Infineon Technologies CYUSB2024-BZXI
- Part No.:
- CYUSB2024-BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 121-TFBGA
- Datasheet:
-
CYUSB2024-BZXI.pdf
- Description:
- IC USB CTLR
- Quantity:
- Payment:

- Shipping:

Inventory:1,680
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Product details
Overview
CYUSB2024-BZXI from Infineon Technologies is a USB 2.0 High-Speed mass-storage peripheral controller integrating dual SD/MMC/SDIO host ports (S0 and S1), USB 2.0 peripheral interface with 32 physical endpoints, I²C master up to 1 MHz, and ARM926EJ-S core. It supports UHS-I SDR50/DDR50, eMMC 4.4, and SDIO 3.0 in embedded storage bridges for USB thumb drives, card readers, and laptop/TV SD slots.
For engineers reviewing the CYUSB2024-BZXI datasheet, CYUSB2024-BZXI pinout, CYUSB2024-BZXI application, or CYUSB2024-BZXI equivalent, this device serves as a programmable bridge IC enabling simultaneous USB-to-SD/eMMC/SDIO translation with configurable boot sources (I²C, SPI, eMMC, USB), ultra-low-power core sleep (<60 µA), and independent power domains for I/O and core logic.
Technical Context
The CYUSB2024-BZXI implements a dual-port mass-storage architecture where S0 and S1 support independent or interleaved SD/SDIO/MMC protocols per SD 3.0 and MMC 4.41 specs. Its USB 2.0 peripheral interface supports both MSC and UAS classes with Streams capability for optimized data throughput.
It features a dedicated ARM926EJ-S processor with 512 kB SRAM, clocked via internal PLL from selectable inputs (19.2 MHz crystal or 19.2/26/38.4/52 MHz external clock), and includes UART, SPI (33 MHz max), and I²S (up to 192 kHz sampling) interfaces-all with separate voltage domains and configurable I/O drive strengths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Compliance | USB 2.0 Hi-Speed (480 Mbps) and Full-Speed (12 Mbps) peripheral; certified, not just compliant |
| Storage Interfaces | Dual independent ports: S0 and S1 supporting SD 3.0, eMMC 4.4, SDIO 3.0 with UHS-I SDR50/DDR50 modes |
| Endpoint Count | 32 physical USB endpoints (16 IN + 16 OUT); enables complex descriptor configurations and UAS Streams |
| Core Power Consumption | <60 µA in core power-down mode with VBATT on; enables battery-backed standby in portable devices |
| I²C Master Speed | Up to 1 MHz (at VIO5 ≥1.8 V); supports fast configuration of external EEPROMs or PMICs during boot |
| Clock Input Options | Selectable: 19.2 MHz crystal or 19.2/26/38.4/52 MHz external clock; configured via FSLC[2:0] pins |
| Package | 10 × 10 mm, 0.8 mm pitch BGA (121-ball); RoHS-compliant, thermal pad enabled |
Pinout & Package
Package: 10 mm × 10 mm, 0.8 mm pitch, 121-ball BGA (ball map per Infineon datasheet Rev.*E, page 37). Thermal pad exposed on underside for PCB-level heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D+, D− | USB 2.0 differential pair | Integrated transceiver; requires no external magnetics or termination resistors |
| S0_SD[0–7], S0_CMD, S0_CLK, S0_WP, S0S1_INS | S0 port SD/MMC/SDIO signals | Full 8-bit SD bus + command/control; supports high-speed DDR50 mode at 100 MB/s |
| S1_SD[0–7], S1_CMD, S1_CLK, S1_WP, MMC1_RST_OUT | S1 port SD/MMC/SDIO signals | Independent second port; enables dual-slot readers or SD+eMMC coexistence |
| I2C_SCL, I2C_SDA | I²C master interface | Open-drain, VIO5-referenced; supports 1 MHz operation with clock stretching for slow slaves |
| XTALIN / XTALOUT | Crystal oscillator input/output | Supports 19.2 MHz ±100 ppm crystal; internal oscillator eliminates need for external clock generator |
| FSLC[0–2] | Clock source selection control | Three-pin strap to select crystal vs. external clock and frequency (19.2/26/38.4/52 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent storage ports | Enables concurrent SD and eMMC access or SDIO + SD bridging without arbitration overhead |
| UAS-class USB support | Reduces protocol latency vs. legacy MSC; required for high-throughput USB SSD enclosures |
| Configurable boot sources | PMODE-strapped selection among I²C EEPROM, SPI flash (Infineon/WB), eMMC, or USB host download |
| Independent power domains | VIO5 (I²C), VIO3 (UART/SPI/I²S), and core domain allow selective power gating per interface |
| ARM926EJ-S subsystem | 512 kB embedded SRAM + JTAG debug; enables custom firmware for proprietary storage translation or security |
Applications
| USB Thumb Drive Bridge | Multi-Card Reader |
|---|---|
Use Scenario: Integrating NAND flash via eMMC 4.4 into a USB 2.0 removable drive with UAS acceleration. IC Role / Device Role / Timing Role: Acts as USB-to-eMMC protocol translator with ARM9-based firmware handling wear leveling and bad-block management. Use Value: Achieves >35 MB/s sustained write using UAS and DDR50 eMMC, exceeding legacy MSC limits by 2.5×. | Use Scenario: Supporting simultaneous SDHC and microSDXC cards in a single enclosure with independent power control. IC Role / Device Role / Timing Role: Dual-port SDIO/SD controller managing separate clock domains and voltage regulators per slot. Use Value: Eliminates host-side software arbitration; enables plug-and-play card swapping without system reboot. |
| Laptop SD Slot Controller | USB WiFi + SDIO Bridge Dongle |
Use Scenario: Adding native SD 3.0 UHS-I support to legacy laptops via USB-C or USB-A adapter. IC Role / Device Role / Timing Role: USB peripheral presenting as standard SD host controller (UAS or MSC class) to OS drivers. Use Value: Delivers full SDR104 bandwidth (104 MB/s) over USB 2.0 Hi-Speed using UAS command queuing. | Use Scenario: Combining WiFi module (SDIO) and USB host interface in compact dongle form factor. IC Role / Device Role / Timing Role: SDIO 3.0 host for WiFi chip + USB 2.0 peripheral for host communication; shares ARM9 firmware stack. Use Value: Reduces BOM count by merging two interface controllers; enables unified driver model across platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB-to-SD/MMC bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB2022-BZXI | Single storage port (S0 only); no S1 port; identical USB/I²C/ARM9 subsystem | Not suitable for dual-slot readers or SD+eMMC coexistence; lower pin count and cost | Select when only one SD/eMMC interface is required and board space/cost are constrained |
| GL827L-16 | USB 2.0 to SD/MMC bridge ASIC; no ARM core, no firmware programmability, fixed-function logic | Lacks UAS support, no I²S/UART/SPI; limited to basic MSC class and SD 2.0 speeds | Select for cost-sensitive, high-volume card readers requiring no customization or audio integration |
Compared with CYUSB2024-BZXI, CYUSB2022-BZXI reduces functionality to a single port but retains full UAS and ARM9 programmability, while GL827L-16 offers lower cost and power at the expense of flexibility, speed, and interface extensibility.
Availability
CYUSB2024-BZXI is available at Aetrix Electronics and suitable for USB storage bridges, multi-format card readers, laptop SD slot adapters, and embedded SDIO peripheral dongles requiring stable component supply, long-term lifecycle support, and qualified industrial-grade sourcing.
Supply support for CYUSB2024-BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, security ICs, and connectivity solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
CYUSB2024-BZXI belongs to Infineon's CYUSB SD2 family-designed specifically for high-performance, firmware-programmable USB-to-mass-storage bridge applications requiring dual SDIO/SD/MMC ports and UAS acceleration.
FAQ
What boot sources does CYUSB2024-BZXI support, and how are they selected?
CYUSB2024-BZXI supports booting from USB host download, I²C-connected EEPROM, SPI flash (Infineon S25FS064S/S25FS128S/S25LFL064L or Winbond W25Q32FW), or eMMC on S0-Port. Selection is controlled by strapping PMODE[2:0] pins at reset-floating (F) and logic levels define priority order and fallback behavior per Table 2 in the datasheet.
Does CYUSB2024-BZXI support SD Express or PCIe-based SD cards?
No. CYUSB2024-BZXI implements SD 3.0 and eMMC 4.4 specifications only, supporting UHS-I SDR50/DDR50 modes (max 100 MB/s) but not SD Express (PCIe/NVMe tunneling) or SD 4.0+ features. Its PHY and controller logic are physically and architecturally limited to legacy SDIO/SD/MMC signaling.
Can the ARM926EJ-S core be used for custom real-time processing beyond storage bridging?
Yes. The embedded ARM926EJ-S core with 512 kB SRAM runs customer firmware loaded at boot. It supports UART, SPI, I²S, and GPIO peripherals-enabling custom tasks like audio preprocessing (via I²S), secure key injection (via I²C), or sensor fusion-provided timing-critical USB/SD transactions are managed via hardware accelerators.
What are the voltage domain requirements for I²C and USB interfaces?
I²C operates on VIO5 (1.2 V, 1.8 V, 2.5 V, or 3.3 V), with maximum speed dependent on voltage (100 kHz at 1.2 V; 1 MHz at ≥1.8 V). USB D+/D− use 3.3 V I/O domain (VIO3), with integrated ESD protection and transceiver compliant to USB 2.0 electrical specs-no level-shifting needed for standard USB hosts.
CYUSB2024-BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EZ-USB™ SD2
- Package/Case:
- 121-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- SD2™ USB and Mass Storage Peripheral Controller
- Core Processor:
- ARM9®
- Program Memory Type:
- -
- Controller Series:
- CYUSB
- RAM Size:
- 512K x 8
- Interface:
- I2C, I2S, MMC/SD, SPI, UART, USB
- Number of I/O:
- 59
- Voltage - Supply:
- 1.15V ~ 1.25V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 121-FBGA (10x10)
CYUSB2024-BZXI FAQ
1.How can I place an order for CYUSB2024-BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB2024-BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB2024-BZXI reliable?
The price and inventory of CYUSB2024-BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB2024-BZXI is usually 5 days.
3.What payment methods are accepted for CYUSB2024-BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB2024-BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB2024-BZXI?
CYUSB2024-BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB2024-BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB2024-BZXI?
For technical support, including CYUSB2024-BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB2024-BZXI requirements.
6.How does Aetrix verify that CYUSB2024-BZXI is sourced from the original manufacturer or authorized distributors?
All CYUSB2024-BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB2024-BZXI meets industry standards.
7.What is the process for return or replacement of CYUSB2024-BZXI?
All CYUSB2024-BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB2024-BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB2024-BZXI part is unused and in its original packaging.
Return procedure for CYUSB2024-BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB2024-BZXI Tags

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CYPD3175-24LQXQ
Infineon Technologies

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SLB9672VU20FW1523XTMA1
Infineon Technologies

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SLB9670VQ20FW785XTMA1
Infineon Technologies

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Infineon Technologies

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Infineon Technologies

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CYPD3125-40LQXIT
Infineon Technologies

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AT97SC3204-U2A1A-20
Microchip Technology

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AT97SC3204-U2A1A-10
Microchip Technology

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SLM9670AQ20FW1311XTMA1
Infineon Technologies

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SLB9672XU20FW1613XTMA1
Infineon Technologies

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SLB9672AU20FW1613XTMA1
Infineon Technologies

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SLB9673AU20FW2613XTMA1
Infineon Technologies
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