Cypress Semiconductor Corp CY7C1314CV18-200BZC

Overview

CY7C1314CV18-200BZC from Cypress Semiconductor is a 18-Mbit QDR® II SRAM with 512K × 36 organization, 200 MHz maximum operating frequency, 1.8V core supply (±0.1V), and 1.4–1.8V I/O supply (VDDQ). It implements separate read/write ports with DDR interfaces on both, 2-word burst architecture, and DLL-enabled 1.5-cycle read latency - deployed in high-bandwidth networking packet buffers and switch fabric memory subsystems.

For engineers reviewing the CY7C1314CV18-200BZC datasheet, CY7C1314CV18-200BZC pinout, CY7C1314CV18-200BZC application, or CY7C1314CV18-200BZC equivalent, key selection considerations include x36 bus width support, echo clock (CQ/CQ) timing alignment for high-speed data capture, dual-clock domain operation (K/K and C/C), and FBGA-165 package compatibility with dense PCB layouts.

Technical Context

The CY7C1314CV18-200BZC uses QDR II architecture with fully independent read and write ports sharing a multiplexed 18-bit address bus (A[17:0]), enabling concurrent transactions without bus turnaround. Its internal organization comprises two 256K × 36 arrays, supporting depth expansion via RPS/WPS and byte-write select (BWS[3:0]) control.

It employs synchronous self-timed writes, HSTL-compatible variable-drive output buffers, and a Delay Lock Loop (DLL) that aligns echo clocks (CQ/CQ) to output clocks (C/C) for precise data capture at 400 Mbps per pin. In DLL-off mode, it operates as a QDR I device with 1-cycle latency up to 167 MHz.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T36150L10BG and IS61WV102436B, the CY7C1314CV18-200BZC uniquely delivers 200 MHz DDR operation with echo-clock–assisted data capture and DLL-based latency control - making it optimal for next-generation switch fabrics requiring sub-5 ns timing closure across 32-bit+ buses.

Availability

CY7C1314CV18-200BZC is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, telecom line card buffering, and high-performance test equipment requiring stable component supply and long-term industrial availability.

Supply support for CY7C1314CV18-200BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

The QDR® II SRAM product line targets high-speed data-path applications demanding deterministic latency, concurrent access, and robust DDR timing - specifically engineered for switch ASICs, packet processors, and test instrumentation.

FAQ

What is the function of the DOFF pin on CY7C1314CV18-200BZC?

The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled low, the device reverts to QDR I timing with 1-cycle read latency and a maximum frequency of 167 MHz. For normal QDR II operation at 200 MHz with 1.5-cycle latency, DOFF must be tied high via a ≤10 kΩ pull-up resistor to VDDQ.

How does the ZQ pin affect output driver performance?

The ZQ pin connects to an external resistor (RQ) to ground to calibrate output driver impedance. The device sets CQ, CQ, and Q[35:0] output impedance to 0.2 × RQ - typically 25 Ω for a 125 Ω resistor. This matching minimizes signal reflections on high-speed HSTL buses. Leaving ZQ floating or tying it to GND violates specifications and degrades signal integrity.

Can CY7C1314CV18-200BZC operate in single-clock mode?

Yes - by connecting C and K, and C and K, the device enters single-clock mode. In this configuration, all data transfers (read and write) are synchronized to the K/K clock pair only. Output data appears on Q[35:0] on rising edges of K/K, and echo clocks CQ/CQ track K/K instead of C/C. This simplifies clock distribution but sacrifices deskew capability.

What is the purpose of BWS[3:0] in x36 configuration?

BWS[3:0] are active-low byte write select signals that enable granular 9-bit updates within the 36-bit word. BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Asserting only selected BWS lines preserves unmodified bytes during partial writes - eliminating read-modify-write cycles and reducing power in sparse update scenarios.