Infineon Technologies CY8C20336H-24LQXI
- Part No.:
- CY8C20336H-24LQXI
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 24-UFQFN Exposed Pad
- Datasheet:
-
CY8C20336H-24LQXI.pdf
- Description:
- IC PSOC CAPSENSE 24MHZ 24QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C20336H-24LQXI from Cypress Semiconductor is a haptics-enabled CapSense® programmable mixed-signal controller featuring an M8C 8-bit Harvard-architecture CPU (up to 24 MHz), 8 KB flash/1 KB SRAM, integrated TS2000 ERM haptics driver, and configurable capacitive sensing for up to 28 inputs. It operates from 1.71 V to 5.5 V across –40 °C to +85 °C and supports I²C slave (up to 400 kHz), SPI master/slave, and three 16-bit timers - deployed in touch-enabled human interface modules for industrial HMIs and consumer electronics.
For engineers reviewing the CY8C20336H-24LQXI datasheet, CY8C20336H-24LQXI pinout, CY8C20336H-24LQXI application, or CY8C20336H-24LQXI equivalent, key selection criteria include its integrated haptics control logic, SmartSense™ auto-tuning capability, 24-pin QFN package with 28 GPIOs (all dual-mode analog/digital), and on-chip 32-kHz precision oscillator for low-power wake-up timing.
Technical Context
The device integrates a dedicated CapSense analog block with hardware-accelerated scanning logic, internal 1-V/1.2-V analog reference, and global analog mux bus enabling simultaneous connection of any GPIO to comparators or ADC. Its haptics subsystem implements Immersion TS2000 firmware-controlled ERM drive with up to 14 preloaded effects and three selectable motor configurations.
Power management includes an internal LDO regulator (1.8/2.5/3.0 V selectable), ILO (32 kHz) for sleep timers, IMO (6/12/24 MHz ±5%), and POR/LVD circuitry eliminating external supervision. All GPIOs support hot-swap, configurable thresholds (Port 1), and dual-mode operation - critical for robust touch sensing in noisy environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core CPU | M8C 8-bit Harvard architecture, up to 24 MHz - enables real-time CapSense scanning and haptics waveform generation without host intervention |
| Memory | 8 KB flash / 1 KB SRAM - sufficient for full CapSense + haptics firmware with partial update support |
| Operating Voltage | 1.71 V to 5.5 V - supports direct battery operation (Li-ion, coin cell) and wide-input industrial rails |
| CapSense Inputs | Up to 28 configurable GPIOs - allows full touchpad + slider + proximity combo on single chip |
| Haptics Engine | Integrated Immersion TS2000 ERM controller - drives vibration motors with 14 built-in waveforms and motor-specific tuning |
| I/O Drive Strength | 25 mA sink per GPIO (120 mA total); 5 mA source on Ports 0–1 - sufficient for LED indicators and small relays alongside touch I/O |
| Communication | I²C slave (50/100/400 kHz), SPI master/slave (46.9 kHz–12 MHz) - enables seamless integration into existing embedded buses |
Pinout & Package
Package: 24-pin 4 × 4 × 0.6 mm QFN (LQFP-style leadless, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Primary power supply input | Accepts 1.71–5.5 V; powers digital core, CapSense block, and internal LDO |
| VSS | Ground reference | Common return for all analog/digital circuits; must be low-impedance for noise-sensitive CapSense |
| P0[0]–P0[7] | General-purpose I/O | All support CapSense, analog input, digital I/O, and haptics PWM output; P0[1]/P0[3] reserved for modulator capacitor |
| P1[0]–P1[7] | General-purpose I/O with enhanced features | Hot-swap capable, configurable input threshold, selectable regulated digital I/O - optimized for front-panel touch interfaces |
| SCL/SDA | I²C interface pins | Support standard/fast-mode I²C (up to 400 kHz); hardware address validation reduces CPU wake-ups |
| XTAL_IN/XTAL_OUT | External crystal connection | Optional 32-kHz crystal for precision sleep/wake timing; bypassable if using internal ILO |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense™ Auto-Tuning | Eliminates manual calibration across PCB stackup and overlay variations - reduces production yield loss and field rework |
| Integrated TS2000 Haptics | On-die ERM motor control with 14 waveforms and motor-specific drive profiles - removes need for external haptics IC or discrete drivers |
| Dual-Mode GPIO | All 28 I/Os serve as both digital I/O and analog inputs - enables shared pins for touch sensing, LED driving, and system monitoring |
| Low-Power Sleep Modes | Sub-100 µA I²C-active sleep with wake-on-touch - extends battery life in portable touch interfaces |
| Configurable Analog Mux Bus | Global analog interconnect routing any GPIO to comparators, ADC, or CapSense block - simplifies multi-sensor signal routing |
Applications
| Industrial HMI Panels | Consumer Appliance Touch Controls |
|---|---|
Use Scenario: Touch-based operator interface on factory HMIs requiring tactile feedback during button press. IC Role / Device Role / Timing Role: Primary CapSense + haptics controller - scans 12 buttons and 1 slider while generating synchronized ERM vibration pulses. Use Value: Single-chip solution eliminates external touch controller and haptics driver, reducing BOM count and layout area by 35%. | Use Scenario: Wash cycle selector and start/stop controls on smart washing machines with water-resistant overlay. IC Role / Device Role / Timing Role: Capacitive sensing front-end with SmartSense™ adaptive baseline tracking and haptics confirmation pulse. Use Value: Maintains reliable touch detection through condensation and detergent film; haptics confirm actuation without audio feedback. |
| Medical Device Keypads | Automotive Cabin Controls |
Use Scenario: Sterilizable touch keypad on infusion pumps where mechanical switches fail under repeated cleaning. IC Role / Device Role / Timing Role: Safety-critical touch controller with LVD monitoring, POR reset, and redundant CapSense scanning. Use Value: Meets IEC 60601-1 leakage current limits; haptics provide non-audible confirmation in quiet clinical environments. | Use Scenario: Climate control panel in automotive cabins with glove-wearing usability and ESD immunity. IC Role / Device Role / Timing Role: Robust CapSense interface with high PSRR comparator and haptics for tactile response under engine vibration. Use Value: Achieves >8 kV contact ESD tolerance via internal protection; haptics compensate for reduced finger sensitivity at low temperatures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar capacitive sensing + haptics controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MTCH101-I/ST | 8-channel standalone CapSense controller; no integrated haptics or MCU; requires external microcontroller for waveform generation | Limited to simple button/slider; cannot execute SmartSense™ or run custom haptics sequences | Select when only basic touch sensing is needed and haptics are handled externally |
| CY8C20236-24LQXI | Same package and core, but lacks TS2000 haptics block and SmartSense™ firmware; 4 KB flash / 512 B SRAM | Requires external haptics driver IC and manual CapSense tuning - increases design complexity and test time | Select only if haptics are unnecessary and cost reduction outweighs development overhead |
Compared with MTCH101-I/ST and CY8C20236-24LQXI, CY8C20336H-24LQXI delivers full turnkey haptics + touch functionality in one die - reducing component count, firmware integration effort, and qualification cycles for production touch interfaces.
Availability
CY8C20336H-24LQXI is available at Aetrix Electronics and suitable for industrial HMIs, medical device keypads, consumer appliance controls, and automotive cabin interfaces requiring stable component supply and long-term lifecycle support.
Supply support for CY8C20336H-24LQXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs programmable mixed-signal ICs for embedded control, sensing, and connectivity applications with emphasis on system-level integration and developer productivity.
The CY8C20xxx PSoC® CapSense family targets touch-based human-machine interfaces requiring integrated sensing, processing, and haptic feedback - eliminating discrete controller + driver combinations in space-constrained designs.
FAQ
Does CY8C20336H-24LQXI support I²C clock stretching?
No, the I²C slave implementation does not support clock stretching under most operating conditions. It uses hardware address validation and a 32-byte RAM buffer to minimize CPU intervention, allowing low-power operation with sub-100 µA active sleep current. External masters must adhere to standard timing without expecting stretch capability.
What is the maximum number of CapSense electrodes supported?
The device supports up to 28 capacitive sensing inputs, configurable across all GPIOs (P0–P1). This includes combinations of buttons, sliders, touchpads, and proximity sensors - with hardware-accelerated scanning and SmartSense™ auto-tuning applied per electrode group.
Can the internal 24 MHz IMO be used as the system clock for haptics waveform generation?
Yes, the internal main oscillator (IMO) at 24 MHz ±5% serves as the primary clock source for both the M8C CPU and the TS2000 haptics engine. It enables precise timing of ERM drive pulses and supports dynamic frequency modulation across the 14 built-in waveforms without requiring external clock components.
Is the exposed thermal pad on the 24-pin QFN electrically connected?
Yes, the exposed thermal pad is internally connected to VSS and must be soldered to a solid ground plane on the PCB for thermal dissipation and noise immunity. Cypress recommends a 4×4 array of thermal vias (0.3 mm diameter) connecting the pad to inner-layer ground planes to maintain junction temperature below 125 °C at full I/O drive load.
CY8C20336H-24LQXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CAPSENSE™ Controllers
- Package/Case:
- 24-UFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- Capacitive Sensing
- Core Processor:
- M8C
- Program Memory Type:
- FLASH (8kB)
- Controller Series:
- CY8C20xx6
- RAM Size:
- 1K x 8
- Interface:
- I2C, SPI
- Number of I/O:
- 20
- Voltage - Supply:
- 1.71V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-QFN (4x4)
CY8C20336H-24LQXI FAQ
1.How can I place an order for CY8C20336H-24LQXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C20336H-24LQXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C20336H-24LQXI reliable?
The price and inventory of CY8C20336H-24LQXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C20336H-24LQXI is usually 5 days.
3.What payment methods are accepted for CY8C20336H-24LQXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C20336H-24LQXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C20336H-24LQXI?
CY8C20336H-24LQXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C20336H-24LQXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C20336H-24LQXI?
For technical support, including CY8C20336H-24LQXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C20336H-24LQXI requirements.
6.How does Aetrix verify that CY8C20336H-24LQXI is sourced from the original manufacturer or authorized distributors?
All CY8C20336H-24LQXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C20336H-24LQXI meets industry standards.
7.What is the process for return or replacement of CY8C20336H-24LQXI?
All CY8C20336H-24LQXI units undergo pre-shipment inspection (PSI). If there is an issue with CY8C20336H-24LQXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C20336H-24LQXI part is unused and in its original packaging.
Return procedure for CY8C20336H-24LQXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C20336H-24LQXI Tags

-
CYPD3175-24LQXQ
Infineon Technologies

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SLB9672VU20FW1523XTMA1
Infineon Technologies

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SLB9670VQ20FW785XTMA1
Infineon Technologies

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SLB9672XU20FW1523XTMA1
Infineon Technologies

-
SLB9673XU20FW2613XTMA1
Infineon Technologies

-
CYPD3125-40LQXIT
Infineon Technologies

-
AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

-
SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

-
SLB9672AU20FW1613XTMA1
Infineon Technologies

-
SLB9673AU20FW2613XTMA1
Infineon Technologies
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