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Cypress Semiconductor Corp CY7C1346H-166AXCT

Part No.:
CY7C1346H-166AXCT
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1346H-166AXCT.pdf
Description:
IC SRAM 2MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,954

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Product details

Overview

CY7C1346H-166AXCT from Cypress Semiconductor is a 2-Mbit (64K × 36) pipelined synchronous SRAM with registered I/O, 3.3V core/3.3V–2.5V I/O operation, 3.5 ns clock-to-output delay at 166 MHz, and JEDEC-standard 100-pin TQFP packaging. It serves as high-speed secondary cache memory in Pentium-class processor systems requiring burst-mode addressing and byte-selectable writes.

For engineers reviewing the CY7C1346H-166AXCT datasheet, CY7C1346H-166AXCT pinout, CY7C1346H-166AXCT application, or CY7C1346H-166AXCT equivalent, key selection criteria include synchronous burst timing compliance, dual-address-strobe (ADSP/ADSC) support, ZZ sleep mode entry/exit latency, and 4-byte write granularity with global write override.

Technical Context

The CY7C1346H-166AXCT implements a two-bit wraparound burst counter fed by A1/A0, supporting both Intel Pentium interleaved and linear burst sequences selected via the MODE strap pin. All synchronous inputs-including address, data, CE1/CE2/CE3, ADSP/ADSC, ADV, BWA–BWD, BWE, and GW-are registered on the rising edge of CLK.

It features asynchronous OE and ZZ controls, synchronous self-timed writes, and common I/O architecture with output registers. The device supports single-cycle ADSC-initiated writes and two-cycle ADSP-initiated writes, with automatic DQ tri-state during write cycles regardless of OE state.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density2 Mbit (64K × 36 bits), enabling 288-bit wide cache line storage per access
Max Clock Frequency166 MHz - defines maximum sustained burst throughput of 595 MB/s (36-bit × 166 MHz)
Access Time (tCO)3.5 ns - guarantees data valid at DQ outputs within 3.5 ns after CLK rise for timing-critical cache interfaces
Core Supply Voltage3.3 V ± 0.3 V - requires dedicated low-noise 3.3V core rail, decoupled from I/O supply
I/O Supply Range2.5 V or 3.3 V - allows direct interfacing with either 2.5V or 3.3V logic families without level shifters
Burst Mode ControlMODE pin strapping - GND = linear, floating/VDD = interleaved - sets burst address sequence at power-up
Sleep Current (IDDZZ)40 mA max - specifies worst-case quiescent current during ZZ-active sleep, critical for thermal/power budgeting

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), JEDEC-standard lead-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CLKSynchronous clock inputRising-edge-triggered master timing reference for all registered inputs/outputs and burst counter increment
ADSP / ADSCAddress strobe inputsADSP prioritized over ADSC; both qualify address capture and initiate burst sequencing-enables dual-bus system integration
ADVBurst advance controlActive-Low signal that increments internal 2-bit counter on CLK rise-controls burst depth progression without external address generation
BWA–BWD, BWE, GWByte write controlsFour independent byte enables + enable gate + global override-enables precise 1–4 byte writes without read-modify-write overhead
OEAsynchronous output enableActive-Low tri-state control independent of CLK-allows dynamic bus sharing and eliminates output contention during write cycles
ZZAsynchronous sleep inputActive-High entry into low-power mode; requires 2 clock cycles to enter/exit; preserves data integrity during sleep

Key Features

FeatureDesign Value
Pipelined synchronous interfaceInput and output registers synchronized to CLK eliminate setup/hold violations in high-speed bus designs
User-selectable burst orderMODE pin configures interleaved (Pentium-compatible) or linear burst-no firmware or configuration register required
Synchronous self-timed writesOn-chip write timing logic removes external write pulse generation-simplifies controller design and improves reliability
Common I/O with automatic tri-stateDQ pins auto-tri-state during writes regardless of OE state-prevents bus contention and eliminates need for OE coordination logic
Three-level chip enable (CE1/CE2/CE3)Supports hierarchical memory banking with independent CE2 (active-HIGH) for flexible address decoding in multi-SRAM systems

Applications

Intel Pentium Cache SubsystemHigh-Performance Network Packet Buffer

Use Scenario: Secondary cache between Pentium processor and main memory in embedded industrial controllers.

IC Role / Device Role / Timing Role: Pipelined SRAM providing 36-bit-wide burst reads/writes synchronized to processor ADSP/ADV signals with interleaved addressing.

Use Value: 3.5 ns tCO and 166 MHz operation meet Pentium P54C/P55C timing requirements for zero-wait-state L2 cache.

Use Scenario: Temporary storage for variable-length Ethernet frames in Layer-2 switching ASICs.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer supporting concurrent ingress/egress DMA with burst-aligned access.

Use Value: 4-byte write select and global write enable allow efficient partial-frame updates without full-line overwrites.

Real-Time DSP Data Exchange BufferPCI-X Bridge Local Memory

Use Scenario: Shared memory between dual-core DSPs executing time-critical audio processing pipelines.

IC Role / Device Role / Timing Role: Synchronous dual-port-like interface using ADSP/ADSC to separate master/slave access arbitration.

Use Value: Separate processor/controller strobes enable deterministic latency for time-sliced data exchange across cores.

Use Scenario: Local frame buffer in PCI-X-to-PCI bridge chips handling graphics or video streaming traffic.

IC Role / Device Role / Timing Role: Burst-capable memory mapped into PCI-X address space, accessed via ADSC-driven controller-side bursts.

Use Value: 2.5V I/O compatibility matches PCI-X 2.5V signaling; ZZ sleep reduces idle power during low-traffic periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV25636A-166TQLI256K × 36 organization, 3.3V-only I/O, no ZZ sleep mode, no MODE-selectable burstLacks interleaved burst support and sleep mode-unsuitable for Pentium legacy systems or power-constrained deploymentsSelect only when linear burst suffices and sleep mode is unnecessary; verify ADSP/ADSC timing compatibility
MT55LSD25636DZ-166:JSame density and speed, but uses DDR interface with differential clocks and no ADSP/ADSC strobesRequires DDR controller interface-not compatible with legacy synchronous bus architectures using single-ended strobesChoose only for new DDR-based designs; incompatible drop-in replacement due to fundamental interface mismatch

Compared with IS61LV25636A-166TQLI and MT55LSD25636DZ-166:J, the CY7C1346H-166AXCT uniquely combines Pentium-interleaved burst support, asynchronous ZZ sleep, and dual-address-strobe flexibility-making it irreplaceable in legacy x86 cache subsystems where timing and control signal compatibility are non-negotiable.

Availability

CY7C1346H-166AXCT is available at Aetrix Electronics and suitable for Intel Pentium-based industrial controllers, high-speed network packet buffers, real-time DSP data exchange systems, and PCI-X bridge local memory applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1346H-166AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

The CY7C1346H belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-mode cache and buffer applications in x86-compatible and custom high-throughput embedded systems.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst address sequence: tied to GND for linear burst, or left floating/VDD for Intel Pentium interleaved burst. It is a static strap pin-must be fixed at power-up and remain unchanged during operation. Internal pull-up ensures default interleaved behavior if unconnected, eliminating need for external biasing in most Pentium designs.

How does the ZZ sleep mode interact with ongoing memory accesses?

Asserting ZZ HIGH places the device in sleep mode after two clock cycles, but pending accesses initiated before ZZ assertion are not guaranteed to complete. The device must be fully deselected (CE1/CE2/CE3 inactive) prior to entering sleep. Recovery requires 2 clock cycles after ZZ returns LOW, and CE1/CE2/CE3 must remain inactive during tZZREC to avoid undefined behavior.

Can ADSP and ADSC be used simultaneously, and what happens if both are asserted?

No-ADSP and ADSC are mutually exclusive. When both are asserted LOW, only ADSP is recognized and ADSC is ignored. This priority ensures deterministic address capture in mixed-processor/controller environments. ADSP is also ignored if CE1 is HIGH, enforcing chip-select gating before strobe evaluation.

What is the timing relationship between ADV and burst address advancement?

ADV must be asserted LOW synchronously with the rising edge of CLK to increment the internal 2-bit burst counter. Each ADV assertion advances to the next address in the selected burst sequence (interleaved or linear). ADV is sampled only during active burst cycles-no effect during single-access or deselected states-and requires no additional setup/hold beyond standard CLK timing.

CY7C1346H-166AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
100-LQFP
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
2Mbit
Memory Organization:
64K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1346H-166AXCT FAQ

1.How can I place an order for CY7C1346H-166AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1346H-166AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1346H-166AXCT reliable?

The price and inventory of CY7C1346H-166AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1346H-166AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1346H-166AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1346H-166AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1346H-166AXCT?

CY7C1346H-166AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1346H-166AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1346H-166AXCT?

For technical support, including CY7C1346H-166AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1346H-166AXCT requirements.

6.How does Aetrix verify that CY7C1346H-166AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1346H-166AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1346H-166AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1346H-166AXCT?

All CY7C1346H-166AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1346H-166AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1346H-166AXCT part is unused and in its original packaging.

Return procedure for CY7C1346H-166AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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