Cypress Semiconductor Corp CY7C1525KV18-250BZXI

Overview

CY7C1525KV18-250BZXI from Cypress Semiconductor is an 8M × 9 (72-Mbit), 1.8V QDR® II SRAM with dual DDR read/write ports, 250 MHz clock operation (500 MT/s per port), 1.5-cycle read latency (DOFF = HIGH), and 165-ball FBGA (13 × 15 × 1.4 mm) packaging. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.

For engineers reviewing the CY7C1525KV18-250BZXI datasheet, CY7C1525KV18-250BZXI pinout, CY7C1525KV18-250BZXI application, or CY7C1525KV18-250BZXI equivalent, key selection criteria include burst depth (2-word), I/O voltage compatibility (VDDQ = 1.4–1.8 V), echo clock support (CQ/CQ), JTAG 1149.1 testability, and synchronous self-timed write timing.

Technical Context

The device implements a true dual-port architecture with physically separate read data outputs (Q[8:0]) and write data inputs (D[8:0]), eliminating bus turnaround overhead. Its PLL synchronizes K/K and C/C clocks to achieve precise 700 Mbps DDR data transfer on both ports at 250 MHz.

Address latching uses a single multiplexed A[22:0] bus sampled on alternating rising edges of K/K; port select signals (WPS, RPS) enable independent depth expansion. DOFF pin configures read latency between 1-cycle (LOW) and 1.5-cycle (HIGH) modes, directly affecting pipeline depth in switch fabric controllers.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with AS7C36256P-250BIN and IS61WV102418BLL-250BLI, CY7C1525KV18-250BZXI uniquely delivers true concurrent access, echo-clock–assisted timing closure, and programmable latency - essential for deterministic 10 Gbps+ data path design.

Availability

CY7C1525KV18-250BZXI is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, 4G baseband processing, and low-latency trading systems requiring stable component supply across extended production lifecycles.

Supply support for CY7C1525KV18-250BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.

The QDR® II SRAM product line targets high-speed packet processing systems requiring deterministic latency, concurrent access, and DDR bandwidth - optimized for ASIC/FPGA-based networking hardware.

FAQ

What is the function of the DOFF pin on CY7C1525KV18-250BZXI?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-speed layouts; when LOW, it selects 1-cycle latency for minimal delay in latency-critical paths. This setting is sampled at power-up and remains static during operation unless reconfigured via reset sequence.

Can CY7C1525KV18-250BZXI operate with only one clock domain (K-only)?

Yes - the device supports single-clock mode using only the K input clock for both read and write operations, with C derived internally. However, this disables echo clock (CQ) functionality and reduces timing margin; dual-clock mode (K/K and C/C) is required to achieve guaranteed 250 MHz DDR performance and full QDR II feature compliance.

How does the BWS0 signal control write operations in CY7C1525KV18-250BZXI?

BWS0 (Byte Write Select 0) is an active-low signal that gates the entire 9-bit D[8:0] bus during write cycles. When asserted, D[8:0] is written to memory; when deasserted, the corresponding 9-bit word remains unchanged. Unlike nibble-select in x8 variants, BWS0 in x9 configuration operates at full-word granularity due to the 9-bit data width.

Is the 165-ball FBGA package of CY7C1525KV18-250BZXI compatible with standard reflow profiles?

Yes - the Pb-free 165-ball FBGA package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260°C for 30 seconds. Thermal pad layout must follow Cypress's recommended 4 × 4 array of thermal vias under the center die pad, and solder mask defined pads are required to prevent bridging on 0.8 mm pitch balls.