Cypress Semiconductor Corp CY7C1414AV18-200BZI
- Part No.:
- CY7C1414AV18-200BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1414AV18-200BZI.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1414AV18 from Cypress Semiconductor is a 1M × 36-bit, 36-Mbit QDR-II™ SRAM with synchronous pipelined architecture, dual independent read/write ports, 200 MHz operation (500 MT/s DDR), and 1.8 V core / 1.4–1.8 V I/O supply. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.
For engineers reviewing the CY7C1414AV18 datasheet, CY7C1414AV18 pinout, CY7C1414AV18 application, or CY7C1414AV18 equivalent, key selection criteria include its 19-bit address bus, 36-bit bidirectional data interface, BWS[3:0] byte write control, DLL-enabled timing accuracy, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.
Technical Context
The CY7C1414AV18 implements QDR-II architecture with physically separate read and write data paths-Q[35:0] outputs and D[35:0] inputs-eliminating bus turnaround delays. Its 2-word burst transfers occur on every rising edge of K/K (write) and C/C (read) clocks, enabling full-duplex 500 MT/s throughput at 200 MHz clock frequency.
Internal synchronization uses input registers clocked by K/K for addresses, RPS/WPS, and BWS signals, and output registers clocked by C/C for Q[35:0] and echo clocks CQ/CQ. The integrated Delay Lock Loop (DLL) aligns output data to echo clocks, ensuring ±50 ps setup/hold margin at 500 MT/s under JEDEC HSTL Class I specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1M × 36-bit (512K × 36 per internal array), total 36 Mbit capacity |
| Maximum Clock Frequency | 200 MHz - supports 500 MT/s DDR data rate on both read and write ports |
| Core Supply Voltage | VDD = 1.8 V ± 0.1 V - defines minimum operating voltage for internal logic and array stability |
| I/O Supply Range | VDDQ = 1.4 V to 1.8 V - sets HSTL output drive strength and input threshold reference |
| Burst Length | 2-word - delivers two consecutive 36-bit words per access, minimizing address overhead |
| Write Select Granularity | BWS[3:0] - enables independent 9-bit byte writes across all 36 data bits |
| Timing Control | DLL + echo clocks (CQ/CQ) - eliminates board-level skew between data and capture clocks |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant lead-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | 36-bit parallel data sampled on rising edge of K clock; ignored when WPS deasserted |
| Q[35:0] | Synchronous read data output | 36-bit parallel data driven on rising edges of C/C clocks; tri-stated when RPS deasserted |
| A[18:0] | Multiplexed address input | 19-bit address latched separately on K (read) and K (write) rising edges |
| RPS / WPS | Active-low port select | Controls read/write port activation; sampled synchronously on K/K rising edges |
| BWS[3:0] | Byte write enable | Four independent active-low signals controlling 9-bit byte writes across D[35:0] |
| C / C, K / K | Differential clock inputs | Four dedicated clocks: K/K for write sync, C/C for read output timing and deskew |
| CQ / CQ | Output echo clocks | Free-running copies of C/C, aligned to Q[35:0] edges for reliable controller capture |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune output driver impedance to 0.2 × RQ |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates bus turnaround latency and contention-enables true full-duplex memory access |
| 2-Word DDR Burst Architecture | Delivers 72 bits per cycle (36-bit × 2) at 500 MT/s, doubling effective bandwidth vs. single-data-rate |
| Delay Lock Loop (DLL) | Compensates for process/voltage/temperature drift to maintain <±50 ps data-to-clock alignment |
| HSTL Class I Compatible I/O | Supports 1.4–1.8 V VDDQ with programmable drive strength for signal integrity on >100 mm traces |
| JTAG 1149.1 Test Access | Enables boundary-scan testing of interconnects without requiring functional memory access |
Applications
| Network Packet Buffering | High-Speed Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G Ethernet line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffer between SERDES PHY and traffic manager ASIC. Use Value: Concurrent read/write at 500 MT/s sustains line-rate forwarding without head-of-line blocking. | Use Scenario: Interconnecting crosspoint switch controllers and scheduler units in modular chassis switches. IC Role / Device Role / Timing Role: Shared memory resource accessed simultaneously by multiple scheduling engines for cell queuing. Use Value: 36-bit wide interface reduces address cycles per cell; DLL ensures deterministic latency across temperature. |
| Telecom Baseband Processing | Test Equipment Pattern Memory |
Use Scenario: Holding channelized time-slot data in 3G/4G LTE baseband processors during symbol interleaving. IC Role / Device Role / Timing Role: Synchronous burst memory synchronized to FPGA fabric clocks for real-time FFT windowing. Use Value: 2-word burst matches typical FFT bin grouping; BWS[3:0] allows selective update of sub-channel buffers. | Use Scenario: Storing high-resolution stimulus/response vectors in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-throughput memory staging data to high-speed DACs and capturing responses from ADCs. Use Value: 165-ball FBGA footprint supports dense routing; echo clocks simplify timing closure at 500 MT/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10PF | 36-Mbit QDR-II+ (not QDR-II); supports 250 MHz (600 MT/s); requires different DLL initialization sequence | Higher speed but tighter setup/hold on CQ; not drop-in compatible due to changed BWS mapping and TDO behavior | Select only if system design accommodates QDR-II+ timing model and JTAG state machine differences |
| ISSI IS61WV102436B | 1M × 36-bit SyncBurst SRAM; 166 MHz max; no DLL; single-ended clocks only | Lacks echo clocks and DLL-requires careful board-level skew management; lower power but reduced timing margin | Prefer for cost-sensitive, lower-speed systems where 333 MT/s suffices and layout constraints limit differential routing |
Compared with IDT72T3615L10PF and ISSI IS61WV102436B, the CY7C1414AV18 provides optimal balance of 500 MT/s throughput, DLL-based timing robustness, and mature QDR-II ecosystem support-making it preferred for telecom infrastructure where deterministic latency and interoperability with legacy FPGA IP are critical.
Availability
CY7C1414AV18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric memory, telecom baseband processing, and test equipment pattern memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1414AV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems.
The QDR-II SRAM product line targets high-speed networking and signal processing applications demanding deterministic latency, concurrent access, and DDR bandwidth without bus turnaround penalties.
FAQ
What is the function of the ZQ pin on CY7C1414AV18?
The ZQ pin calibrates output driver impedance to match the system data bus. When connected to a precision resistor (RQ) to ground, it sets Q[35:0], CQ, and CQ output impedance to 0.2 × RQ. Direct connection to VDDQ enables minimum impedance mode. It must never be left floating or tied to VSS.
Can CY7C1414AV18 operate with only a single clock domain?
Yes-the device supports single-clock mode where K and K are tied together, and C and C are tied together. In this configuration, Q[35:0] and CQ/CQ are driven from K, eliminating need for differential clock routing, though deskew capability is lost and timing margins tighten.
How does the BWS[3:0] signal map to the D[35:0] data bus?
BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Each active-low signal enables writing of its corresponding 9-bit byte during a write cycle; deselected bytes retain prior contents.
Is the DOFF pin required for normal operation?
No-DOFF is optional. When pulled HIGH (to VDD), the internal DLL remains enabled for precise data-to-clock alignment. Pulling DOFF LOW disables the DLL, reverting to fixed-delay output timing with reduced timing margin and increased PVT sensitivity.
CY7C1414AV18-200BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1414AV18-200BZI FAQ
1.How can I place an order for CY7C1414AV18-200BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1414AV18-200BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1414AV18-200BZI reliable?
The price and inventory of CY7C1414AV18-200BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1414AV18-200BZI is usually 5 days.
3.What payment methods are accepted for CY7C1414AV18-200BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1414AV18-200BZI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1414AV18-200BZI?
CY7C1414AV18-200BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1414AV18-200BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1414AV18-200BZI?
For technical support, including CY7C1414AV18-200BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1414AV18-200BZI requirements.
6.How does Aetrix verify that CY7C1414AV18-200BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1414AV18-200BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1414AV18-200BZI meets industry standards.
7.What is the process for return or replacement of CY7C1414AV18-200BZI?
All CY7C1414AV18-200BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1414AV18-200BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1414AV18-200BZI part is unused and in its original packaging.
Return procedure for CY7C1414AV18-200BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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