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Cypress Semiconductor Corp CY7C1515V18-167BZC

Part No.:
CY7C1515V18-167BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1515V18-167BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,599

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Product details

Overview

CY7C1515V18 from Cypress Semiconductor is a 72-Mbit QDR-II SRAM with 2M × 36 organization, designed for high-bandwidth packet buffering in networking ASICs and FPGA-based line cards. It supports concurrent read/write operations at 167 MHz clock frequency (334 MT/s DDR), delivers 24 Gbps peak bandwidth, uses separate K/K and C/C differential clock pairs for precise timing control, and features echo clocks (CQ/CQ) for simplified high-speed data capture.

For engineers reviewing the CY7C1515V18 datasheet, CY7C1515V18 pinout, CY7C1515V18 application, or CY7C1515V18 equivalent, key selection criteria include burst depth (4-word), x36 interface width, 1.8 V core / 1.4–1.8 V I/O supply range, DLL-enabled timing accuracy, and FBGA-165 package compatibility with high-density routing constraints.

Technical Context

The CY7C1515V18 implements QDR-II architecture with fully independent read and write ports sharing a single multiplexed address bus. Address latching occurs on alternating rising edges of K/K, enabling 4-word burst transfers per access without bus turnaround. Internal pipelining allows back-to-back read and write commands with zero cycle overlap penalty.

It uses HSTL Class I output drivers with programmable drive strength controlled via ZQ impedance calibration. The integrated Delay Lock Loop (DLL) aligns CQ/CQ echo clocks to output data edges within ±50 ps skew, and DOFF pin enables deterministic DLL bypass for legacy timing closure.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 bits), enabling compact 9 MB buffer storage per device in x36 configuration.
Max Clock Frequency 167 MHz input clock → 334 MT/s effective throughput, supporting OC-192/STM-64 packet processing rates.
Burst Length Fixed 4-word burst per access, reducing address bus toggling by 75% vs. single-word addressing.
Core & I/O Voltage VDD = 1.8 V ±0.1 V (core logic); VDDQ = 1.4–1.8 V (I/O), allowing interoperability with 1.5 V or 1.8 V FPGA I/O banks.
Package 165-ball FBGA (15 mm × 17 mm × 1.4 mm), compatible with standard 0.8 mm pitch PCB assembly processes.
Timing Architecture DLL-synchronized echo clocks (CQ/CQ) referenced to C/C, enabling source-synchronous data capture at 600 Mbps per data line.
Write Select Granularity Four active-low byte write selects (BWS[3:0]), permitting partial 36-bit word updates without read-modify-write cycles.

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA) package, 15 mm × 17 mm footprint, 1.4 mm height, RoHS-compliant, with 0.8 mm ball pitch and standard JEDEC MO-245AC mechanical outline.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data inputs 36-bit parallel data sampled on rising edge of K/K; supports full or partial writes via BWS[3:0].
Q[35:0] Synchronous read data outputs 36-bit parallel data driven on rising edges of C/C; tri-stated when RPS is deasserted.
A[18:0] Multiplexed address inputs 19-bit address bus shared by read/write ports; latched on alternating K/K edges for 2M-depth addressing.
RPS, WPS Active-low port select controls Independent gating of read/write paths; enables depth expansion using multiple devices without external logic.
BWS[3:0] Byte write enable signals Selects four 9-bit bytes within 36-bit word; each BWS controls D[8:0], D[17:9], D[26:18], D[35:27] respectively.
C, C, K, K Differential clock inputs K/K clocks all synchronous inputs; C/C clocks read outputs and synchronize echo clocks CQ/CQ.
CQ, CQ Source-synchronous echo clocks Free-running outputs aligned to Q[35:0] edges; used by controller for timing margin recovery in >300 MHz systems.
ZQ Output impedance calibration reference Connects to external 240 Ω resistor to ground to tune HSTL driver impedance to 48 Ω ±10%.
DOFF DLL disable control Pulling low disables internal DLL, reverting to fixed-delay output timing for backward compatibility.
TCK/TMS/TDI/TDO JTAG 1149.1 test interface Enables boundary scan testing and in-system programming of configuration registers.

Key Features

Feature Design Value
Concurrent Read/Write Ports Eliminates data bus turnaround delay, enabling sustained 100% bus utilization in full-duplex traffic scenarios.
4-Word Burst Architecture Reduces address bus frequency by 4× versus single-word mode, lowering EMI and simplifying PCB routing.
HSTL Class I Outputs with ZQ Calibration Ensures signal integrity across 600 Mbps DDR links while adapting to board trace impedance variations.
DLL-Synchronized Echo Clocks (CQ/CQ) Removes flight-time skew between clock and data paths, enabling reliable capture without complex receiver deskew logic.
Independent Byte Write Selects (BWS[3:0]) Permits atomic update of sub-word fields (e.g., header/metadata) without corrupting adjacent payload bytes.

Applications

Telecom Line Cards Network Processor Buffers

Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface modules handling 10 Gbps aggregate traffic.

IC Role / Device Role / Timing Role: Primary burst SRAM for ingress/egress FIFOs, interfacing directly with SerDes PHYs and traffic managers via x36 HSTL buses.

Use Value: 24 Gbps peak bandwidth and zero-turnaround architecture sustain full line-rate packet queuing with <10 ns latency variation.

Use Scenario: Deep packet inspection engines requiring temporary storage of fragmented IPv6 headers and TCP segments before reassembly.

IC Role / Device Role / Timing Role: Off-chip memory extension for NPU microengines, operating in lockstep with dual-clock domain controllers (K/K for writes, C/C for reads).

Use Value: Independent RPS/WPS enables simultaneous header read + payload write, accelerating multi-stage classification pipelines.

FPGA-Based Protocol Analyzers High-Frequency Trading Switches

Use Scenario: Real-time protocol decoding hardware capturing full-duplex Ethernet frames at wire speed for forensic analysis.

IC Role / Device Role / Timing Role: Dual-port buffer staging captured frames prior to PCIe transfer; CQ/CQ clocks feed FPGA IDELAYCTRL for adaptive sampling.

Use Value: Echo clock alignment reduces setup/hold uncertainty to ±35 ps, enabling >99.9% frame capture fidelity at 156.25 MHz sampling.

Use Scenario: Ultra-low-latency order matching switches where packet buffering must add <50 ns total delay from ingress to egress decision point.

IC Role / Device Role / Timing Role: Deterministic latency SRAM for time-critical order book snapshots, configured with DOFF=LOW to eliminate DLL jitter.

Use Value: Fixed-delay timing mode guarantees worst-case read latency of 3.2 ns (±0.3 ns), meeting sub-100 ns system budget.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10PA 36-Mbit (1M × 36), 100 MHz max clock, no DLL, LVDS I/O, 208-pin PQFP package Limited to lower bandwidth (7.2 Gbps) and lacks echo clocks; suited for cost-sensitive, non-ultra-high-speed designs Select when system clock ≤100 MHz and PCB space permits larger PQFP; avoid for >167 MHz timing closure.
ISSI IS61WV102436B 36-Mbit (1M × 36), asynchronous interface, 15 ns access, 100-pin TQFP, 3.3 V only No burst, no DDR, no separate ports - requires external arbitration logic and suffers bus turnaround penalties Only viable for legacy upgrades where QDR-II features are unused; not recommended for new high-speed designs.

Compared with IDT72T3615L10PA and IS61WV102436B, the CY7C1515V18 provides double the density, 2.4× higher bandwidth, DLL-controlled timing precision, and true concurrent access - making it the sole choice for OC-192+ and sub-100 ns latency systems.

Availability

CY7C1515V18 is available at Aetrix Electronics and suitable for telecom line cards, network processor buffers, FPGA-based protocol analyzers, and high-frequency trading switches requiring stable component supply across extended product lifecycles.

Supply support for CY7C1515V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR-II SRAM product line was engineered specifically for deterministic, low-latency, high-throughput buffering in packet-switched infrastructure - targeting ASIC/FPGA co-designs where bus efficiency and timing predictability are critical.

FAQ

What is the minimum supported VDDQ voltage for CY7C1515V18?

The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed and may cause HSTL output driver malfunction or timing violations. At 1.4 V, output swing is reduced to ~0.7 V, requiring receiver threshold adjustment.

Can CY7C1515V18 operate without connecting the ZQ pin?

No. ZQ must be connected either to a 240 Ω resistor to ground for calibrated 48 Ω output impedance or directly to VDDQ for minimum impedance mode. Leaving ZQ floating or tied to VSS violates Absolute Maximum Ratings and risks output driver damage.

How does the DOFF pin affect timing parameters?

When DOFF is pulled LOW, the internal DLL is disabled and output timing shifts to fixed-delay mode: tAC increases by 0.8 ns typical, and CQ/CQ phase relationship becomes static rather than dynamically aligned. All DLL-related specs (e.g., tDQSKEW) no longer apply.

Is CY7C1515V18 pin-compatible with other QDR-II family members like CY7C1513V18?

No. Although all share the same 165-ball FBGA footprint, pin functions differ significantly: CY7C1515V18 uses BWS[3:0] and A[18:0], while CY7C1513V18 uses BWS[1:0] and A[19:0]; Q[35:0] and D[35:0] occupy different ball locations. Direct substitution requires PCB redesign.

CY7C1515V18-167BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1515V18-167BZC FAQ

1.How can I place an order for CY7C1515V18-167BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1515V18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1515V18-167BZC reliable?

The price and inventory of CY7C1515V18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1515V18-167BZC is usually 5 days.

3.What payment methods are accepted for CY7C1515V18-167BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1515V18-167BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1515V18-167BZC?

CY7C1515V18-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1515V18-167BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1515V18-167BZC?

For technical support, including CY7C1515V18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1515V18-167BZC requirements.

6.How does Aetrix verify that CY7C1515V18-167BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1515V18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1515V18-167BZC meets industry standards.

7.What is the process for return or replacement of CY7C1515V18-167BZC?

All CY7C1515V18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1515V18-167BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1515V18-167BZC part is unused and in its original packaging.

Return procedure for CY7C1515V18-167BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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