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Infineon Technologies CY8C20466AS-24LQXI

Part No.:
CY8C20466AS-24LQXI
Manufacturer:
Infineon Technologies
Category:
Application Specific Microcontrollers
Package:
32-UFQFN Exposed Pad
Datasheet:
AetrixCY8C20466AS-24LQXI.pdf
Description:
IC CAPSENSE AP 32KB 32QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,657

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Product details

Overview

CY8C20466AS-24LQXI from Cypress Semiconductor is a haptics-enabled CapSense® programmable mixed-signal controller featuring an M8C 8-bit Harvard-architecture CPU (up to 24 MHz), 16 KB flash / 2 KB SRAM, integrated Immersion TS2000 ERM haptics driver, and configurable capacitive sensing for up to 28 GPIOs. It operates from 1.71 V to 5.5 V across –40 °C to +85 °C and supports I²C slave (up to 400 kHz), SPI master/slave, and three 16-bit timers - deployed in human-interface consumer electronics requiring touch + tactile feedback.

For engineers reviewing the CY8C20466AS-24LQXI datasheet, CY8C20466AS-24LQXI pinout, CY8C20466AS-24LQXI application, or CY8C20466AS-24LQXI equivalent, key selection criteria include CapSense scan resolution, haptics effect count (14 preloaded), GPIO sink/source drive capability (120 mA total sink, 20 mA total source), and QFN-24 package compatibility with 4 × 4 mm footprint.

Technical Context

The device integrates a dedicated CapSense analog block with hardware-accelerated scanning logic, internal 1-V/1.2-V analog reference, and SmartSense™ auto-tuning - enabling robust capacitive sensing without external components or manual calibration. Its analog mux bus connects all GPIOs to the CapSense comparator and ADC, supporting sliders, touchpads, and proximity detection via configurable IDAC-based charge-transfer measurement.

Haptics control is implemented via a dedicated TS2000-compatible engine driving ERM actuators with 14 built-in waveforms and selectable drive profiles. Clocking combines a ±5% 6/12/24 MHz IMO, 32-kHz ILO for sleep timing, and optional precision 32-kHz crystal input - enabling low-power active sensing and synchronized haptic response.

Key Specifications

ParameterValue and Actual Design Meaning
Core CPUM8C 8-bit Harvard architecture, up to 24 MHz (4 MIPS); enables real-time CapSense scanning and haptics waveform sequencing
Memory16 KB flash / 2 KB SRAM; supports partial updates and ISSP in-system programming for field firmware revision
CapSense InputsUp to 28 GPIOs configurable as buttons, sliders, or proximity sensors; hardware-accelerated scanning reduces CPU load
Haptics EngineImmersion TS2000-compatible controller with 14 preloaded ERM effects; eliminates need for external haptics IC
I/O Drive25 mA sink per GPIO (120 mA total), 5 mA source on ports 0–1; sufficient for direct LED drive and ERM biasing
Operating Voltage1.71 V to 5.5 V; supports single-supply operation across battery-powered and USB-powered devices
Temperature Range–40 °C to +85 °C; qualified for industrial and extended-consumer environments without derating

Pinout & Package

Package: 24-pin QFN (4 × 4 × 0.6 mm), lead-free, RoHS-compliant, exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower supply inputPrimary 1.71–5.5 V supply for digital core and analog resources; decoupling required at pin
VSSGround referenceDigital and analog ground return; tied to exposed thermal pad for thermal and noise performance
P0[0]–P0[7]General-purpose I/OConfigurable as CapSense inputs, digital I/O, or analog inputs; support hot-swap on port 1
P1[0]–P1[7]General-purpose I/OSame functionality as port 0; port 1 supports selectable I/O threshold and regulated digital output
SCL / SDAI²C interfaceOpen-drain bidirectional pins for 50/100/400 kHz I²C slave communication; hardware address validation
XTAL_IN / XTAL_OUTClock input/outputSupports optional 32-kHz crystal for precision timing; internal oscillator used if crystal omitted
RESETActive-low resetAsynchronous reset input; internally pulled up; compatible with pushbutton or supervisor IC assertion

Key Features

FeatureDesign Value
SmartSense™ Auto-TuningEliminates manual CapSense tuning across overlay thickness, material, and environmental variation - enables production-ready firmware without rework
Integrated Haptics ControllerDirect ERM actuator drive with 14 waveforms; removes external haptics IC and reduces BOM count by one component
Flexible Clock SystemIMO (6/12/24 MHz) + ILO (32 kHz) + optional crystal; allows dynamic clock scaling between active sensing and low-power sleep
Analog Mux BusConnects all 28 GPIOs to CapSense block, comparators, and ADC simultaneously; enables multi-touch and cross-capacitance measurements
Hot-Swap I/O on Port 1GPIOs tolerate live insertion/removal without latch-up; simplifies modular UI board replacement in field-serviceable devices

Applications

Smartphone Front PanelWearable Touch Interface

Use Scenario: Capacitive home button with vibration feedback on smartphone bezel.

IC Role / Device Role / Timing Role: CapSense controller scans button capacitance and triggers TS2000 haptics engine for 100-ms click effect synchronized to press event.

Use Value: Single-chip solution replaces discrete MCU + touch controller + haptics driver; reduces PCB area by 35% and eliminates inter-IC timing skew.

Use Scenario: Touch-sensitive wristband with gesture slider and tap feedback.

IC Role / Device Role / Timing Role: Scans 5-slider segments using IDAC-based delta-C measurement while concurrently driving ERM with waveform #7 for tap confirmation.

Use Value: Hardware-accelerated scanning completes full slider read in <12 ms; enables 60-Hz UI responsiveness with <5 µA average current in sleep mode.

Industrial Control PanelHome Appliance Keypad

Use Scenario: Glove-compatible stainless-steel keypad in factory environment.

IC Role / Device Role / Timing Role: Uses high-sensitivity CapSense configuration with SmartSense adaptive baseline to reject oil, moisture, and EMI from nearby motors.

Use Value: Maintains >99.5% touch detection reliability across –25 °C to +70 °C ambient; no recalibration needed after thermal cycling.

Use Scenario: Washable glass-topped oven control with proximity wake and button press haptics.

IC Role / Device Role / Timing Role: Proximity sensor (P0[3]) wakes device from deep sleep; button scan and haptics activation occur within 20 ms of wake.

Use Value: Achieves <15 µA average system current in standby; meets Energy Star Level VI standby power requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar capacitive sensing + haptics controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F072CBT6No integrated CapSense or haptics hardware; requires external touch controller and driver ICRequires additional BOM, layout space, and firmware integration effort for same functionalityPreferred only when existing STM32 ecosystem mandates reuse and external haptics IC is already qualified
ATtiny1616-MFRLacks dedicated CapSense block and haptics engine; relies on software-based sensing and PWM-driven ERMLower scan SNR, no SmartSense auto-tuning, and limited haptics waveform fidelityAcceptable for cost-sensitive low-channel-count designs where <10 ms scan latency and <95% noise immunity are acceptable

Compared with STM32F072CBT6 and ATtiny1616-MFR, CY8C20466AS-24LQXI delivers turnkey CapSense + haptics integration with hardware acceleration, reducing firmware development time by ~60% and eliminating two external ICs - critical for rapid prototyping and volume production of touch-enabled consumer devices.

Availability

CY8C20466AS-24LQXI is available at Aetrix Electronics and suitable for smartphone front panels, wearable touch interfaces, industrial control panels, and home appliance keypads requiring stable component supply and long-term lifecycle support.

Supply support for CY8C20466AS-24LQXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs programmable mixed-signal ICs for embedded human-interface and system-control applications, with focus on integration, low power, and ease of use.

CY8C20466AS-24LQXI belongs to the PSoC® 1 CapSense family, engineered specifically to consolidate capacitive touch sensing, haptics control, and microcontroller functions into a single chip for compact, cost-sensitive consumer and industrial UIs.

FAQ

What is the maximum number of simultaneous CapSense electrodes supported?

CY8C20466AS-24LQXI supports up to 28 GPIOs configurable as CapSense inputs. All 28 can be scanned in sequence using hardware-accelerated scanning logic; concurrent multi-electrode measurement is not supported, but sequential scan time for full 28-electrode array is under 15 ms at 24 MHz CPU speed with default settings.

Does this device support I²C master mode?

No. The CY8C20466AS-24LQXI implements I²C only as a slave device, supporting standard-mode (100 kHz) and fast-mode (400 kHz) operation with hardware address recognition. It does not include I²C master logic; external master (e.g., application processor) must initiate all transactions.

Can the haptics engine drive linear resonant actuators (LRAs)?

No. The integrated TS2000-compatible haptics controller is designed exclusively for eccentric rotating mass (ERM) actuators. It lacks the high-voltage, phase-controlled drive circuitry required for LRA operation. ERM drivers require only DC bias and PWM modulation - which this device provides natively.

Is SmartSense™ tuning data stored in nonvolatile memory?

Yes. SmartSense™ automatically calculates and stores optimal CapSense parameters (baseline, thresholds, IDAC values) in dedicated flash memory sectors during runtime calibration. These values persist across power cycles and are retained through ISSP firmware updates unless explicitly overwritten by new calibration.

CY8C20466AS-24LQXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CAPSENSE™ Controllers
Package/Case:
32-UFQFN Exposed Pad
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Applications:
Capacitive Sensing
Core Processor:
M8C
Program Memory Type:
FLASH (32kB)
Controller Series:
CY8C20xx6A
RAM Size:
2K x 8
Interface:
I2C, SPI
Number of I/O:
28
Voltage - Supply:
1.71V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5x5)

CY8C20466AS-24LQXI FAQ

1.How can I place an order for CY8C20466AS-24LQXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C20466AS-24LQXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C20466AS-24LQXI reliable?

The price and inventory of CY8C20466AS-24LQXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C20466AS-24LQXI is usually 5 days.

3.What payment methods are accepted for CY8C20466AS-24LQXI?

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CY8C20466AS-24LQXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C20466AS-24LQXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C20466AS-24LQXI?

For technical support, including CY8C20466AS-24LQXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C20466AS-24LQXI requirements.

6.How does Aetrix verify that CY8C20466AS-24LQXI is sourced from the original manufacturer or authorized distributors?

All CY8C20466AS-24LQXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C20466AS-24LQXI meets industry standards.

7.What is the process for return or replacement of CY8C20466AS-24LQXI?

All CY8C20466AS-24LQXI units undergo pre-shipment inspection (PSI). If there is an issue with CY8C20466AS-24LQXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C20466AS-24LQXI part is unused and in its original packaging.

Return procedure for CY8C20466AS-24LQXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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