Cypress Semiconductor Corp CY7C1415AV18-250BZC
- Part No.:
- CY7C1415AV18-250BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1415AV18-250BZC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,602
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Product details
Overview
CY7C1415AV18 from Cypress Semiconductor is a 1M × 36-bit, 36-Mbit QDR-II SRAM with separate read/write ports, 250 MHz clock operation (600 Mbps DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements synchronous pipelined burst reads/writes with four-word bursts per access and supports depth expansion via port selects in high-bandwidth networking line cards.
For engineers reviewing the CY7C1415AV18 datasheet, CY7C1415AV18 pinout, CY7C1415AV18 application, or CY7C1415AV18 equivalent, key selection criteria include its dual-clock DDR timing architecture, echo clock (CQ/CQ) support for skew compensation, HSTL-compatible I/O, JTAG 1149.1 testability, and 165-ball FBGA package compatibility with high-speed memory subsystems.
Technical Context
The CY7C1415AV18 uses QDR-II architecture with fully independent read and write ports sharing a single multiplexed address bus. Address latching occurs on alternating rising edges of K/K clocks, enabling concurrent read/write operations without bus turnaround.
It employs a Delay Lock Loop (DLL) for precise data placement, echo clocks (CQ/CQ) referenced to C/C for receiver deskewing, and variable-drive HSTL output buffers. Write operations are internally self-timed and synchronized to K/K, while read data is clocked out on C/C with programmable impedance tuning via ZQ.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1M × 36-bit (36 Mbit total); enables 144-bit wide data burst per access cycle |
| Maximum Clock Frequency | 250 MHz (K/K input); supports 500 MT/s effective throughput per port |
| Data Rate | 600 Mbps DDR (300 MHz × 2 transitions); delivers 21.6 GB/s aggregate bandwidth |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interface voltage matching to FPGA/ASIC I/O banks |
| Burst Length | 4-word burst (36-bit words); reduces address bus toggling frequency by 4× vs. single-word access |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm); compatible with standard high-density PCB routing and thermal management |
| JTAG Support | IEEE 1149.1 compliant TAP; enables boundary-scan testing and in-system debug of memory interconnects |
Pinout & Package
165-ball Fine-Pitch Ball Grid Array (FBGA) package, 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free option available).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edge of K/K; supports full 36-bit parallel writes per cycle |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of C/C; tri-stated when RPS is deasserted |
| RPS, WPS | Read/Write Port Select (active LOW) | Enables independent port activation; allows depth expansion without external logic |
| BWS[3:0] | Byte Write Select (active LOW) | Selects which 9-bit byte (D[8:0], D[17:9], D[26:18], D[35:27]) is written; preserves unselected bytes |
| K, K | Positive/negative input clocks | Control all synchronous inputs; rising edges latch addresses, commands, and data |
| C, C | Positive/negative output clocks | Source-synchronous read data strobes; minimize flight-time mismatch across memory channels |
| CQ, CQ | Echo clocks referenced to C/C | Free-running copies of C/C; simplify capture timing at controller side in high-speed systems |
| ZQ | Output impedance calibration input | Connects to external resistor to ground; tunes Q[35:0] and CQ/CQ driver impedance to match PCB trace Z₀ |
| DOFF | DLL disable control | Pulling LOW disables internal DLL; used for low-jitter or legacy timing modes |
| TCK/TMS/TDI/TDO | JTAG test access port | Supports IEEE 1149.1 boundary scan; verifies interconnect integrity before system boot |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data paths | Eliminates bus turnaround overhead and data contention; enables true concurrent access in packet buffering |
| 4-word burst architecture | Reduces address bus switching frequency by 75%; lowers EMI and simplifies controller address generation |
| Source-synchronous echo clocks (CQ/CQ) | Compensates for board-level flight time variation; enables reliable >500 MT/s read capture at FPGA receivers |
| HSTL-compatible I/O with ZQ calibration | Ensures signal integrity on long traces; matches typical FPGA memory interface termination schemes |
| Internally self-timed writes | Removes external write-enable timing constraints; simplifies controller timing closure for burst writes |
Applications
| High-Speed Packet Buffering | Network Processor Interface |
|---|---|
Use Scenario: Line-rate buffering of 10G/40G Ethernet packets in telecom switch fabric ASICs. IC Role / Device Role / Timing Role: Dedicated QDR-II SRAM providing zero-wait-state, concurrent read/write access to packet descriptor and payload memory pools. Use Value: 250 MHz clock + 4-word burst delivers 21.6 GB/s sustained bandwidth-sufficient for full-duplex 40G line-rate packet buffering with headroom. | Use Scenario: Shared memory between multi-core network processors and traffic manager units in carrier-grade routers. IC Role / Device Role / Timing Role: High-throughput, low-latency shared buffer supporting simultaneous packet classification, scheduling, and shaping operations. Use Value: Independent read/write ports eliminate arbitration stalls; echo clocks (CQ/CQ) enable deterministic <100 ps setup/hold margin at 600 Mbps DDR. |
| Baseband Processing Memory | Test Equipment Pattern Memory |
Use Scenario: Real-time symbol buffering in LTE/5G massive MIMO baseband units requiring deterministic latency. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM serving as channel estimation and precoding coefficient store with strict timing predictability. Use Value: DLL-controlled data placement ensures sub-cycle jitter; 1.8 V core reduces dynamic power vs. 2.5 V QDR-I alternatives in dense RF modules. | Use Scenario: High-fidelity waveform storage in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Burst-access memory holding multi-gigabit test vectors with precise edge-aligned output timing. Use Value: Source-synchronous C/C and CQ/CQ clocks guarantee <±50 ps data valid window at 600 Mbps-critical for sub-nanosecond timing accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1415AV18-250BZI | Same die, industrial temperature range (−40°C to +85°C) vs. commercial (0°C to +70°C); identical timing and pinout | Required for extended-temperature base station or industrial control deployments | Select BZI for operation beyond 70°C ambient; no design change needed |
| AS7C362000B-250BIN | 256K × 36-bit QDR-II+ SRAM; higher density per pin count but lower max frequency (200 MHz) and no ZQ calibration | Suitable for cost-sensitive designs where 17.3 GB/s bandwidth suffices and impedance tuning is handled externally | Choose for lower power or simpler layout; verify DLL and echo clock requirements are relaxed |
Compared with CY7C1415AV18-250BZC, the BZI variant extends thermal range without performance trade-off, while the AS7C362000B offers higher density but sacrifices 20% bandwidth and eliminates on-die impedance tuning-requiring external termination design effort.
Availability
CY7C1415AV18-250BZC is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfaces, baseband processing memory, and ATE pattern memory requiring stable component supply and long-term obsolescence planning.
Supply support for CY7C1415AV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for communications, industrial, and automotive markets, with emphasis on signal integrity and system-level timing robustness.
The QDR-II SRAM product line targets high-throughput, low-latency memory subsystems in networking infrastructure-specifically engineered to replace asynchronous SRAM and simplify DDR-based controller design with deterministic timing.
FAQ
What is the function of the ZQ pin on CY7C1415AV18-250BZC?
The ZQ pin calibrates the output driver impedance of Q[35:0] and echo clocks CQ/CQ to match the system data bus characteristic impedance. It must be connected to a precision 240 Ω resistor to ground (setting output Z₀ ≈ 48 Ω) or directly to VDDQ for minimum impedance mode. Leaving ZQ floating or tied to GND violates specification and causes signal integrity failure.
Can CY7C1415AV18-250BZC operate with only a single clock (K) instead of differential K/K?
Yes-CY7C1415AV18-250BZC supports single-clock mode where K serves as both positive and negative clock input. In this configuration, C/C must also be driven single-ended, and echo clocks CQ/CQ derive from K. Setup/hold margins tighten slightly, and maximum frequency may reduce by ~10% versus differential mode due to increased jitter sensitivity.
How does the 4-word burst architecture affect address bus utilization?
The 4-word burst reduces effective address bus toggling frequency by 4×: one address initiates four sequential 36-bit word transfers. For a 1M × 36-bit device, only 18 address lines (A[17:0]) are required-enabling compact routing and lower capacitive loading. The controller must generate only one address per burst, simplifying logic and reducing timing closure complexity.
What happens to Q[35:0] outputs when RPS is deasserted during an active read burst?
When RPS is deasserted, the current read burst completes normally, and Q[35:0] drivers are automatically tri-stated on the next rising edge of the C clock. No additional control signals or wait states are required. This behavior ensures clean bus release and prevents contention in multi-SRAM depth-expanded configurations.
CY7C1415AV18-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1415AV18-250BZC FAQ
1.How can I place an order for CY7C1415AV18-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1415AV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1415AV18-250BZC reliable?
The price and inventory of CY7C1415AV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1415AV18-250BZC is usually 5 days.
3.What payment methods are accepted for CY7C1415AV18-250BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1415AV18-250BZC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1415AV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1415AV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1415AV18-250BZC?
For technical support, including CY7C1415AV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1415AV18-250BZC requirements.
6.How does Aetrix verify that CY7C1415AV18-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1415AV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1415AV18-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1415AV18-250BZC?
All CY7C1415AV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1415AV18-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1415AV18-250BZC part is unused and in its original packaging.
Return procedure for CY7C1415AV18-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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