Infineon Technologies CY7C1474BV33-167BGCT
- Part No.:
- CY7C1474BV33-167BGCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 209-BGA
- Datasheet:
-
CY7C1474BV33-167BGCT.pdf
- Description:
- IC SRAM 72MBIT PAR 209FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,535
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Product details
Overview
CY7C1474BV33-167BGCT from Cypress Semiconductor is a 72-Mbit (1M × 72) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 167 MHz with zero wait states, supports synchronous self-timed writes, features 8-byte write capability via BWSa–BWh pins, and uses a single 3.3 V core supply with 3.3 V/2.5 V I/O support.
For engineers reviewing the CY7C1474BV33-167BGCT datasheet, CY7C1474BV33-167BGCT pinout, CY7C1474BV33-167BGCT application, or CY7C1474BV33-167BGCT equivalent, this device delivers deterministic 3.4 ns clock-to-output timing, IEEE 1149.1 JTAG boundary scan, burst read/write in linear or interleaved order, and ZZ sleep mode for low-power standby in backplane interface buffers and packet buffer memory systems.
Technical Context
The CY7C1474BV33-167BGCT implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling true back-to-back read/write operations without wait states.
It supports three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank selection, asynchronous OE for tri-state control, and CEN to suspend clock recognition without deselecting the device. Byte write select signals (BWSa–BWh) enable independent 8-bit write masking aligned to DQa–DQh and associated parity bits (DQPa–DQPh).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (1M × 72 organization), enabling full-word parallel access for packet header + payload buffering |
| Max Clock Frequency | 167 MHz - guarantees sustained 167 MT/s throughput with no cycle penalties |
| Access Time | 3.4 ns - defines maximum clock-to-output delay for timing-critical pipeline stages |
| Supply Voltage | Core: 3.3 V ± 0.3 V; I/O: 3.3 V or 2.5 V - supports mixed-voltage system interfacing |
| Operating Current | 450 mA max at 167 MHz - sets thermal and power delivery requirements for PCB layout |
| Standby Current | 120 mA max - determines quiescent power in low-activity buffer modes |
| Burst Capability | Linear or interleaved burst order - matches standard memory controller addressing patterns |
Pinout & Package
This device is packaged in a Pb-free/non-Pb-free 209-ball FBGA (14 × 22 × 1.76 mm, ball pitch 1.0 mm), optimized for high-density routing and thermal dissipation in multi-layer telecom PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | Latched on rising CLK edge; selects one of 1M addresses in 72-bit word space |
| BWSa–BWSh | Synchronous Byte Write Select | Active-low per-byte mask controlling DQa/DQPa through DQh/DQPh; qualified by WE |
| CLK | Primary Synchronous Clock | Rising-edge-triggered master clock; gated by CEN to extend cycles without deselection |
| CEN | Clock Enable | Active-low input that masks CLK while preserving internal state - enables power-aware clock gating |
| CE1, CE2, CE3 | Chip Enable Group | Three-input decode (CE1/L, CE2/H, CE3/L) allows fine-grained bank isolation in multi-SRAM systems |
| OE | Asynchronous Output Enable | Tri-states DQ/DQP during write sequences and after deselection to prevent bus contention |
| ZZ | Deep Sleep Control | Active-low signal reducing standby current beyond CEN suspension - used for system-level power management |
| DQa–DQh, DQPa–DQPh | Bidirectional Data I/O | 72-bit data + 8-bit parity interface; direction controlled synchronously by OE and access type |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables unlimited back-to-back reads/writes with zero wait states - eliminates pipeline stalls in burst-heavy traffic |
| Synchronous Self-Timed Writes | On-chip write timing control removes external write-pulse width constraints - simplifies controller design |
| IEEE 1149.1 JTAG Boundary Scan | Supports in-system test and interconnect verification without dedicated test pads - critical for high-reliability telecom boards |
| Byte Write Select (8 channels) | Independent 8-bit masking aligns with 72-bit word structure and parity bits - enables precise partial updates without read-modify-write |
| ZZ Sleep Mode | Reduces current below standard standby level - extends hold time during system idle periods without losing data |
Applications
| Packet Buffer Memory | Backplane Interface Buffer |
|---|---|
Use Scenario: Storing variable-length Ethernet/IP packets in switching ASIC co-processors. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory for ingress/egress packet queues with parity protection. Use Value: 167 MT/s sustained throughput and 3.4 ns clock-to-output meet sub-6 ns switch fabric timing budgets. |
Use Scenario: Interfacing between line card processors and high-speed SerDes PHYs in modular routers. IC Role / Device Role / Timing Role: Synchronous bridge memory absorbing bursty backplane traffic with deterministic latency. Use Value: Fully registered I/O and NoBL™ operation ensure jitter-free handoff across clock domains with no wait-state insertion. |
| Telecom Line Card FIFO | Network Processor Scratchpad |
Use Scenario: Implementing configurable depth FIFOs for TDM-to-packet conversion in VoIP gateways. IC Role / Device Role / Timing Role: Dual-port-like behavior via burst addressing and ADV/LD-controlled counter for seamless data streaming. Use Value: Linear/interleaved burst modes match TDM frame alignment; ZZ mode cuts power during silence intervals. |
Use Scenario: Providing fast local memory for network processors executing deep packet inspection firmware. IC Role / Device Role / Timing Role: Low-latency scratchpad supporting instruction/data fetches with byte-write granularity. Use Value: 8 independent BWS lines allow atomic update of metadata fields without disturbing adjacent packet context data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1472BV33-167BZI | 4M × 18 organization (72 Mbit), 165-ball FBGA, only 4 BWS inputs (BWa–BWb) | Limited to 18-bit data path; requires wider bus multiplexing for 72-bit use | Select when system uses 18-bit-wide memory controllers or needs smaller package footprint |
| IDT72V2135L10PF | 72-Mbit (1M × 72), 10 ns access, 209-ball FBGA, but lacks JTAG and ZZ mode | No boundary scan or deep sleep - reduces test coverage and power optimization capability | Select when legacy IDT ecosystem compatibility is required and JTAG/ZZ are not needed |
Compared with CY7C1474BV33-167BGCT, the CY7C1472BV33-167BZI trades byte-write flexibility and full 72-bit parallelism for smaller package and lower pin count, while the IDT72V2135L10PF sacrifices testability and ultra-low-power modes for proven field reliability in non-JTAG environments.
Availability
CY7C1474BV33-167BGCT is available at Aetrix Electronics and suitable for packet buffer memory, backplane interface buffering, and telecom line card FIFO applications requiring stable component supply across extended production lifecycles.
Supply support for CY7C1474BV33-167BGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial and communications infrastructure.
CY7C1474BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, zero-wait-state memory subsystems in carrier-grade networking equipment where throughput and timing predictability are non-negotiable.
FAQ
What is the function of the ADV/LD pin in CY7C1474BV33-167BGCT?
The ADV/LD pin controls the internal burst address counter: when HIGH and CEN is active, it advances the counter for sequential burst accesses; when LOW, it loads a new base address from A0–A17. This dual-mode operation enables both continuous streaming and random-access initiation without external address generation logic.
Does CY7C1474BV33-167BGCT support 2.5 V I/O operation with 3.3 V core supply?
Yes - the device has separate VDDQ pins for I/O voltage, allowing 2.5 V operation while maintaining 3.3 V on VDD for core logic. This is confirmed in the "Electrical Characteristics" table (Rev. *O, p.23) and enables direct interfacing with 2.5 V FPGAs or ASICs without level shifters.
How does the ZZ sleep mode differ from CEN-based clock suspension?
ZZ mode actively powers down internal circuitry beyond clock gating, reducing current to levels below standard standby (120 mA). CEN only masks CLK and extends the last cycle; ZZ disables dynamic logic blocks and leakage paths - making it essential for extended idle periods in energy-sensitive line cards.
Can CY7C1474BV33-167BGCT be used in place of CY7C1470BV33-167BGI?
No - although pin-compatible within the same FBGA family, CY7C1470BV33 is organized as 2M × 36 (72 Mbit) with only four BWS inputs (BWa–BWd), whereas CY7C1474BV33 is 1M × 72 with eight BWS inputs (BWSa–BWSh). The byte-write granularity and data bus mapping are fundamentally incompatible.
CY7C1474BV33-167BGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 209-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 1M x 72
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 209-FBGA (14x22)
CY7C1474BV33-167BGCT FAQ
1.How can I place an order for CY7C1474BV33-167BGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1474BV33-167BGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1474BV33-167BGCT reliable?
The price and inventory of CY7C1474BV33-167BGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474BV33-167BGCT is usually 5 days.
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CY7C1474BV33-167BGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1474BV33-167BGCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1474BV33-167BGCT?
For technical support, including CY7C1474BV33-167BGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474BV33-167BGCT requirements.
6.How does Aetrix verify that CY7C1474BV33-167BGCT is sourced from the original manufacturer or authorized distributors?
All CY7C1474BV33-167BGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474BV33-167BGCT meets industry standards.
7.What is the process for return or replacement of CY7C1474BV33-167BGCT?
All CY7C1474BV33-167BGCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474BV33-167BGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1474BV33-167BGCT part is unused and in its original packaging.
Return procedure for CY7C1474BV33-167BGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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