Cypress Semiconductor Corp CY7C1470BV33-200BZI
- Part No.:
- CY7C1470BV33-200BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV33-200BZI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1470BV33 from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in networking and telecom data paths. It operates at 200 MHz with zero wait states, supports 3.3 V core supply and 3.3 V/2.5 V I/O, and delivers 3.0 ns clock-to-output time. Its fully registered inputs/outputs enable true back-to-back read/write operations in packet switching and protocol acceleration systems.
For engineers reviewing the CY7C1470BV33 datasheet, CY7C1470BV33 pinout, CY7C1470BV33 application, or CY7C1470BV33 equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability via four BW pins (BWa–BWd), synchronous self-timed writes, and JEDEC-standard 100-pin TQFP packaging with JTAG boundary scan compliance.
Technical Context
The device implements a fully synchronous interface with all inputs and outputs registered on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers on every clock cycle without wait states.
It features three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank decoding, asynchronous OE for output tri-state control, and internal self-timed output buffer control that removes dependency on external OE timing. Burst addressing is supported in linear or interleaved order via ADV/LD.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 200 MHz - enables 200 MT/s sustained throughput with no wait states |
| Access Time | 3.0 ns - defines minimum clock-to-output delay for timing-critical datapaths |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing |
| Byte Write Control | 4 independent BW pins (BWa–BWd) - allows selective 9-bit writes to DQa–DQd and parity bits DQPa–DQPd |
| Power Consumption | 500 mA max operating current - sets thermal budget for dense memory subsystems |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - JEDEC-compliant, Pb-free option available |
Pinout & Package
Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm), JEDEC-standard, Pb-free compatible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous address input | 18-bit address bus sampled on rising CLK edge; selects one of 2M locations |
| BWa–BWd | Synchronous byte write select | Active-low controls 9-bit write segments: BWa→DQa/DQPa, BWb→DQb/DQPb, etc. |
| CLK | Primary clock input | Rising-edge-triggered master clock; gated by CEN for cycle suspension |
| CEN | Clock enable | Active-low; masks CLK without deselecting device, extending previous cycle |
| CE1, CE2, CE3 | Chip enable group | Three-signal decode: CE1/CE3 active-low, CE2 active-high - enables multi-bank memory mapping |
| OE | Asynchronous output enable | Active-low; tri-states outputs during write cycles and deselected states to prevent bus contention |
| DQa–DQd, DQPa–DQPd | Bidirectional data I/O | 36 data + 4 parity bits; direction controlled by OE and internal read/write state machine |
| ADV/LD | Burst address control | High = advance internal counter; Low = load new address - enables burst sequencing |
| ZZ | Deep sleep mode | Active-low entry into low-power standby (CMOS standby current ≤120 mA) |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) architecture | Enables unlimited back-to-back reads/writes with zero wait states - critical for line-rate packet buffering |
| Fully registered interface | All inputs and outputs synchronized to CLK rising edge - simplifies timing closure in FPGA-ASIC interconnects |
| Synchronous self-timed writes | On-chip write timing control eliminates external write pulse width constraints - improves signal integrity |
| JTAG IEEE 1149.1 boundary scan | Supports production test and board-level debug without additional test fixtures |
| Flexible burst ordering | Configurable linear or interleaved burst sequences - matches legacy ZBT and modern network processor requirements |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer interfaced to MAC controllers and traffic managers. Use Value: 200 MHz operation and zero-wait-state pipelining sustain full wire-speed throughput across 10 Gbps interfaces. |
Use Scenario: Frame reassembly and header processing in OC-192/STM-64 SONET/SDH line cards. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as descriptor memory and payload scratchpad in framer ASICs. Use Value: Byte-write capability (BWa–BWd) enables efficient partial updates of packet metadata without full-word overwrites. |
| Protocol Accelerator Cache | Industrial Real-Time Controller Memory |
|
Use Scenario: Offloading TCP/IP checksum, encryption, or deep packet inspection in security appliances. IC Role / Device Role / Timing Role: Burst-accessible memory for temporary storage of packet fragments during hardware-accelerated processing. Use Value: Interleaved burst mode aligns with DMA engines in NPU cores, reducing bus arbitration overhead by >40% vs. random access. |
Use Scenario: Deterministic data logging and motion control loop buffering in PLCs and CNC systems. IC Role / Device Role / Timing Role: Synchronous SRAM providing jitter-free memory access for real-time firmware executing on ARM Cortex-R cores. Use Value: CEN pin allows precise clock gating during idle cycles, cutting dynamic power by up to 65% while preserving state. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PF | 10 ns access time, 100 MHz max frequency, 3.3 V only (no 2.5 V I/O support) | Limited to lower-bandwidth industrial control; lacks burst mode and JTAG | Select when cost sensitivity outweighs speed and debug requirements |
| ISSI IS61WV102432BLL-10TLI | 10 ns access, 100 MHz, 3.3 V core/I/O, no byte write or NoBL architecture | Suitable for non-pipelined, burst-agnostic designs; higher latency per transaction | Prefer for legacy system upgrades where pinout compatibility is mandatory but performance headroom exists |
Compared with IDT72V2115L10PF and IS61WV102432BLL-10TLI, CY7C1470BV33 delivers 2× higher bandwidth, deterministic zero-wait-state operation, and integrated debug infrastructure - making it optimal for next-generation data plane architectures requiring sustained 200 MT/s throughput.
Availability
CY7C1470BV33 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, protocol accelerator cache, and industrial real-time controller memory requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1470BV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1470BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory subsystems in packet-switched infrastructure and real-time embedded systems.
FAQ
What is the function of the ADV/LD pin in CY7C1470BV33?
The ADV/LD pin controls burst address generation: when HIGH (with CEN active), it advances the internal address counter for sequential burst accesses; when LOW, it loads a new base address from A0–A17. This dual-mode operation enables both continuous streaming and random-start burst transfers without external address logic.
Does CY7C1470BV33 support 2.5 V I/O voltage levels?
Yes - the device supports 2.5 V I/O operation via the VDDQ supply pin, while maintaining 3.3 V core (VDD) operation. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, provided VDDQ is externally regulated to 2.5 V ±5% and meets AC timing specifications.
How does the ZZ (sleep) mode reduce power consumption?
Asserting ZZ LOW places the device in deep sleep mode, reducing CMOS standby current to ≤120 mA. During ZZ mode, all internal clocks and output drivers are disabled, but data retention is maintained as long as VDD and VDDQ remain within specification - enabling rapid wake-up (<5 ns) without data loss.
Can CY7C1470BV33 be used as a drop-in replacement for ZBT SRAMs?
Yes - it is pin-compatible and functionally equivalent to ZBT devices (e.g., IDT72V2115), supporting identical control protocols, burst orders, and timing models. However, its NoBL™ architecture provides superior throughput due to elimination of turnaround cycles between read/write transitions.
CY7C1470BV33-200BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV33-200BZI FAQ
1.How can I place an order for CY7C1470BV33-200BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV33-200BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV33-200BZI reliable?
The price and inventory of CY7C1470BV33-200BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-200BZI is usually 5 days.
3.What payment methods are accepted for CY7C1470BV33-200BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV33-200BZI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470BV33-200BZI?
CY7C1470BV33-200BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV33-200BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV33-200BZI?
For technical support, including CY7C1470BV33-200BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-200BZI requirements.
6.How does Aetrix verify that CY7C1470BV33-200BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV33-200BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-200BZI meets industry standards.
7.What is the process for return or replacement of CY7C1470BV33-200BZI?
All CY7C1470BV33-200BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-200BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV33-200BZI part is unused and in its original packaging.
Return procedure for CY7C1470BV33-200BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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