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Infineon Technologies CY7C1474BV33-200BGCT

Part No.:
CY7C1474BV33-200BGCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
209-BGA
Datasheet:
AetrixCY7C1474BV33-200BGCT.pdf
Description:
IC SRAM 72MBIT PARALLEL 209FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,249

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Product details

Overview

CY7C1474BV33-200BGCT from Cypress Semiconductor is a 72-Mbit (1M × 72) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in networking and telecom data paths. It operates at 200 MHz with zero wait states, supports synchronous self-timed writes, features 8-byte write select (BWSa–BWSh), and uses a single 3.3 V core supply with 3.3 V/2.5 V I/O compatibility.

For engineers reviewing the CY7C1474BV33-200BGCT datasheet, CY7C1474BV33-200BGCT pinout, CY7C1474BV33-200BGCT application, or CY7C1474BV33-200BGCT equivalent, key selection criteria include burst mode support (linear/interleaved), ZZ sleep mode capability, IEEE 1149.1 JTAG boundary scan compliance, and 209-ball FBGA package thermal performance in backplane interface designs.

Technical Context

This SRAM implements fully registered pipelined operation: all address, control, and data inputs pass through input registers on the rising edge of CLK; all outputs are clocked through output registers synchronized to CLK. The internal burst logic and address counter enable continuous linear or interleaved burst reads/writes without bus latency.

NoBL™ architecture eliminates asynchronous output enable timing constraints by using internally self-timed output buffer control. Write operations are managed by synchronous byte write enables (BWSa–BWSh) and WE, with on-chip self-timed write circuitry ensuring deterministic setup/hold margins across voltage and temperature.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (1M × 72 organization), enabling single-chip replacement for dual 36-bit ZBT SRAMs in high-pin-count packet buffer applications.
Maximum Clock Frequency 200 MHz - guarantees 5 ns clock period timing margin for synchronous back-to-back read/write cycles in OC-192 line card designs.
Access Time 3.0 ns - defines minimum clock-to-output delay for first word in burst read, critical for meeting 200 MHz system timing closure.
Supply Voltage 3.3 V ± 0.3 V core; 3.3 V/2.5 V I/O - allows direct interfacing with both LVTTL and SSTL-2 drivers without level shifters.
Byte Write Capability 8 independent byte write selects (BWSa–BWSh) - enables granular 8×8-bit partial writes without read-modify-write overhead in protocol header editing.
Power Consumption 500 mA max operating current at 200 MHz - informs thermal design for 209-ball FBGA in compact 1U switch chassis.
Sleep Mode ZZ pin-controlled deep sleep - reduces standby current to ≤120 mA, supporting power-gated buffer banks in energy-aware routers.

Pinout & Package

Package: 209-ball Fine-Pitch Ball Grid Array (FBGA), 14 mm × 22 mm × 1.76 mm, RoHS-compliant, with perimeter I/O and central power/ground ball array optimized for signal integrity and thermal dissipation.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Synchronous Address Input 18-bit address bus sampled on rising CLK edge; supports full 1M-word addressing for 72-bit words.
BWSa–BWSh Synchronous Byte Write Select Eight active-low signals controlling individual 8-bit lanes; BWSa → DQa/DQPa, BWSb → DQb/DQPb, ..., BWSh → DQh/DQPh.
CLK Primary Synchronous Clock Rising-edge-triggered master clock; qualified by CEN; drives all internal registers and burst counter.
CEN Clock Enable Active-low synchronous gate for CLK; suspends operation without deselecting device, extending previous cycle timing.
CE1, CE3 Synchronous Chip Enable (Low) Two active-low enables used with CE2 (active-high) for 3-signal bank selection in multi-SRAM systems.
OE Asynchronous Output Enable Active-low tri-state control; masked during write data phase to prevent bus contention on bidirectional DQ lines.
DQa–DQh, DQPa–DQPh Bidirectional Data I/O 72-bit data bus (8 × 9-bit groups); DQx carry data, DQP x carry parity bits for ECC-capable systems.
ZZ Deep Sleep Control Active-low entry into low-power ZZ mode; reduces ICC to ≤120 mA while preserving memory contents.
ADV/LD Address Counter Control High = advance internal burst counter; Low = load new address from A[17:0]; required after deselection to reinitialize access.
TCK/TMS/TDI/TDO JTAG Boundary Scan Interface IEEE 1149.1 compliant test access port; supports production testing and in-system debug of PCB interconnects.

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) Architecture Enables true back-to-back read/write operations with zero wait states, delivering sustained 200 MHz throughput in packet forwarding pipelines.
Full Synchronous Register Pipeline All inputs and outputs registered to CLK rising edge - eliminates hold-time violations and simplifies PCB layout timing closure.
Configurable Burst Order Supports both linear and interleaved burst addressing modes via MODE pin, matching legacy ZBT or modern network processor requirements.
On-Chip Self-Timed Writes Removes external write pulse width constraints - internal timing logic ensures reliable data capture across voltage/temperature corners.
Parity Support 72-bit data + 8-bit parity (DQPa–DQPh) enables single-bit error detection in mission-critical control plane memory buffers.

Applications

Telecom Line Cards Network Processor Buffers

Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface modules requiring deterministic latency and burst depth.

IC Role / Device Role / Timing Role: Primary data path SRAM providing 72-bit wide, 200 MHz synchronous access for ingress/egress FIFOs.

Use Value: NoBL™ architecture sustains 200 MHz back-to-back reads/writes, eliminating pipeline stalls and enabling 10 Gbps+ line rate processing.

Use Scenario: Temporary storage for packet headers and metadata in multi-core network processors with parallel instruction pipelines.

IC Role / Device Role / Timing Role: Low-latency, byte-granular write SRAM interfaced directly to NPU AXI or XLR buses for header rewrite acceleration.

Use Value: 8 independent BWS signals allow concurrent 8-byte updates to distinct header fields without read-modify-write cycles.

Switch Fabric Controllers Base Station Baseband Units

Use Scenario: Shared memory resource for crossbar arbitration logic and queue management in modular enterprise switches.

IC Role / Device Role / Timing Role: Dual-port accessible SRAM (via CE partitioning) serving as centralized descriptor table and statistics buffer.

Use Value: Three chip enables (CE1/CE2/CE3) support independent bank selection for concurrent CPU and ASIC access paths.

Use Scenario: Real-time buffering of OFDMA symbol data between digital front-end and channel estimation units in LTE/5G baseband.

IC Role / Device Role / Timing Role: High-reliability SRAM with ZZ sleep mode and parity for burst-mode symbol storage under dynamic traffic load.

Use Value: ZZ mode reduces idle power by >75% during low-traffic intervals while retaining data integrity for rapid wake-up response.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2135L10PF 10 ns access time, 100 MHz max frequency, 1M × 72, 208-pin PQFP package Lacks JTAG boundary scan, no ZZ sleep mode, lower speed grade limits use in 200 MHz systems Select when cost-sensitive industrial control requires proven long-lifecycle PQFP packaging over FBGA density.
ISSI IS61WV102472BLL-200B3 200 MHz, 72-Mbit (1M × 72), 209-ball FBGA, but no parity bits (DQPx) or IEEE 1149.1 support Missing parity and JTAG reduces suitability for telecom carrier-grade systems requiring field-testability and ECC Choose for non-ECC embedded applications where footprint and speed match but test/debug features are secondary.

Compared with IDT72V2135L10PF and IS61WV102472BLL-200B3, CY7C1474BV33-200BGCT uniquely combines 200 MHz operation, full 72-bit parity, and JTAG in a 209-ball FBGA-making it the only option meeting carrier-class reliability and testability requirements at full speed.

Availability

CY7C1474BV33-200BGCT is available at Aetrix Electronics and suitable for telecom line cards, network processor buffers, switch fabric controllers, and base station baseband units requiring stable component supply across extended product lifecycles.

Supply support for CY7C1474BV33-200BGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for communications and industrial markets.

CY7C1474BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth data buffering in telecom infrastructure and high-end networking equipment.

FAQ

What is the function of the ADV/LD pin in burst operations?

The ADV/LD pin controls the internal address counter: when HIGH and CEN is active, it advances the counter for sequential burst access; when LOW, it loads a new base address from A[17:0]. After device deselection, ADV/LD must be driven LOW before the next access to ensure correct address initialization and avoid burst wraparound errors.

Does CY7C1474BV33-200BGCT support both linear and interleaved burst modes?

Yes - burst order is selected by the MODE pin: MODE = LOW configures linear burst (incrementing address), MODE = HIGH selects interleaved burst (bit-swapped address sequence). This matches legacy ZBT SRAM behavior and aligns with network processor DMA engine requirements for cache-line-aligned transfers.

How does the ZZ (sleep) mode affect data retention and wake-up time?

In ZZ mode, core power is gated while VDD remains applied; data is retained indefinitely as long as VDD ≥ 2.7 V. Wake-up latency is one clock cycle after ZZ deassertion - no refresh or reinitialization is needed, enabling sub-microsecond resumption of full-speed operation in burst-intensive traffic patterns.

Are the DQP pins dedicated to parity, or can they be used as general-purpose I/O?

DQP pins (DQPa–DQPh) are hardwired parity outputs tied to their corresponding DQ byte groups and cannot be repurposed. During write cycles, parity is generated internally; during reads, DQP pins deliver computed parity bits - essential for ECC implementations in telecom control plane memory subsystems.

CY7C1474BV33-200BGCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
209-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
1M x 72
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
209-FBGA (14x22)

CY7C1474BV33-200BGCT FAQ

1.How can I place an order for CY7C1474BV33-200BGCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1474BV33-200BGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1474BV33-200BGCT reliable?

The price and inventory of CY7C1474BV33-200BGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474BV33-200BGCT is usually 5 days.

3.What payment methods are accepted for CY7C1474BV33-200BGCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1474BV33-200BGCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1474BV33-200BGCT?

CY7C1474BV33-200BGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1474BV33-200BGCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1474BV33-200BGCT?

For technical support, including CY7C1474BV33-200BGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474BV33-200BGCT requirements.

6.How does Aetrix verify that CY7C1474BV33-200BGCT is sourced from the original manufacturer or authorized distributors?

All CY7C1474BV33-200BGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474BV33-200BGCT meets industry standards.

7.What is the process for return or replacement of CY7C1474BV33-200BGCT?

All CY7C1474BV33-200BGCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474BV33-200BGCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1474BV33-200BGCT part is unused and in its original packaging.

Return procedure for CY7C1474BV33-200BGCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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