Infineon Technologies CY7C1470BV33-200BZCT
- Part No.:
- CY7C1470BV33-200BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV33-200BZCT.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1470BV33 from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom infrastructure. It operates at 200 MHz with zero wait states, supports 3.3 V core supply and 3.3 V/2.5 V I/O, and delivers 3.0 ns clock-to-output time. Its fully registered inputs/outputs enable true back-to-back read/write operations in packet buffering and cache applications.
For engineers reviewing the CY7C1470BV33 datasheet, CY7C1470BV33 pinout, CY7C1470BV33 application, or CY7C1470BV33 equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability via four BW pins, synchronous self-timed writes, JTAG boundary scan compliance, and compatibility with ZBT™-based system designs requiring deterministic latency.
Technical Context
The device implements a fully synchronous interface with all inputs and outputs registered on the rising edge of CLK, qualified by CEN. Address, control, and data are latched synchronously, eliminating asynchronous timing hazards and enabling predictable cycle-to-cycle operation.
NoBL™ logic eliminates bus latency by allowing consecutive read or write transfers on every clock cycle without pipeline stalls. Burst addressing is supported in linear or interleaved order, with ADV/LD controlling counter advance or address reload - critical for sequential packet header processing and DMA coherency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 200 MHz - enables 200 MT/s sustained throughput with no wait states |
| Access Time | 3.0 ns - defines minimum clock-to-output delay for timing-critical read paths |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing |
| Byte Write Pins | 4 independent BWa–BWd signals - allow granular 9-bit writes to DQa–DQd + parity groups |
| Power Consumption | 500 mA max operating current - sets thermal budget for dense memory modules |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testability in multilayer PCB assemblies |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous address input | Latched on rising CLK edge; selects one of 2M locations in 36-bit word space |
| BWa–BWd | Byte write select (active low) | Each controls 9-bit data/parity group (e.g., BWa → DQa/DQPa); enables partial writes without read-modify-write |
| CLK, CEN | Clock and clock enable | CEN masks CLK asynchronously; suspends operation while preserving internal state and extending previous cycle |
| CE1, CE2, CE3 | Chip enable group | Three-level decode (CE1↓, CE2↑, CE3↓) allows bank selection in multi-SRAM systems |
| OE | Asynchronous output enable | Tri-states DQs during write data phase and after deselection to prevent bus contention |
| ADV/LD | Burst address control | HIGH advances internal counter for sequential access; LOW loads new address - essential for burst-mode DMA |
| ZZ | Deep sleep mode | Reduces standby current to <120 µA by gating internal clocks and disabling I/O drivers |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ architecture | Enables unlimited back-to-back reads/writes with zero wait states - eliminates pipeline bubbles in high-speed packet engines |
| Four-byte write granularity | Independent BWa–BWd control over 36-bit data + 4 parity bits - avoids full-word writes when updating headers or metadata |
| Synchronous self-timed writes | On-chip write timing logic eliminates external write pulse width constraints - simplifies timing closure in FPGA-attached memory interfaces |
| Linear/interleaved burst modes | Configurable via MODE pin - matches legacy ZBT or modern DDR-style addressing requirements in switch fabric controllers |
| ZBT™ pin and functional compatibility | Drop-in replacement for ZBT SRAMs without layout or firmware changes - accelerates migration in field-upgradable systems |
Applications
| Packet Buffering in Ethernet Switches | Cache Memory in Telecom Baseband Processors |
|---|---|
Use Scenario: Storing ingress/egress packet queues in Layer 2/3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM serving as first-level packet buffer with deterministic 3.0 ns read response. Use Value: Enables 200 MT/s line-rate forwarding without stall cycles, directly supporting 10 GbE+ traffic shaping. | Use Scenario: Acting as instruction/data cache between DSP cores and shared memory in 4G/5G baseband units. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM providing zero-wait-state access to cached FIR filter coefficients and FFT twiddle tables. Use Value: Eliminates CPU stall penalties during burst-intensive signal processing, improving MAC-layer throughput by >18%. |
| PCI Express Endpoint Memory Mapping | Industrial Real-Time Control FIFO |
Use Scenario: Providing BAR-mapped memory for PCIe endpoint devices requiring fast host-accessible buffers. IC Role / Device Role / Timing Role: Memory-mapped SRAM with JTAG testability and burst-capable interface for reliable host-to-peripheral data exchange. Use Value: Supports PCIe Gen2 x4 link bandwidth with guaranteed 200 MHz synchronous access and IEEE 1149.1 test coverage. | Use Scenario: Serving as deterministic FIFO for motion controller feedback loops in servo drives. IC Role / Device Role / Timing Role: Fully registered SRAM ensuring jitter-free read/write timing under variable interrupt load in real-time OS environments. Use Value: Guarantees sub-10 ns timing margin for 50 kHz position update cycles, preventing encoder data loss during transient load spikes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1470BV33-250BZCT | 250 MHz speed grade; 3.0 ns access time vs. 3.4 ns at 167 MHz | Requires tighter PCB layout and higher-power supply stability; suited for 25 GbE line cards | Select when system clock exceeds 200 MHz and timing margin is constrained |
| IDT72V2115L10PF | 10 ns access time; 100 MHz max frequency; different pinout and burst protocol | Lacks NoBL™ zero-wait-state operation; requires additional handshake logic for back-to-back transfers | Consider only for legacy redesign where board re-spin is not feasible |
Compared with CY7C1470BV33-250BZCT, this 200 MHz variant offers relaxed timing closure and lower power; versus IDT72V2115L10PF, it delivers 2× throughput and eliminates external flow control, reducing FPGA logic utilization by ~12% in burst-heavy designs.
Availability
CY7C1470BV33 is available at Aetrix Electronics and suitable for packet buffering in Ethernet switches, cache memory in telecom baseband processors, and PCI Express endpoint memory mapping requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470BV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The CY7C1470BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory subsystems in network infrastructure and real-time embedded systems demanding zero-wait-state performance.
FAQ
What is the function of the ADV/LD pin in burst operations?
The ADV/LD pin controls the internal address counter behavior during burst accesses. When HIGH and CEN is active, it advances the counter to the next sequential address; when LOW, it loads a new starting address from A[17:0]. This dual-mode operation enables both continuous streaming (e.g., packet payload reads) and random-start bursts (e.g., descriptor table traversal) without external address generation logic.
Does CY7C1470BV33 support 2.5 V I/O signaling?
Yes - the device features a dedicated VDDQ supply pin that accepts either 3.3 V or 2.5 V, allowing direct interface with 2.5 V FPGAs or ASICs without level shifters. The I/O voltage is set independently of the 3.3 V VDD core supply, and all DC and AC specifications are guaranteed across both VDDQ levels per the datasheet's 2.5 V test conditions section.
How does the ZZ (Sleep Mode) pin reduce power consumption?
Asserting ZZ places the device into deep sleep mode by disabling internal clocks, gating output drivers, and powering down sense amplifiers and address decoders. This reduces standby current to ≤120 µA - a 99.8% reduction versus active standby - while preserving data integrity. Exit time from ZZ is 100 ns, enabling rapid resumption of traffic handling in bursty network applications.
Can CY7C1470BV33 be used as a drop-in replacement for ZBT SRAMs?
Yes - it is pin-compatible and functionally equivalent to ZBT devices, including identical control signal timing, burst protocols, and byte write behavior. No PCB or firmware changes are required. However, designers must verify that their system's OE timing aligns with CY7C1470BV33's asynchronous OE masking behavior during write cycles and deselect transitions.
CY7C1470BV33-200BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV33-200BZCT FAQ
1.How can I place an order for CY7C1470BV33-200BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV33-200BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV33-200BZCT reliable?
The price and inventory of CY7C1470BV33-200BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-200BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1470BV33-200BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV33-200BZCT transactions.
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CY7C1470BV33-200BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV33-200BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV33-200BZCT?
For technical support, including CY7C1470BV33-200BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-200BZCT requirements.
6.How does Aetrix verify that CY7C1470BV33-200BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV33-200BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-200BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1470BV33-200BZCT?
All CY7C1470BV33-200BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-200BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV33-200BZCT part is unused and in its original packaging.
Return procedure for CY7C1470BV33-200BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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