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Cypress Semiconductor Corp CY7C1470BV33-200BZI

Part No.:
CY7C1470BV33-200BZI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1470BV33-200BZI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,828

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Product details

Overview

CY7C1470BV33 from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in networking and telecom data paths. It operates at 200 MHz with zero wait states, supports 3.3 V core supply and 3.3 V/2.5 V I/O, and delivers 3.0 ns clock-to-output time. Its fully registered inputs/outputs enable true back-to-back read/write operations in packet switching and protocol acceleration systems.

For engineers reviewing the CY7C1470BV33 datasheet, CY7C1470BV33 pinout, CY7C1470BV33 application, or CY7C1470BV33 equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability via four BW pins (BWa–BWd), synchronous self-timed writes, and JEDEC-standard 100-pin TQFP packaging with JTAG boundary scan compliance.

Technical Context

The device implements a fully synchronous interface with all inputs and outputs registered on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers on every clock cycle without wait states.

It features three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank decoding, asynchronous OE for output tri-state control, and internal self-timed output buffer control that removes dependency on external OE timing. Burst addressing is supported in linear or interleaved order via ADV/LD.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 200 MHz - enables 200 MT/s sustained throughput with no wait states
Access Time 3.0 ns - defines minimum clock-to-output delay for timing-critical datapaths
Supply Voltage 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing
Byte Write Control 4 independent BW pins (BWa–BWd) - allows selective 9-bit writes to DQa–DQd and parity bits DQPa–DQPd
Power Consumption 500 mA max operating current - sets thermal budget for dense memory subsystems
Package 100-pin TQFP (14 × 20 × 1.4 mm) - JEDEC-compliant, Pb-free option available

Pinout & Package

Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm), JEDEC-standard, Pb-free compatible.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Synchronous address input 18-bit address bus sampled on rising CLK edge; selects one of 2M locations
BWa–BWd Synchronous byte write select Active-low controls 9-bit write segments: BWa→DQa/DQPa, BWb→DQb/DQPb, etc.
CLK Primary clock input Rising-edge-triggered master clock; gated by CEN for cycle suspension
CEN Clock enable Active-low; masks CLK without deselecting device, extending previous cycle
CE1, CE2, CE3 Chip enable group Three-signal decode: CE1/CE3 active-low, CE2 active-high - enables multi-bank memory mapping
OE Asynchronous output enable Active-low; tri-states outputs during write cycles and deselected states to prevent bus contention
DQa–DQd, DQPa–DQPd Bidirectional data I/O 36 data + 4 parity bits; direction controlled by OE and internal read/write state machine
ADV/LD Burst address control High = advance internal counter; Low = load new address - enables burst sequencing
ZZ Deep sleep mode Active-low entry into low-power standby (CMOS standby current ≤120 mA)

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) architecture Enables unlimited back-to-back reads/writes with zero wait states - critical for line-rate packet buffering
Fully registered interface All inputs and outputs synchronized to CLK rising edge - simplifies timing closure in FPGA-ASIC interconnects
Synchronous self-timed writes On-chip write timing control eliminates external write pulse width constraints - improves signal integrity
JTAG IEEE 1149.1 boundary scan Supports production test and board-level debug without additional test fixtures
Flexible burst ordering Configurable linear or interleaved burst sequences - matches legacy ZBT and modern network processor requirements

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer interfaced to MAC controllers and traffic managers.

Use Value: 200 MHz operation and zero-wait-state pipelining sustain full wire-speed throughput across 10 Gbps interfaces.

Use Scenario: Frame reassembly and header processing in OC-192/STM-64 SONET/SDH line cards.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as descriptor memory and payload scratchpad in framer ASICs.

Use Value: Byte-write capability (BWa–BWd) enables efficient partial updates of packet metadata without full-word overwrites.

Protocol Accelerator Cache Industrial Real-Time Controller Memory

Use Scenario: Offloading TCP/IP checksum, encryption, or deep packet inspection in security appliances.

IC Role / Device Role / Timing Role: Burst-accessible memory for temporary storage of packet fragments during hardware-accelerated processing.

Use Value: Interleaved burst mode aligns with DMA engines in NPU cores, reducing bus arbitration overhead by >40% vs. random access.

Use Scenario: Deterministic data logging and motion control loop buffering in PLCs and CNC systems.

IC Role / Device Role / Timing Role: Synchronous SRAM providing jitter-free memory access for real-time firmware executing on ARM Cortex-R cores.

Use Value: CEN pin allows precise clock gating during idle cycles, cutting dynamic power by up to 65% while preserving state.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L10PF 10 ns access time, 100 MHz max frequency, 3.3 V only (no 2.5 V I/O support) Limited to lower-bandwidth industrial control; lacks burst mode and JTAG Select when cost sensitivity outweighs speed and debug requirements
ISSI IS61WV102432BLL-10TLI 10 ns access, 100 MHz, 3.3 V core/I/O, no byte write or NoBL architecture Suitable for non-pipelined, burst-agnostic designs; higher latency per transaction Prefer for legacy system upgrades where pinout compatibility is mandatory but performance headroom exists

Compared with IDT72V2115L10PF and IS61WV102432BLL-10TLI, CY7C1470BV33 delivers 2× higher bandwidth, deterministic zero-wait-state operation, and integrated debug infrastructure - making it optimal for next-generation data plane architectures requiring sustained 200 MT/s throughput.

Availability

CY7C1470BV33 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, protocol accelerator cache, and industrial real-time controller memory requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1470BV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1470BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory subsystems in packet-switched infrastructure and real-time embedded systems.

FAQ

What is the function of the ADV/LD pin in CY7C1470BV33?

The ADV/LD pin controls burst address generation: when HIGH (with CEN active), it advances the internal address counter for sequential burst accesses; when LOW, it loads a new base address from A0–A17. This dual-mode operation enables both continuous streaming and random-start burst transfers without external address logic.

Does CY7C1470BV33 support 2.5 V I/O voltage levels?

Yes - the device supports 2.5 V I/O operation via the VDDQ supply pin, while maintaining 3.3 V core (VDD) operation. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, provided VDDQ is externally regulated to 2.5 V ±5% and meets AC timing specifications.

How does the ZZ (sleep) mode reduce power consumption?

Asserting ZZ LOW places the device in deep sleep mode, reducing CMOS standby current to ≤120 mA. During ZZ mode, all internal clocks and output drivers are disabled, but data retention is maintained as long as VDD and VDDQ remain within specification - enabling rapid wake-up (<5 ns) without data loss.

Can CY7C1470BV33 be used as a drop-in replacement for ZBT SRAMs?

Yes - it is pin-compatible and functionally equivalent to ZBT devices (e.g., IDT72V2115), supporting identical control protocols, burst orders, and timing models. However, its NoBL™ architecture provides superior throughput due to elimination of turnaround cycles between read/write transitions.

CY7C1470BV33-200BZI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1470BV33-200BZI FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1470BV33-200BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470BV33-200BZI reliable?

The price and inventory of CY7C1470BV33-200BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-200BZI is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV33-200BZI transactions.

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CY7C1470BV33-200BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470BV33-200BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470BV33-200BZI?

For technical support, including CY7C1470BV33-200BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-200BZI requirements.

6.How does Aetrix verify that CY7C1470BV33-200BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1470BV33-200BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-200BZI meets industry standards.

7.What is the process for return or replacement of CY7C1470BV33-200BZI?

All CY7C1470BV33-200BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-200BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470BV33-200BZI part is unused and in its original packaging.

Return procedure for CY7C1470BV33-200BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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