Cypress Semiconductor Corp CY7C1470V33-200AXC
- Part No.:
- CY7C1470V33-200AXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1470V33-200AXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1470V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit pipelined synchronous SRAM with NoBL™ architecture, configured as 2M × 36, supporting 200 MHz zero-wait-state bus operation, 3.3 V core supply, and 3.3 V/2.5 V I/O supply. It delivers 3.0 ns clock-to-output time and enables true back-to-back read/write transitions in high-throughput networking and packet buffering systems.
For engineers reviewing the CY7C1470V33 datasheet, CY7C1470V33 pinout, CY7C1470V33 application, or CY7C1470V33 equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed writes, byte write capability (BWa–BWd), JTAG boundary scan compliance, and TQFP/FBGA package compatibility for memory subsystems requiring deterministic latency.
Technical Context
This SRAM implements fully registered synchronous interfaces: all address, control, and data signals pass through input registers on the rising clock edge, while outputs are driven via output registers synchronized to the same edge. The NoBL™ logic eliminates bus latency by enabling consecutive read/write operations without wait states.
It supports three chip enables (CE1/CE2/CE3) for bank selection, asynchronous OE for output tristate control, and clock enable (CEN) to suspend operation. Write cycles use synchronous self-timed circuitry with byte-write select inputs (BWa–BWd), and includes ZZ sleep mode with external grounding requirement per errata.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 200 MHz - enables 200 MT/s sustained throughput with zero wait states |
| Access Time | 3.0 ns - defines minimum clock-to-output delay for timing-critical designs |
| Supply Voltage | 3.3 V core, 3.3 V/2.5 V I/O - supports mixed-voltage system interfacing |
| Power Consumption | 500 mA max operating current - sets thermal and PSU sizing requirements |
| Burst Mode | Linear or interleaved - determines address sequencing behavior during burst reads/writes |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testability in production and debug |
Pinout & Package
Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and non-Pb-free 165-ball FBGA (15 × 17 × 1.4 mm). Pin functions validated per Document Number 38-05289 Rev. *Y.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master timing reference for all synchronous operations |
| CEN | Clock enable | Active-high signal that suspends internal clocking and extends previous cycle |
| WE | Write enable | Controls initiation of synchronous write cycles when asserted with valid address/data |
| BWa–BWd | Byte write selects | Four independent 9-bit write masks enabling partial-word writes to 36-bit data bus |
| CE1/CE2/CE3 | Chip enables | Three-level decode for multi-bank memory expansion and hierarchical selection |
| OE | Output enable | Asynchronous control for output buffer tristate; avoids bus contention during writes |
| ZZ | Sleep mode | Must be externally grounded per errata (Pin 64 TQFP / Ball H11 FBGA) to enter low-power state |
| DQa–DQd | Data I/O (36-bit) | Four 9-bit bidirectional data groups supporting full-width or byte-aligned transfers |
| DQPa–DQPd | Data parity outputs | Four parity bits for error detection in mission-critical memory applications |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables unlimited true back-to-back read/write operations with no bus latency, increasing effective bandwidth in burst-intensive systems |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints; internal logic guarantees completion within defined clock cycles |
| Byte Write Capability (BWa–BWd) | Allows selective 9-bit updates within 36-bit word without read-modify-write overhead |
| Zero Wait State at 200 MHz | Guarantees deterministic 200 MT/s throughput without pipeline stalls or arbitration delays |
| JTAG Boundary Scan (IEEE 1149.1) | Supports automated PCB test coverage and interconnect verification in high-density layouts |
Applications
| Telecom Packet Buffering | Network Switch Fabric Memory |
|---|---|
Use Scenario: Temporary storage of variable-length Ethernet/IP packets in line-rate switching ASICs. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as ingress/egress packet buffer with deterministic 3.0 ns access. Use Value: Enables full-line-rate forwarding at 10 Gbps+ by eliminating wait states during rapid read/write alternation. | Use Scenario: Shared memory pool for header lookup results and forwarding table entries in modular switches. IC Role / Device Role / Timing Role: Pipelined SRAM providing concurrent access to multiple switch fabric ports via CE-banked addressing. Use Value: Sustains 200 MT/s throughput across interleaved bursts, reducing fabric arbitration bottlenecks. |
| Baseband Signal Processing | Industrial Real-Time Control Buffer |
Use Scenario: Intermediate data storage between FFT engines and channel encoders in LTE/5G baseband units. IC Role / Device Role / Timing Role: Burst-capable SRAM synchronizing multi-stage DSP pipelines with precise clock-aligned transfers. Use Value: Linear/interleaved burst modes match algorithmic dataflow patterns, minimizing DMA overhead. | Use Scenario: Deterministic I/O history logging and motion profile caching in CNC controllers and robotics drives. IC Role / Device Role / Timing Role: Low-jitter memory buffer ensuring sub-microsecond response to position feedback interrupts. Use Value: ZZ sleep mode + CEN suspension reduces idle power by >80% while preserving data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36120L10PFI | 10 ns access time, 100 MHz max frequency, 3.3 V only I/O, no ZZ sleep mode | Lacks sleep mode and 200 MHz performance; suited for cost-sensitive, lower-bandwidth control planes | Select when deterministic 10 ns latency suffices and JTAG test is not required |
| ISSI IS61WV102436B | 15 ns access, 66 MHz max, asynchronous interface, no burst or NoBL logic | Non-pipelined architecture limits throughput; requires external wait-state generation | Choose only for legacy designs where pin compatibility with older ZBT-style layouts is mandatory |
Compared with IDT72T36120L10PFI and IS61WV102436B, CY7C1470V33 uniquely delivers 200 MHz zero-wait-state operation with integrated NoBL™ logic and JTAG testability-critical for next-generation telecom and real-time embedded buffers.
Availability
CY7C1470V33 is available at Aetrix Electronics and suitable for telecom packet buffering, network switch fabric memory, and baseband signal processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for legacy Cypress memory devices.
This device belongs to the NoBL™ SRAM product line, engineered specifically for high-throughput, low-latency memory subsystems in networking, communications infrastructure, and real-time embedded systems.
FAQ
What is the required connection for the ZZ pin on CY7C1470V33?
The ZZ pin (Pin 64 in TQFP, Ball H11 in FBGA) must be externally connected to ground to enable proper sleep mode operation, as documented in Errata on page 35 of datasheet 38-05289 Rev. *Y. Leaving ZZ floating or pulling high disables sleep functionality and may cause undefined behavior during low-power states.
Does CY7C1470V33 support 2.5 V I/O voltage while operating at 3.3 V core?
Yes - the device features separate VDDQ pins for I/O supply, allowing operation at either 3.3 V or 2.5 V independent of the 3.3 V VDD core supply. This dual-voltage I/O capability enables seamless interfacing with both 3.3 V and 2.5 V logic families without level shifters.
How many byte write enable signals does CY7C1470V33 provide?
CY7C1470V33 provides four byte write enable signals: BWa, BWb, BWc, and BWd. Each controls a 9-bit segment of the 36-bit data bus, enabling granular 9-bit writes without requiring read-modify-write sequences or external masking logic.
Is CY7C1470V33 pin-compatible with standard ZBT SRAMs?
Yes - it is explicitly designed to be pin-compatible and functionally equivalent to industry-standard ZBT SRAMs, including identical pin assignments for CLK, CEN, WE, CE1–CE3, OE, and DQ buses. This allows drop-in replacement in existing ZBT-based designs with no layout changes required.
CY7C1470V33-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1470V33-200AXC FAQ
1.How can I place an order for CY7C1470V33-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470V33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470V33-200AXC reliable?
The price and inventory of CY7C1470V33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V33-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1470V33-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V33-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470V33-200AXC?
CY7C1470V33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470V33-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470V33-200AXC?
For technical support, including CY7C1470V33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V33-200AXC requirements.
6.How does Aetrix verify that CY7C1470V33-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1470V33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V33-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1470V33-200AXC?
All CY7C1470V33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V33-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470V33-200AXC part is unused and in its original packaging.
Return procedure for CY7C1470V33-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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