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Cypress Semiconductor Corp CY7C1415AV18-250BZC

Part No.:
CY7C1415AV18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1415AV18-250BZC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,602

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Product details

Overview

CY7C1415AV18 from Cypress Semiconductor is a 1M × 36-bit, 36-Mbit QDR-II SRAM with separate read/write ports, 250 MHz clock operation (600 Mbps DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements synchronous pipelined burst reads/writes with four-word bursts per access and supports depth expansion via port selects in high-bandwidth networking line cards.

For engineers reviewing the CY7C1415AV18 datasheet, CY7C1415AV18 pinout, CY7C1415AV18 application, or CY7C1415AV18 equivalent, key selection criteria include its dual-clock DDR timing architecture, echo clock (CQ/CQ) support for skew compensation, HSTL-compatible I/O, JTAG 1149.1 testability, and 165-ball FBGA package compatibility with high-speed memory subsystems.

Technical Context

The CY7C1415AV18 uses QDR-II architecture with fully independent read and write ports sharing a single multiplexed address bus. Address latching occurs on alternating rising edges of K/K clocks, enabling concurrent read/write operations without bus turnaround.

It employs a Delay Lock Loop (DLL) for precise data placement, echo clocks (CQ/CQ) referenced to C/C for receiver deskewing, and variable-drive HSTL output buffers. Write operations are internally self-timed and synchronized to K/K, while read data is clocked out on C/C with programmable impedance tuning via ZQ.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization1M × 36-bit (36 Mbit total); enables 144-bit wide data burst per access cycle
Maximum Clock Frequency250 MHz (K/K input); supports 500 MT/s effective throughput per port
Data Rate600 Mbps DDR (300 MHz × 2 transitions); delivers 21.6 GB/s aggregate bandwidth
Supply VoltagesVDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interface voltage matching to FPGA/ASIC I/O banks
Burst Length4-word burst (36-bit words); reduces address bus toggling frequency by 4× vs. single-word access
Package165-ball FBGA (15 × 17 × 1.4 mm); compatible with standard high-density PCB routing and thermal management
JTAG SupportIEEE 1149.1 compliant TAP; enables boundary-scan testing and in-system debug of memory interconnects

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA) package, 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free option available).

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputsLatched on rising edge of K/K; supports full 36-bit parallel writes per cycle
Q[35:0]Synchronous read data outputsDriven on rising edges of C/C; tri-stated when RPS is deasserted
RPS, WPSRead/Write Port Select (active LOW)Enables independent port activation; allows depth expansion without external logic
BWS[3:0]Byte Write Select (active LOW)Selects which 9-bit byte (D[8:0], D[17:9], D[26:18], D[35:27]) is written; preserves unselected bytes
K, KPositive/negative input clocksControl all synchronous inputs; rising edges latch addresses, commands, and data
C, CPositive/negative output clocksSource-synchronous read data strobes; minimize flight-time mismatch across memory channels
CQ, CQEcho clocks referenced to C/CFree-running copies of C/C; simplify capture timing at controller side in high-speed systems
ZQOutput impedance calibration inputConnects to external resistor to ground; tunes Q[35:0] and CQ/CQ driver impedance to match PCB trace Z₀
DOFFDLL disable controlPulling LOW disables internal DLL; used for low-jitter or legacy timing modes
TCK/TMS/TDI/TDOJTAG test access portSupports IEEE 1149.1 boundary scan; verifies interconnect integrity before system boot

Key Features

FeatureDesign Value
Separate read/write data pathsEliminates bus turnaround overhead and data contention; enables true concurrent access in packet buffering
4-word burst architectureReduces address bus switching frequency by 75%; lowers EMI and simplifies controller address generation
Source-synchronous echo clocks (CQ/CQ)Compensates for board-level flight time variation; enables reliable >500 MT/s read capture at FPGA receivers
HSTL-compatible I/O with ZQ calibrationEnsures signal integrity on long traces; matches typical FPGA memory interface termination schemes
Internally self-timed writesRemoves external write-enable timing constraints; simplifies controller timing closure for burst writes

Applications

High-Speed Packet BufferingNetwork Processor Interface

Use Scenario: Line-rate buffering of 10G/40G Ethernet packets in telecom switch fabric ASICs.

IC Role / Device Role / Timing Role: Dedicated QDR-II SRAM providing zero-wait-state, concurrent read/write access to packet descriptor and payload memory pools.

Use Value: 250 MHz clock + 4-word burst delivers 21.6 GB/s sustained bandwidth-sufficient for full-duplex 40G line-rate packet buffering with headroom.

Use Scenario: Shared memory between multi-core network processors and traffic manager units in carrier-grade routers.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared buffer supporting simultaneous packet classification, scheduling, and shaping operations.

Use Value: Independent read/write ports eliminate arbitration stalls; echo clocks (CQ/CQ) enable deterministic <100 ps setup/hold margin at 600 Mbps DDR.

Baseband Processing MemoryTest Equipment Pattern Memory

Use Scenario: Real-time symbol buffering in LTE/5G massive MIMO baseband units requiring deterministic latency.

IC Role / Device Role / Timing Role: Synchronous pipelined SRAM serving as channel estimation and precoding coefficient store with strict timing predictability.

Use Value: DLL-controlled data placement ensures sub-cycle jitter; 1.8 V core reduces dynamic power vs. 2.5 V QDR-I alternatives in dense RF modules.

Use Scenario: High-fidelity waveform storage in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Burst-access memory holding multi-gigabit test vectors with precise edge-aligned output timing.

Use Value: Source-synchronous C/C and CQ/CQ clocks guarantee <±50 ps data valid window at 600 Mbps-critical for sub-nanosecond timing accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1415AV18-250BZISame die, industrial temperature range (−40°C to +85°C) vs. commercial (0°C to +70°C); identical timing and pinoutRequired for extended-temperature base station or industrial control deploymentsSelect BZI for operation beyond 70°C ambient; no design change needed
AS7C362000B-250BIN256K × 36-bit QDR-II+ SRAM; higher density per pin count but lower max frequency (200 MHz) and no ZQ calibrationSuitable for cost-sensitive designs where 17.3 GB/s bandwidth suffices and impedance tuning is handled externallyChoose for lower power or simpler layout; verify DLL and echo clock requirements are relaxed

Compared with CY7C1415AV18-250BZC, the BZI variant extends thermal range without performance trade-off, while the AS7C362000B offers higher density but sacrifices 20% bandwidth and eliminates on-die impedance tuning-requiring external termination design effort.

Availability

CY7C1415AV18-250BZC is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfaces, baseband processing memory, and ATE pattern memory requiring stable component supply and long-term obsolescence planning.

Supply support for CY7C1415AV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for communications, industrial, and automotive markets, with emphasis on signal integrity and system-level timing robustness.

The QDR-II SRAM product line targets high-throughput, low-latency memory subsystems in networking infrastructure-specifically engineered to replace asynchronous SRAM and simplify DDR-based controller design with deterministic timing.

FAQ

What is the function of the ZQ pin on CY7C1415AV18-250BZC?

The ZQ pin calibrates the output driver impedance of Q[35:0] and echo clocks CQ/CQ to match the system data bus characteristic impedance. It must be connected to a precision 240 Ω resistor to ground (setting output Z₀ ≈ 48 Ω) or directly to VDDQ for minimum impedance mode. Leaving ZQ floating or tied to GND violates specification and causes signal integrity failure.

Can CY7C1415AV18-250BZC operate with only a single clock (K) instead of differential K/K?

Yes-CY7C1415AV18-250BZC supports single-clock mode where K serves as both positive and negative clock input. In this configuration, C/C must also be driven single-ended, and echo clocks CQ/CQ derive from K. Setup/hold margins tighten slightly, and maximum frequency may reduce by ~10% versus differential mode due to increased jitter sensitivity.

How does the 4-word burst architecture affect address bus utilization?

The 4-word burst reduces effective address bus toggling frequency by 4×: one address initiates four sequential 36-bit word transfers. For a 1M × 36-bit device, only 18 address lines (A[17:0]) are required-enabling compact routing and lower capacitive loading. The controller must generate only one address per burst, simplifying logic and reducing timing closure complexity.

What happens to Q[35:0] outputs when RPS is deasserted during an active read burst?

When RPS is deasserted, the current read burst completes normally, and Q[35:0] drivers are automatically tri-stated on the next rising edge of the C clock. No additional control signals or wait states are required. This behavior ensures clean bus release and prevents contention in multi-SRAM depth-expanded configurations.

CY7C1415AV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1415AV18-250BZC FAQ

1.How can I place an order for CY7C1415AV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1415AV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1415AV18-250BZC reliable?

The price and inventory of CY7C1415AV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1415AV18-250BZC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1415AV18-250BZC transactions.

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CY7C1415AV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1415AV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1415AV18-250BZC?

For technical support, including CY7C1415AV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1415AV18-250BZC requirements.

6.How does Aetrix verify that CY7C1415AV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1415AV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1415AV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1415AV18-250BZC?

All CY7C1415AV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1415AV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1415AV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1415AV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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