Infineon Technologies CYUSB2025-BZXI
- Part No.:
- CYUSB2025-BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 121-TFBGA
- Datasheet:
-
CYUSB2025-BZXI.pdf
- Description:
- IC USB CTLR 121BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,598
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Product details
Overview
CYUSB2025-BZXI from Infineon Technologies is a USB 2.0 High-Speed mass-storage peripheral controller integrating dual SD/MMC/SDIO host ports (S0 and S1), a certified USB 2.0 peripheral interface with 32 physical endpoints, I²C master up to 1 MHz, and ARM926EJ-S core. It supports UHS-I SDR50/DDR50, eMMC 4.4, and SDIO 3.0 in embedded card readers, USB thumb drives, and SD slot-equipped TVs/STBs.
For engineers reviewing the CYUSB2025-BZXI datasheet, CYUSB2025-BZXI pinout, CYUSB2025-BZXI application, or CYUSB2025-BZXI equivalent, key selection considerations include dual-port SDIO/SD/eMMC concurrency, USB Attached SCSI (UAS) support, ultra-low-power core shutdown (<60 µA), 19.2–52 MHz clock flexibility, and BGA-144 package compatibility with industrial storage bridge designs.
Technical Context
The CYUSB2025-BZXI implements a dual-port storage architecture enabling independent or interleaved operation of S0 and S1 ports across SD/SDIO/eMMC combinations - including SD+SDIO, MMC+SDIO, and SD+MMC configurations. Its USB 2.0 peripheral interface supports both Mass Storage Class (MSC) and USB Attached SCSI (UAS) for optimized throughput and command queuing.
It features separate power domains for core (VDDCORE) and I/O (VIO3, VIO5), enabling voltage scaling per interface: VIO5 powers the I²C bus (1.2/1.8/2.5/3.3 V selectable), while VIO3 supplies SDIO/SD/MMC signaling. Clocking is managed via internal PLL with configurable input sources - 19.2 MHz crystal or 19.2/26/38.4/52 MHz external clock - with phase noise compliance down to –130 dBc/Hz at 1 MHz offset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Compliance | USB 2.0 Hi-Speed (480 Mbps) and Full-Speed (12 Mbps) peripheral; certified; supports UAS and MSC classes |
| Storage Ports | Dual independent ports (S0 & S1); each supports SD 3.0, eMMC 4.4, SDIO 3.0, UHS-I SDR50/DDR50 |
| Endpoints | 32 physical USB endpoints (16 IN + 16 OUT); enables multi-LUN and streaming support |
| I²C Master | Up to 1 MHz; operates only as master; supports clock stretching; VIO5-supplied; pull-ups required to VIO5 |
| Core Power | <60 µA in core power-down with VBATT on; <20 µA with VBATT off; enables battery-backed standby |
| Clock Input | Selectable: 19.2 MHz crystal or 19.2/26/38.4/52 MHz external clock; FSLC[2:0] configures source and frequency |
| Package | 10 × 10 mm, 0.8 mm pitch BGA-144; RoHS-compliant; thermal pad exposed on underside |
Pinout & Package
Package: 10 × 10 mm, 0.8 mm pitch ball grid array (BGA-144) with exposed thermal pad (pin 144 = VSS_THERMAL). Designed for high-density PCB layouts with controlled impedance routing for USB D+/D− and SDIO signal groups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D+, D− | USB 2.0 differential pair | Hi-Speed/Full-Speed USB physical layer; require 90 Ω differential impedance and ESD protection |
| S0_SD0–S0_SD7, S0_CMD, S0_CLK, S0_WP, S0S1_INS | S0 port SDIO/SD/MMC signals | 8-bit data bus + control lines for first storage device; supports 4-bit/8-bit SD, 4-bit/8-bit eMMC, SDIO |
| S1_SD0–S1_SD7, S1_CMD, S1_CLK, S1_WP, MMC1_RST_OUT | S1 port SDIO/SD/MMC signals | Independent second storage interface; identical capability to S0; enables dual-slot or bridge functionality |
| I2C_SCL, I2C_SDA | I²C master interface | Open-drain outputs; require external pull-up resistors to VIO5; used for boot EEPROM or configuration ICs |
| XTALIN, XTALOUT, CLKIN, CLKIN_32 | Clock inputs | Support crystal (19.2 MHz) or external clock (19.2–52 MHz); CLKIN_32 for 32 kHz watchdog reference |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent storage ports | Enables concurrent SD + eMMC, SDIO + SD, or dual SD card operation without arbitration overhead |
| USB Attached SCSI (UAS) support | Reduces command latency and enables native command queuing for faster file transfers vs. legacy MSC |
| Configurable clock input | FSLC[2:0] pins select between 19.2 MHz crystal or four external clock frequencies - simplifies board-level clock sourcing |
| Multi-voltage I/O domains | VIO5 (I²C) and VIO3 (SDIO) operate independently; allows mixed-voltage system integration (e.g., 1.8 V SD + 3.3 V I²C) |
| ARM926EJ-S core | Embedded 32-bit RISC processor with 512 kB SRAM; enables firmware customization for protocol translation and security logic |
Applications
| USB Thumb Drive | SD Card Reader |
|---|---|
Use Scenario: Compact portable storage device connecting via USB to PCs or media players. IC Role / Device Role / Timing Role: Acts as USB-to-SDIO bridge; handles FAT32/ExFAT translation and wear leveling via embedded ARM926EJ-S. Use Value: Enables single-chip design with UAS acceleration for >30 MB/s sequential read; eliminates external microcontroller. | Use Scenario: Multi-format card reader supporting SD, microSD, and MMC in laptops or docking stations. IC Role / Device Role / Timing Role: Dual-port controller managing simultaneous SD and eMMC access; provides hot-plug detection via S0S1_INS and MMCx_RST_OUT. Use Value: Reduces BOM count by integrating PHY, USB stack, and dual SDIO controllers - no external level shifters needed for 1.8/3.3 V cards. |
| Laptop SD Slot | TV/STB SD Expansion |
Use Scenario: Integrated SD card slot in ultrabooks requiring low-power, always-on readiness. IC Role / Device Role / Timing Role: USB peripheral presenting as mass storage; enters <60 µA core power-down when idle but retains VBATT context. Use Value: Extends battery life during sleep mode while preserving card state - critical for instant-resume user experience. | Use Scenario: SD slot in smart TV or set-top box for firmware updates, app caching, or DVR expansion. IC Role / Device Role / Timing Role: Bridges USB host (via internal hub or SoC) to SDIO Wi-Fi module or eMMC-based storage expansion. Use Value: Supports SDIO 3.0 4-bit mode at 208 Mbps for real-time video buffering; isolates noisy SDIO traffic from HDMI/AV subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB-to-SDIO bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB2024-BZXI | Single storage port (S0 only); no S1 port; identical USB/UAS/I²C specs and package | Not suitable for dual-slot or SDIO+eMMC bridge use cases; lower pin count and cost | Select when only one SD/MMC device is required and board space/cost optimization is prioritized |
| GL827L-16 | No ARM core; fixed-function USB-SD/MMC bridge; supports only SD 2.0 and MMC 4.2; no UAS or I²C master | Lacks firmware programmability and dual-port concurrency; limited to basic card reader applications | Choose for cost-sensitive, non-upgradable USB card readers where UAS or SDIO 3.0 is not required |
Compared with CYUSB2025-BZXI, CYUSB2024-BZXI reduces functionality to a single-port solution with identical power and USB performance, while GL827L-16 offers a simpler, lower-cost alternative without programmability or modern SDIO 3.0 support - making CYUSB2025-BZXI optimal for feature-rich, future-proof storage bridges.
Availability
CYUSB2025-BZXI is available at Aetrix Electronics and suitable for USB SDIO bridges, embedded card readers, and SD slot expansion modules requiring stable component supply, long-lifecycle support, and automotive-grade reliability validation.
Supply support for CYUSB2025-BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and connectivity solutions for automotive, industrial, and consumer markets.
CYUSB2025-BZXI belongs to Infineon's SD2 family of USB mass-storage controllers, designed specifically for high-performance, low-power USB-to-SDIO/eMMC bridging in portable and embedded storage systems.
FAQ
What boot sources does CYUSB2025-BZXI support?
CYUSB2025-BZXI supports boot from USB, I²C-connected EEPROM, eMMC on S0-Port, or SPI flash (Infineon S25FS064S/S25FS128S/S25LFL064L and Winbond W25Q32FW). Boot source is selected via PMODE[2:0] pin strapping, with fallback to USB boot enabled on failure for most configurations.
Does CYUSB2025-BZXI support SDXC cards?
Yes, CYUSB2025-BZXI supports SDXC cards via SD 3.0 specification compliance, including exFAT file system handling through firmware running on its embedded ARM926EJ-S core. It supports UHS-I SDR50 and DDR50 modes required for SDXC performance tiers.
Can the two storage ports operate simultaneously?
Yes, S0 and S1 ports operate independently and can be accessed concurrently or interleaved. Supported combinations include SD+eMMC, SD+SDIO, and SDIO+SDIO - enabling true dual-device operation without software arbitration or bandwidth contention.
What is the maximum I²C clock frequency supported?
The maximum I²C clock frequency is 1 MHz, achievable when VIO5 supply is 1.8 V, 2.5 V, or 3.3 V. At 1.2 V VIO5, maximum frequency is limited to 100 kHz. Clock stretching is supported, and external pull-up resistors to VIO5 are mandatory for proper bus operation.
CYUSB2025-BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EZ-USB™ SD2
- Package/Case:
- 121-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- SD2™ USB and Mass Storage Peripheral Controller
- Core Processor:
- ARM9®
- Program Memory Type:
- -
- Controller Series:
- CYUSB
- RAM Size:
- 512K x 8
- Interface:
- I2C, I2S, MMC/SD, SPI, UART, USB
- Number of I/O:
- 59
- Voltage - Supply:
- 1.15V ~ 1.25V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 121-FBGA (10x10)
CYUSB2025-BZXI FAQ
1.How can I place an order for CYUSB2025-BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB2025-BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB2025-BZXI reliable?
The price and inventory of CYUSB2025-BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB2025-BZXI is usually 5 days.
3.What payment methods are accepted for CYUSB2025-BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB2025-BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB2025-BZXI?
CYUSB2025-BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB2025-BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB2025-BZXI?
For technical support, including CYUSB2025-BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB2025-BZXI requirements.
6.How does Aetrix verify that CYUSB2025-BZXI is sourced from the original manufacturer or authorized distributors?
All CYUSB2025-BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB2025-BZXI meets industry standards.
7.What is the process for return or replacement of CYUSB2025-BZXI?
All CYUSB2025-BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB2025-BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB2025-BZXI part is unused and in its original packaging.
Return procedure for CYUSB2025-BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB2025-BZXI Tags

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CYPD3175-24LQXQ
Infineon Technologies

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Infineon Technologies

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Infineon Technologies

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Infineon Technologies

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Infineon Technologies

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CYPD3125-40LQXIT
Infineon Technologies

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AT97SC3204-U2A1A-20
Microchip Technology

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AT97SC3204-U2A1A-10
Microchip Technology

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SLM9670AQ20FW1311XTMA1
Infineon Technologies

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SLB9672XU20FW1613XTMA1
Infineon Technologies

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Infineon Technologies

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SLB9673AU20FW2613XTMA1
Infineon Technologies
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