Infineon Technologies CY7C1472BV33-200BZCT
- Part No.:
- CY7C1472BV33-200BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1472BV33-200BZCT.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1472BV33-200BZCT from Cypress Semiconductor is a 3.3 V, 4M × 18 (72-Mbit) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput back-to-back read/write operations in networking and telecom data paths. It supports 200 MHz bus operation with zero wait states, features fully registered I/O, byte-write capability via BWa–BWb, and internal self-timed output control eliminating asynchronous OE timing constraints.
For engineers reviewing the CY7C1472BV33-200BZCT datasheet, CY7C1472BV33-200BZCT pinout, CY7C1472BV33-200BZCT application, or CY7C1472BV33-200BZCT equivalent, this device delivers deterministic 3.0 ns clock-to-output timing, synchronous burst (linear/interleaved), JTAG boundary scan compliance, and dual-voltage I/O support (3.3 V core / 2.5 V or 3.3 V I/O).
Technical Context
The CY7C1472BV33-200BZCT implements a fully synchronous, pipelined memory interface where all address, control, and data signals are registered on the rising edge of CLK. Its NoBL™ logic enables true back-to-back accesses without bus latency by decoupling address latching from data transfer timing.
It uses three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank selection, supports synchronous self-timed writes qualified by WE and BWa/BWb, and includes CEN to suspend clock recognition without deselection-preserving internal state across extended cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 configuration) |
| Max Clock Frequency | 200 MHz - enables sustained 200 MT/s throughput with no wait states |
| Access Time | 3.0 ns - guaranteed clock-to-output delay at 200 MHz operation |
| Supply Voltage | 3.3 V ± 0.3 V core; 2.5 V or 3.3 V I/O - supports mixed-voltage system interfacing |
| Operating Current | 500 mA max - defined at 200 MHz, full-speed operation |
| Standby Current | 120 mA max - measured in CMOS standby mode with all controls inactive |
| Burst Capability | Linear or interleaved - configurable via MODE pin for cache-line or sequential access patterns |
Pinout & Package
This device is packaged in a JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) with exposed thermal pad. Pin functions are fully synchronous except OE (asynchronous) and ZZ (sleep control).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:17] | Synchronous Address Input | 18-bit address sampled on rising CLK edge; defines 4M-word location in 18-bit address space |
| BWa, BWb | Synchronous Byte Write Select | Active-low controls write to DQa/DQPa and DQb/DQPb respectively; qualified with WE |
| CLK | Synchronous Clock Input | Rising-edge-triggered master clock; gated by CEN to extend previous cycle without deselection |
| CE1, CE3 | Synchronous Chip Enable (active-low) | Combined with CE2 (active-high) to enable device; all sampled on CLK rise |
| OE | Asynchronous Output Enable | Tri-states outputs when HIGH; masked during write data phase to prevent bus contention |
| ZZ | Deep Sleep Control | Asynchronous entry into low-power sleep mode; reduces current to <100 µA |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited consecutive read/write operations with zero wait states and full 200 MT/s utilization |
| Fully Registered I/O | All inputs and outputs synchronized to CLK rising edge-eliminates setup/hold timing violations in high-speed PCB layouts |
| Byte Write Select (BWa/BWb) | Independent 18-bit write masking per 9-bit byte pair-supports partial writes without read-modify-write overhead |
| JTAG Boundary Scan (IEEE 1149.1) | Full 165-pin FBGA-compatible test access port-enables board-level interconnect verification pre- and post-assembly |
| Dual-Voltage I/O Support | Configurable 2.5 V or 3.3 V I/O interface-simplifies integration with legacy 2.5 V ASICs or modern 3.3 V FPGAs |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in multi-gigabit line cards. IC Role / Device Role / Timing Role: High-bandwidth, low-latency packet buffer with deterministic 3.0 ns read latency and back-to-back write capability. Use Value: Enables full wire-speed buffering at 10 Gbps+ without packet loss due to memory access stalls. |
Use Scenario: Acting as shared buffer between ingress and egress traffic managers in enterprise switches. IC Role / Device Role / Timing Role: Synchronous burst SRAM providing concurrent read/write access for cut-through and store-and-forward switching modes. Use Value: Eliminates pipeline bubbles during rapid read/write transitions-critical for sub-100 ns switch latency targets. |
| Baseband Processing Units | High-Speed Test Equipment Memory |
|
Use Scenario: Temporary storage of OFDM symbol buffers in LTE/5G baseband processing chains. IC Role / Device Role / Timing Role: Pipelined SRAM interfaced directly to FPGA-based FFT/IFFT engines requiring aligned 18-bit word access. Use Value: Matches FPGA register timing with fully registered I/O-reduces timing closure effort and eliminates external latch requirements. |
Use Scenario: Pattern memory in automated test equipment (ATE) for high-speed digital IC validation. IC Role / Device Role / Timing Role: Deterministic-access memory delivering known-good vectors at 200 MHz with precise clock-aligned strobes. Use Value: Guarantees sub-ns timing repeatability across temperature and voltage-essential for nanosecond-level test margining. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PF | 10 ns access time, 100 MHz max frequency, 2M × 18 density, 3.3 V only I/O | Limited to lower bandwidth systems; lacks burst mode and JTAG support | Select when cost sensitivity outweighs speed requirement and JTAG is unnecessary |
| ISSI IS61WV102418B | 15 ns access, 66 MHz max, 1M × 18 density, no NoBL™ or burst capability | Targeted at legacy control-plane buffering-not suitable for data-path throughput demands | Choose only for non-critical, low-speed buffering where pin count and power are primary constraints |
Compared with IDT72V2115L10PF and ISSI IS61WV102418B, the CY7C1472BV33-200BZCT provides 2× higher bandwidth, deterministic burst access, and integrated JTAG-making it uniquely suited for real-time, high-throughput data-path buffering where latency predictability and testability are mandatory.
Availability
CY7C1472BV33-200BZCT is available at Aetrix Electronics and suitable for telecom infrastructure, network packet processing, and high-speed test equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1472BV33-200BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C147x series belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in telecom and networking equipment where deterministic timing and burst efficiency are critical.
FAQ
What is the function of the MODE pin on CY7C1472BV33-200BZCT?
The MODE pin selects burst order: LOW configures linear burst addressing, HIGH selects interleaved burst addressing. This setting determines how the internal address counter increments during burst reads/writes and must be stable before initiating burst sequences. It is sampled synchronously on the rising edge of CLK when CEN is active.
Can CY7C1472BV33-200BZCT operate with 2.5 V I/O while maintaining 3.3 V core supply?
Yes-the device supports independent 3.3 V core (VDD) and 2.5 V or 3.3 V I/O (VDDQ) supplies. When VDDQ = 2.5 V, input thresholds and output drive levels comply with LVTTL/2.5 V standards, enabling direct interfacing with 2.5 V FPGAs or ASICs without level shifters.
How does the ZZ (Sleep Mode) pin interact with CEN and chip enables?
ZZ is asynchronous and forces deep sleep regardless of CEN or CE states-reducing ICC to <100 µA. Unlike CEN (which pauses clock recognition but retains state), ZZ disables internal clocks and memory array biasing. All control pins become don't-care upon ZZ assertion, and recovery requires ZZ deassertion followed by two valid CLK cycles before normal operation resumes.
Is the CY7C1472BV33-200BZCT pin-compatible with CY7C1470BV33-200BZI?
No-CY7C1472BV33-200BZCT (4M × 18, 100-pin TQFP) and CY7C1470BV33-200BZI (2M × 36, same package) share functional equivalence and NoBL™ architecture but differ in byte-write pin mapping (BWa–BWb vs. BWa–BWd) and address width usage. Their pinouts are not interchangeable due to distinct DQ/DQP groupings and internal memory organization.
CY7C1472BV33-200BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1472BV33-200BZCT FAQ
1.How can I place an order for CY7C1472BV33-200BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1472BV33-200BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1472BV33-200BZCT reliable?
The price and inventory of CY7C1472BV33-200BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1472BV33-200BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1472BV33-200BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1472BV33-200BZCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1472BV33-200BZCT?
CY7C1472BV33-200BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1472BV33-200BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1472BV33-200BZCT?
For technical support, including CY7C1472BV33-200BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1472BV33-200BZCT requirements.
6.How does Aetrix verify that CY7C1472BV33-200BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1472BV33-200BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1472BV33-200BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1472BV33-200BZCT?
All CY7C1472BV33-200BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1472BV33-200BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1472BV33-200BZCT part is unused and in its original packaging.
Return procedure for CY7C1472BV33-200BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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