Infineon Technologies CY8C20075-24LKXI

Overview

CY8C20075-24LKXI from Infineon Technologies is a capacitive sensing microcontroller with 8 KB flash, 1 KB SRAM, and integrated CapSense® analog front-end for touch-button and slider interfaces. It operates at up to 24 MHz, supports I²C and UART interfaces, and targets human-interface applications in consumer electronics and industrial HMI panels.

For engineers reviewing the CY8C20075-24LKXI datasheet, CY8C20075-24LKXI pinout, CY8C20075-24LKXI application, or CY8C20075-24LKXI equivalent, key selection criteria include CapSense channel count, low-power sleep current, on-chip voltage regulator capability, and QFN-16 package compatibility with automated assembly.

Technical Context

This device integrates a M8C 8-bit CPU core with dedicated hardware blocks for capacitive sensing signal acquisition, including IDACs, SC/CT blocks, and noise-immunity algorithms. It supports up to 16 self-capacitance or 8 mutual-capacitance sensors with automatic baseline tracking and shield driver support.

The MCU includes a programmable 24 MHz internal oscillator, power management unit enabling deep-sleep modes down to 1.3 µA, and configurable GPIOs with Schmitt-trigger inputs and open-drain outputs. All peripherals are register-mapped and controlled via the CPU without external components.

Key Specifications

Pinout & Package

16-pin QFN package (3 mm × 3 mm, 0.5 mm pitch) with exposed thermal pad (Pin 17). Designed for reflow-compatible PCB assembly and thermal dissipation in space-constrained HMI modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar capacitive sensing controller applications.

Compared with CY8C20075-24LKXI, CY8C201A0-24LKXI offers headroom for feature expansion, while MTCH101-I/ST reduces BOM count where MCU functionality is unnecessary - both require layout and firmware revalidation due to pin and register differences.

Availability

CY8C20075-24LKXI is available at Aetrix Electronics and suitable for smart appliance control panels, industrial HMI keypads, and medical device touch interfaces requiring stable component supply and long-term production continuity.

Supply support for CY8C20075-24LKXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and microcontroller solutions for industrial, automotive, and consumer markets.

CY8C20000 series targets cost-optimized, low-power capacitive sensing applications with integrated analog front-end and programmable MCU core - designed specifically for replacing mechanical switches in human-interface systems.

FAQ

What is the maximum number of touch buttons supported by CY8C20075-24LKXI?

The CY8C20075-24LKXI supports up to 16 self-capacitance buttons or 8 mutual-capacitance buttons. This is determined by its dedicated CapSense hardware block, which allocates one IDAC and SC/CT channel per sensor. Layout constraints and signal-to-noise ratio may reduce practical channel count in noisy environments.

Does CY8C20075-24LKXI require an external crystal?

No. The device uses an internal 24 MHz precision oscillator for CPU and CapSense timing. An external crystal is not required, though optional 32.768 kHz watch crystal support is available for RTC functions if enabled in firmware - not present in default configuration.

Can CY8C20075-24LKXI operate from a 3.3 V supply?

Yes. The device operates across 2.4 V to 5.5 V, making 3.3 V fully compliant. At 3.3 V, deep-sleep current is 1.3 µA typical, and CapSense sensitivity remains within datasheet specifications when electrode design follows Infineon's layout guidelines.

Is the exposed thermal pad on the QFN package electrically connected?

Yes. The exposed thermal pad (Pin 17) is internally connected to GND and must be soldered to a PCB thermal pad tied to the system ground plane. This connection is required for thermal performance and ESD robustness - floating or unconnected pads degrade CapSense noise immunity and reliability.