mbps wire-speed buffering without pipeline stalls; FBGA thermal profile sustains continuous traffic load. |
Use Scenario: Holding configuration registers and status flags in programmable logic controller backplanes. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding runtime parameters during hot-swappable module insertion/removal. Use Value: 2.0 V data retention preserves critical I/O mapping during 3.3 V rail interruption; CE1/CE2 allows isolated bank access during diagnostics. |
| Medical Imaging Frame Store | Automotive ADAS Preprocessing Buffer |
|
Use Scenario: Temporary storage of digitized ultrasound scan lines prior to DSP-based beamforming. IC Role / Device Role / Timing Role: High-reliability static RAM acting as line buffer between ADC interface and FPGA processing pipeline. Use Value: TTL-compatible I/O ensures clean signal integrity at 50+ MHz sampling clocks; multiple VCC/VSS balls suppress switching noise in analog-sensitive environments. |
Use Scenario: Caching radar point-cloud metadata in automotive forward collision warning ECUs. IC Role / Device Role / Timing Role: Low-latency memory for timestamped object tracking vectors generated by vision processors. Use Value: 50 µA ISB2 standby current extends ECU sleep-mode battery life; industrial-grade –40°C to +85°C operation validated per ordering code suffix. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV20488AL-10MLI | Same 2 M × 8 organization and 10 ns access, but uses single CE and lacks CE2; 48-pin TSOP II only. | No dual-CE bank isolation; unsuitable for hierarchical memory maps requiring glitch-free chip select sequencing. | Select when board space permits TSOP II and system design uses simple single-enable memory decoding. |
| Winbond W9825G6JH-10 | DDR SDRAM (256 Mbit), not SRAM; requires clock, command bus, refresh; higher bandwidth but non-deterministic latency. | Not pin- or functionally compatible; introduces complexity in timing-critical deterministic systems. | Choose only if sustained throughput >200 MB/s is required and latency jitter is acceptable in the application layer. |
Compared with IS61LV20488AL-10MLI and W9825G6JH-10, the CY7C1069AV33-10BAC uniquely delivers deterministic 10 ns access with dual CE control and 2.0 V data retention in an FBGA package-making it optimal for safety-critical, low-jitter, and power-interruption-resilient embedded memory roles.
Availability
CY7C1069AV33-10BAC is available at Aetrix Electronics and suitable for industrial PLC data buffering, network packet memory, and medical imaging frame store applications requiring stable component supply, long-lifecycle support, and Pb-free compliance.
Supply support for CY7C1069AV33-10BAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.
The CY7C1069AV33 belongs to Cypress's high-speed asynchronous SRAM product line, designed specifically for deterministic, low-latency memory applications in real-time embedded systems where refresh-free operation and precise timing control are mandatory.
FAQ
What is the maximum operating temperature range for CY7C1069AV33-10BAC?
The CY7C1069AV33-10BAC is rated for industrial operation from –40°C to +85°C ambient temperature. This rating is confirmed in the "Operating Range" table on page 4 of the official datasheet (Document #: 38-05255 Rev. *F), and applies to both DC and AC specifications including tAA = 10 ns and ISB2 = 50 µA.
Does CY7C1069AV33-10BAC require an external clock signal?
No. The CY7C1069AV33-10BAC is an asynchronous static RAM and operates without any clock input. All timing is controlled by edge-triggered control signals (CE1, CE2, WE, OE) and address setup/hold windows defined in the AC switching characteristics table (page 4).
Can CY7C1069AV33-10BAC be used with 2.5 V I/O interfaces?
No. The device requires VCC = 3.3 V ± 0.3 V and specifies VIH = 2.0 V minimum and VIL = 0.8 V maximum. Driving inputs below 2.0 V may cause unreliable logic recognition; interfacing with 2.5 V systems requires level translation per the Absolute Maximum Ratings section.
How many address lines does CY7C1069AV33-10BAC have?
The CY7C1069AV33-10BAC has 21 address inputs (A0 through A20), as confirmed by its 2,097,152-word (221) organization. This is explicitly stated in the Functional Description section (page 1) and verified in the TSOP II and FBGA pin configurations (pages 2–3).
CY7C1069AV33-10BAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-FBGA (8x20)
CY7C1069AV33-10BAC FAQ
1.How can I place an order for CY7C1069AV33-10BAC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1069AV33-10BAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1069AV33-10BAC reliable?
The price and inventory of CY7C1069AV33-10BAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069AV33-10BAC is usually 5 days.
3.What payment methods are accepted for CY7C1069AV33-10BAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069AV33-10BAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1069AV33-10BAC?
CY7C1069AV33-10BAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1069AV33-10BAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1069AV33-10BAC?
For technical support, including CY7C1069AV33-10BAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069AV33-10BAC requirements.
6.How does Aetrix verify that CY7C1069AV33-10BAC is sourced from the original manufacturer or authorized distributors?
All CY7C1069AV33-10BAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069AV33-10BAC meets industry standards.
7.What is the process for return or replacement of CY7C1069AV33-10BAC?
All CY7C1069AV33-10BAC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069AV33-10BAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1069AV33-10BAC part is unused and in its original packaging.
Return procedure for CY7C1069AV33-10BAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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