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Infineon Technologies CYUSB2014-BZXCT

Part No.:
CYUSB2014-BZXCT
Manufacturer:
Infineon Technologies
Category:
Application Specific Microcontrollers
Package:
121-TFBGA
Datasheet:
AetrixCYUSB2014-BZXCT.pdf
Description:
IC EZ-USB BRIDGE FX3 3.0 121BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,886

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Product details

Overview

CYUSB2014-BZXCT from Infineon is a USB 3.2 Gen 1 and USB 2.0-compliant SuperSpeed USB controller IC featuring an ARM926EJ-S core running at 200 MHz, 256 KB embedded SRAM, and a programmable 100-MHz GPIF II interface supporting 8-/16-/24-/32-bit data buses. It integrates USB 3.2 Gen 1 (5-Gbps) PHY, HS-OTG host/peripheral capability, and dual-power-domain I/O (1.2 V core, 1.8–3.3 V I/O). Used in high-bandwidth video capture cards and industrial cameras for real-time sensor-to-PC streaming.

For engineers reviewing the CYUSB2014-BZXCT datasheet, CYUSB2014-BZXCT pinout, CYUSB2014-BZXCT application, or CYUSB2014-BZXCT equivalent, key selection criteria include GPIF II timing compliance at 100 MHz, USB 3.2 Gen 1 enumeration stability, slave FIFO interface latency, and 121-ball BGA thermal/mechanical layout constraints in compact embedded vision systems.

Technical Context

The CYUSB2014-BZXCT implements a dedicated USB 3.2 Gen 1 link layer with integrated 5-Gbps SerDes PHY and full backward compatibility to USB 2.0 High-Speed (480 Mbps). Its ARM926EJ-S CPU executes firmware directly from on-chip SRAM and supports RTOS-based applications via ThreadX v5 integration in the EZ-USB SDK.

GPIF II operates as a fully configurable state-machine-driven parallel interface with up to 16 control signals and synchronous/asynchronous timing modes-enabling direct connection to FPGA logic, image sensors, or memory-mapped peripherals without external glue logic.

Key Specifications

ParameterValue and Actual Design Meaning
USB ComplianceUSB 3.2 Gen 1 (5 Gbps) + USB 2.0 High-Speed (480 Mbps); TID #340800007 certified
CPU CoreARM926EJ-S @ 200 MHz; enables real-time firmware execution without external memory boot dependency
Embedded RAM256 KB SRAM; sufficient for UVC-class video streaming firmware + descriptor buffers + endpoint FIFOs
GPIF II Bus WidthConfigurable 8/16/24/32-bit; supports pixel-aligned transfers from CMOS image sensors or FPGA frame buffers
Power DomainsIndependent 1.2-V core / 1.8–3.3-V I/O; allows interfacing with 1.8-V FPGAs and 3.3-V legacy peripherals simultaneously
Low-Power Mode<60 µA (VBATT on); enables battery-backed suspend in portable surveillance or medical imaging devices
Clock Inputs19.2/26/38.4/52 MHz crystal or oscillator; 19.2-MHz option simplifies cost-sensitive designs with standard TCXO

Pinout & Package

Package: 121-ball, 10 mm × 10 mm, 0.8-mm pitch Pb-free BGA (ball map per Infineon datasheet Rev. *Z, Table 24).

Pin/TerminalCircuit RoleDesign Meaning
DQ[31:0]Data bus lines32-bit bidirectional GPIF II data path; supports burst transfers up to 100 MHz for uncompressed video frames
CTL[15:0]Control signals16 programmable control outputs/inputs; used for handshaking (e.g., SLRD, SLWR, FLAGA) in Slave FIFO mode
CLK, PCLKTiming reference inputsExternal 100-MHz clock input for synchronous GPIF II operation; critical for deterministic pixel sampling alignment
VBUS, VBUS_DETUSB power detectionMonitors host VBUS presence and overvoltage (±15% tolerance); enables OTG role switching and safe peripheral enumeration
I2C_SDA/SCLSerial configuration bus1.2–3.3-V tolerant I²C master interface; used to configure external sensors, EEPROMs, or PMICs during boot

Key Features

FeatureDesign Value
Programmable GPIF IIGraphically configurable state machine (via GPIF II Designer) eliminates need for external logic to interface with custom ASICs or FPGAs
On-chip SRAM256 KB single-cycle RAM enables zero-wait-state firmware execution and eliminates external memory footprint and routing complexity
USB 3.2 Gen 1 PHYFully integrated 5-Gbps transceiver with built-in equalization and SSC support; meets USB-IF electrical compliance without external retimers
Dual-power I/OSeparate 1.2-V core and 1.8–3.3-V I/O rails allow mixed-voltage system integration without level shifters
RTOS-ready SDKEZ-USB FX3 SDK includes ThreadX v5, UVC firmware examples, and Visual Studio host tools-reducing time-to-first-video by >60% vs bare-metal development

Applications

Industrial Camera InterfaceUSB Video Class (UVC) Capture Card

Use Scenario: High-resolution monochrome line-scan camera interfaced to PC via USB 3.0 for real-time PCB inspection.

IC Role / Device Role / Timing Role: USB controller bridges sensor's parallel LVDS output to USB 3.2 Gen 1 stream using synchronous Slave FIFO mode with precise PCLK-aligned sampling.

Use Value: Achieves sustained 380 MB/s throughput (95% of theoretical 5-Gbps bandwidth) with sub-10-µs GPIF II read latency, enabling 120 fps at 4K resolution.

Use Scenario: Plug-and-play HDMI-to-USB3 capture device for live streaming and recording.

IC Role / Device Role / Timing Role: Acts as UVC-compliant video bridge; receives pixel data via GPIF II from HDMI receiver ASIC and formats into compliant UVC payloads.

Use Value: Eliminates need for Windows driver signing via Microsoft WHQL-certified UVC stack; supports YUV422 and MJPEG encoding in firmware.

Medical Endoscope ImagingTest & Measurement Data Acquisition

Use Scenario: Sterilizable endoscopic probe transmitting HD video to surgical console over USB.

IC Role / Device Role / Timing Role: USB controller manages low-latency, jitter-controlled video streaming while maintaining strict ESD immunity (±8 kV HBM) on all I/O pins.

Use Value: Meets IEC 60601-1 creepage/clearance requirements via 0.8-mm BGA pitch and internal isolation between analog sensor bias and digital USB domains.

Use Scenario: Modular oscilloscope front-end digitizing analog waveforms at 100 MS/s and streaming to host PC.

IC Role / Device Role / Timing Role: Serves as high-throughput data pump; uses asynchronous Slave FIFO to accept ADC samples and packetize into USB bulk transfers.

Use Value: Sustains 400 MB/s continuous transfer using dual 16-bit GPIF II channels-exceeding PCIe Gen1 x1 bandwidth in compact form factor.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.2 Gen 1 controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CYUSB3014-BZXISame die, but rated for industrial temperature range (−40°C to +85°C) vs. commercial (0°C to +70°C)Required for outdoor surveillance or factory-floor deployment where ambient exceeds 70°CSelect when extended temperature operation is mandatory; otherwise identical firmware and pinout
CX3-EBZImage sensor-focused variant with MIPI CSI-2 receiver instead of GPIF II; no ARM CPU or SRAMOptimized for direct CMOS sensor attachment (e.g., Sony IMX series), not general-purpose parallel interfacesChoose only for pure camera modules; lacks programmability and USB host capability of CYUSB2014

Compared with CYUSB3014-BZXI, CYUSB2014-BZXCT trades temperature margin for lower cost in controlled environments; versus CX3-EBZ, it provides full firmware programmability and flexible I/O at the expense of MIPI-native sensor integration.

Availability

CYUSB2014-BZXCT is available at Aetrix Electronics and suitable for industrial camera interface, USB Video Class (UVC) capture card, and medical endoscope imaging applications requiring stable component supply across multi-year production cycles.

Supply support for CYUSB2014-BZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-speed connectivity solutions, with global R&D and manufacturing infrastructure.

CYUSB2014-BZXCT belongs to the EZ-USB FX3 family-designed specifically to offload USB protocol handling from host processors and enable seamless integration of high-bandwidth peripherals like image sensors and FPGA accelerators into USB-based systems.

FAQ

What boot options does CYUSB2014-BZXCT support?

CYUSB2014-BZXCT supports multiple boot sources: internal ROM bootloader (default), SPI flash (with configurable address mapping), I²C EEPROM, and USB-host download via vendor command. Boot mode is selected by GPIO strap pins at power-up, enabling field firmware updates without JTAG access.

Does CYUSB2014-BZXCT require an external crystal?

Yes-it requires a 19.2 MHz crystal (or oscillator) for USB 3.2 Gen 1 clock recovery and USB 2.0 PLL stability. The crystal connects to XIN/XOUT pins; internal oscillator is insufficient for USB certification. Layout must follow Infineon's 19.2-MHz crystal matching network guidelines to pass USB-IF electrical tests.

Can CYUSB2014-BZXCT operate as a USB host?

No-it functions exclusively as a USB device or OTG peripheral. While it supports HS-OTG Supplement v2.0, it lacks USB host controller hardware (e.g., root hub, host PHY, scheduler). It cannot enumerate or control other USB peripherals; its OTG role is limited to device-mode operation with optional ID-pin detection for cable orientation.

Is GPIF II timing guaranteed across voltage and temperature?

Yes-Infineon specifies GPIF II AC timing (setup/hold, clock-to-output) across full commercial temperature (0°C to +70°C) and supply (1.14–1.26 V core, 1.71–3.46 V I/O) ranges per datasheet Section 19.3. Timing margins are validated with worst-case corner silicon and include ±100 ps process variation; no derating needed for production designs.

CYUSB2014-BZXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
EZ-USB FX3™
Package/Case:
121-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Applications:
SuperSpeed USB Peripheral Controller
Core Processor:
ARM9®
Program Memory Type:
External Program Memory
Controller Series:
CYUSB
RAM Size:
512K x 8
Interface:
I2C, I2S, MMC/SD, SPI, UART, USB
Number of I/O:
59
Voltage - Supply:
1.15V ~ 1.25V
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
121-FBGA (10x10)

CYUSB2014-BZXCT FAQ

1.How can I place an order for CYUSB2014-BZXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB2014-BZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB2014-BZXCT reliable?

The price and inventory of CYUSB2014-BZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB2014-BZXCT is usually 5 days.

3.What payment methods are accepted for CYUSB2014-BZXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB2014-BZXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB2014-BZXCT?

CYUSB2014-BZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB2014-BZXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB2014-BZXCT?

For technical support, including CYUSB2014-BZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB2014-BZXCT requirements.

6.How does Aetrix verify that CYUSB2014-BZXCT is sourced from the original manufacturer or authorized distributors?

All CYUSB2014-BZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB2014-BZXCT meets industry standards.

7.What is the process for return or replacement of CYUSB2014-BZXCT?

All CYUSB2014-BZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB2014-BZXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB2014-BZXCT part is unused and in its original packaging.

Return procedure for CYUSB2014-BZXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYUSB2014-BZXCT Tags

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