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Infineon Technologies CY8C6144AZI-S4F62

Part No.:
CY8C6144AZI-S4F62
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP Exposed Pad
Datasheet:
AetrixCY8C6144AZI-S4F62.pdf
Description:
IC MCU 32BIT 256KB FLASH 64TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,253

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Product details

Overview

CY8C6144AZI-S4F62 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 61 microcontroller with 256 KB flash, 128 KB SRAM, integrated CAN FD, USB Full-Speed, and hardware cryptography acceleration-designed for secure, ultra-low-power IoT edge nodes requiring real-time sensor fusion and wireless coexistence.

For engineers reviewing the CY8C6144AZI-S4F62 datasheet, CY8C6144AZI-S4F62 pinout, CY8C6144AZI-S4F62 application, or CY8C6144AZI-S4F62 equivalent, this device supports concurrent BLE/Wi-Fi system control, capacitive touch + analog sensing in Deep Sleep (7 µA), and XIP execution from external QSPI Flash with on-the-fly encryption-key selection criteria for battery-powered industrial gateways and smart home hubs.

Technical Context

The CY8C6144AZI-S4F62 implements a tightly coupled dual-CPU architecture: the 150-MHz Cortex-M4F handles application processing and floating-point math, while the 100-MHz Cortex-M0+ is reserved exclusively for system-level functions including security boot, power management, and interrupt arbitration-no user application code runs on M0+.

Its programmable analog subsystem includes two synchronized 12-bit 2-Msps SAR ADCs with 16-channel sequencer and Deep Sleep operation, a 12-bit DAC with <2-µs settling time, and two low-power comparators active in Hibernate mode-enabling continuous sensor monitoring without CPU wake-up.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Arm Cortex-M4F (FP/MPU) + 100-MHz Cortex-M0+ (system-only)
Memory 256-KB application flash + 32-KB supervisory flash; 128-KB SRAM with retention granularity
Power Consumption 7 µA in Deep Sleep with 64-KB SRAM retention; on-chip DC-DC buck converter <1-µA quiescent current
Analog Peripherals Two 12-bit 2-Msps SAR ADCs (sync sampling, Deep Sleep capable); one 12-bit DAC (<2-µs settling)
Digital Interfaces One CAN FD block; six configurable SCBs (SPI/I2C/UART); USB Full-Speed device; QSPI/SMIF with XIP + encryption
Security Hardware crypto accelerator (AES/SHA/RSA/ECC/TRNG); authentication during boot; up to eight protection contexts
Capacitive Sensing CapSense™ CSD with SmartSense auto-tuning, liquid tolerance, and mutual/self-sensing support

Pinout & Package

This device is housed in an 80-pin TQFP package (12 mm × 12 mm, 0.5 mm pitch) with exposed thermal pad, supporting industrial temperature range (–40°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] GPIO Bank 0 Programmable drive modes, slew rates; two pins overvoltage-tolerant (OVT) up to 5.5 V
P1[0]–P1[7] GPIO Bank 1 Supports Smart I/O Boolean logic during System Deep Sleep; configurable as analog inputs or digital interfaces
USB_DP / USB_DM USB Full-Speed Interface Differential pair compliant with USB 2.0 specification; internal termination and PHY; no external components required
CAN_TX / CAN_RX CAN FD Transceiver Interface Dedicated differential pins for CAN FD physical layer; supports data rates up to 5 Mbps with flexible bit timing
QSPI_SCK / QSPI_SS / QSPI_IO0–IO3 Quad-SPI Memory Interface Direct connection to external QSPI Flash; enables Execute-In-Place (XIP) with 4-KB cache and hardware decryption
VDDA / VDDD / VBUS Power Supply Terminals VDDA (1.7–3.6 V analog), VDDD (1.7–3.6 V digital), VBUS (5 V tolerant for USB detection)

Key Features

Feature Design Value
Dual-CPU Power Gating User-selectable core voltage (0.9 V or 1.1 V) per CPU domain enables fine-grained dynamic voltage scaling for peak efficiency
Deep Sleep Analog Monitoring ADC, DAC, comparators, and CapSense™ operate autonomously in Deep Sleep-enabling wake-on-event without CPU intervention
Secure Boot & Runtime Protection ROM-based boot loader validates firmware signature using SHA-256; eFuse array stores keys and disables debug ports permanently
Programmable Digital Logic Smart I/O block (6 pins) performs Boolean operations (AND/OR/XOR) in Deep Sleep-replaces external glue logic for sensor preprocessing
Segment LCD Driver Drives up to 61 segments × 8 commons with built-in bias generation; operates in System Deep Sleep mode for ultra-low-power displays

Applications

Smart Home Hub Industrial Sensor Node

Use Scenario: Central controller aggregating Zigbee, BLE, and Wi-Fi traffic while managing local UI, security sensors, and energy monitoring.

IC Role / Device Role / Timing Role: Dual-core runtime coordinator: M4F processes protocol stacks and UI rendering; M0+ manages secure boot, power state transitions, and watchdog supervision.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life >1 year in battery-backed hubs; CAN FD enables wired fieldbus integration for HVAC or lighting control.

Use Scenario: Battery-powered vibration/temperature/pressure node deployed in remote machinery with 10-year maintenance cycles.

IC Role / Device Role / Timing Role: Autonomous sensor fusion engine: SAR ADCs sample multi-channel analog sensors synchronously; CapSense™ detects enclosure tampering; RTC triggers periodic wake-ups.

Use Value: On-chip DC-DC buck converter <1-µA quiescent current minimizes no-load loss; hardware TRNG and AES-128 enable zero-touch secure OTA updates over LoRaWAN.

Medical Wearable Automotive Body Control Module

Use Scenario: ECG/PPG patch with capacitive touch interface, motion sensing, and Bluetooth LE telemetry to cloud.

IC Role / Device Role / Timing Role: Real-time biosignal processor: M4F runs digital filters and feature extraction; ADCs operate in Deep Sleep with comparator-triggered wake-up on heartbeat detection.

Use Value: Integrated opamps and low-power comparators eliminate external signal conditioning; SmartSense auto-calibrates touch electrodes despite sweat or motion artifacts.

Use Scenario: Door module controlling window lift, mirror fold, seat position, and interior lighting with LIN/CAN communication.

IC Role / Device Role / Timing Role: Mixed-signal body controller: CAN FD handles high-speed bus commands; TCPWMs generate precise PWM for motor control; GPIOs drive relays and LEDs with programmable slew rate.

Use Value: Six configurable SCBs allow re-use across LIN (UART), diagnostics (I2C), and actuator feedback (SPI); OTP eFuse stores calibration data and VIN-specific configuration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RGV6 Single-core Cortex-M4 + Cortex-M0+ radio coprocessor; integrated 2.4 GHz BLE 5.0 radio; no CAN FD or QSPI XIP Better suited for BLE-centric endpoints; lacks industrial interface breadth (CAN, USB FS, segment LCD) Select when wireless connectivity dominates over wired fieldbus and external memory execution requirements
RA6M5G32FPKBE Single 200-MHz Cortex-M33 core; TrustZone security; no integrated CapSense™ or Smart I/O; 1 MB flash, 512 KB SRAM Higher compute throughput for RTOS-heavy applications; requires external touch controller and analog front-end Select when deterministic real-time performance and large code footprint outweigh need for autonomous analog/digital peripherals

Compared with STM32WB55RGV6 and RA6M5G32FPKBE, the CY8C6144AZI-S4F62 uniquely integrates CAN FD, USB FS, QSPI XIP with encryption, and hardware-accelerated CapSense™-making it optimal for mixed-interface, ultra-low-power, sensor-rich edge controllers where peripheral autonomy reduces host CPU load and BOM count.

Availability

CY8C6144AZI-S4F62 is available at Aetrix Electronics and suitable for smart home hubs, industrial sensor nodes, medical wearables, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY8C6144AZI-S4F62 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power systems, automotive ICs, and secure microcontrollers-with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.

The PSOC™ 6 family targets secure, low-power IoT endpoints-combining programmable analog/digital fabric with Arm dual-core MCUs to reduce external component count and accelerate development of certified edge devices.

FAQ

Does CY8C6144AZI-S4F62 support JTAG debugging?

Yes, it supports SWD and JTAG via the SWJ-DP interface using the 32-bit Silicon ID. The JTAG ID is derived from die revision, part number encoding ("E4B0"), and manufacturer ID ("069"). Debug access can be permanently disabled via eFuse programming to meet security certification requirements such as PSA Level 3 or SESIP.

What is the maximum operating frequency of the QSPI interface?

The QSPI/SMIF interface supports up to 320 Mbps throughput in quad mode, enabled by programmable clock dividers and phase-aligned sampling. This allows direct XIP execution from external Flash with minimal latency penalty, and the 4-KB dedicated cache further reduces effective access time during burst reads.

Can the Cortex-M0+ core execute user firmware?

No-the Cortex-M0+ core in CY8C6144AZI-S4F62 is reserved exclusively for system-level functions including secure boot, power management, interrupt routing, and cryptographic key handling. All application firmware must run on the Cortex-M4F core; M0+ firmware is preloaded in ROM and not modifiable.

Is the CapSense™ subsystem compatible with wet or gloved operation?

Yes, the Capacitive Sigma-Delta (CSD) implementation supports liquid-tolerant sensing and proximity detection through hardware-based shield drivers and SmartSense auto-tuning. It dynamically adjusts scan parameters to maintain SNR >60 dB even under water droplets or thick gloves-validated per IEC 61000-4-6 and IP67 test conditions.

CY8C6144AZI-S4F62 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP Exposed Pad
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
150MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6144AZI-S4F62 FAQ

1.How can I place an order for CY8C6144AZI-S4F62 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6144AZI-S4F62 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6144AZI-S4F62 reliable?

The price and inventory of CY8C6144AZI-S4F62 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6144AZI-S4F62 is usually 5 days.

3.What payment methods are accepted for CY8C6144AZI-S4F62?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6144AZI-S4F62 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6144AZI-S4F62?

CY8C6144AZI-S4F62 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6144AZI-S4F62 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6144AZI-S4F62?

For technical support, including CY8C6144AZI-S4F62 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6144AZI-S4F62 requirements.

6.How does Aetrix verify that CY8C6144AZI-S4F62 is sourced from the original manufacturer or authorized distributors?

All CY8C6144AZI-S4F62 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6144AZI-S4F62 meets industry standards.

7.What is the process for return or replacement of CY8C6144AZI-S4F62?

All CY8C6144AZI-S4F62 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6144AZI-S4F62, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6144AZI-S4F62 part is unused and in its original packaging.

Return procedure for CY8C6144AZI-S4F62:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6144AZI-S4F62 Tags

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