Cypress Semiconductor Corp CY7C1911KV18-300BZC

Overview

CY7C1911KV18-300BZC from Cypress Semiconductor is a 2-Mbit × 9 (18-Mbit total) QDR® II SRAM with separate read/write ports, 300 MHz clock operation, 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers 600 MB/s bandwidth via DDR interfaces on both ports and supports 1.5-cycle read latency (DOFF = HIGH) in high-speed networking buffers and packet memory applications.

For engineers reviewing the CY7C1911KV18-300BZC datasheet, CY7C1911KV18-300BZC pinout, CY7C1911KV18-300BZC application, or CY7C1911KV18-300BZC equivalent, key selection criteria include burst depth (four-word), echo clock (CQ/CQ) timing margining, HSTL-compatible output drive, JTAG 1149.1 testability, and FBGA-165 package compatibility with high-density routing.

Technical Context

This QDR II SRAM implements fully independent synchronous read and write pipelines with dual-clock domains: K/K for address/data capture and C/C for output data staging. Its four-word burst architecture reduces effective address bus toggling by 75% versus single-word access, while internal self-timed writes eliminate external write-strobe coordination.

The device uses a 2M × 9 organization (19-bit address bus), supports byte-level write masking via BWS0, and integrates a PLL for precise data-eye alignment. Echo clocks (CQ/CQ) are phase-matched to output data edges, enabling reliable capture at 600 MB/s without complex board-level delay tuning.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, 1.0 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T3615L10PF and IS61WV102418BLL-10BLI, CY7C1911KV18-300BZC uniquely combines echo-clock timing margining, JTAG testability, and true concurrent read/write-critical for 10G+ packet processing systems requiring deterministic latency and production test coverage.

Availability

CY7C1911KV18-300BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and FPGA co-processor memory applications requiring stable component supply and long-term industrial availability.

Supply support for CY7C1911KV18-300BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

CY7C1911KV18 belongs to the QDR® II SRAM product line, engineered specifically for high-throughput, low-latency packet memory in networking infrastructure and baseband processing equipment.

FAQ

What is the function of the DOFF pin on CY7C1911KV18-300BZC?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for improved timing margin in high-speed FPGA interfaces; when LOW, it reverts to 1-cycle latency for maximum throughput. This is a static configuration pin set at power-up and not dynamically switchable during operation.

Can CY7C1911KV18-300BZC operate with a 1.5 V VDDQ supply?

Yes - the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V. This allows direct interfacing with 1.5 V FPGA I/O banks without level shifters. Core VDD remains fixed at 1.8 V ±0.1 V and must be supplied independently.

How does the echo clock (CQ) improve system timing margin?

CQ is a phase-aligned copy of the C clock output, routed alongside Q[8:0] data signals. At 600 MB/s, this eliminates the need for precise PCB trace length matching between clock and data, because the receiver uses CQ to sample Q - effectively making the data path self-timed relative to its own clock edge.

Is JTAG boundary scan supported on CY7C1911KV18-300BZC?

Yes - the device implements IEEE 1149.1 JTAG with TCK, TMS, TDI, and TDO pins. It supports instruction register loading, boundary scan register access, and IDCODE readback. JTAG can be disabled via fuse or strap if unused, but the hardware interface remains present.