Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CYUSB3011-BZXC

Part No.:
CYUSB3011-BZXC
Manufacturer:
Infineon Technologies
Category:
Application Specific Microcontrollers
Package:
121-TFBGA
Datasheet:
AetrixCYUSB3011-BZXC.pdf
Description:
IC ARM9 USB3 CONTROLLER 121FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:939

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CYUSB3011-BZXC from Infineon is a USB 3.2 Gen 1 (5 Gbps) and USB 2.0 programmable SuperSpeed USB controller with ARM926EJ-S core (200 MHz), 512 KB SRAM, 32 physical endpoints, and GPIF II interface supporting 8-/16-/24-/32-bit buses up to 100 MHz - used in high-bandwidth video capture cards, industrial cameras, and medical imaging devices.

For engineers reviewing the CYUSB3011-BZXC datasheet, CYUSB3011-BZXC pinout, CYUSB3011-BZXC application, or CYUSB3011-BZXC equivalent, key selection criteria include USB 3.2 Gen 1 PHY compliance (TID #340800007), configurable GPIF II timing, dual-power-domain operation (1.2 V core / 1.8–3.3 V I/O), and boot flexibility via SPI/I²C/USB.

Technical Context

The CYUSB3011-BZXC integrates a full-featured USB 3.2 Gen 1 transceiver with integrated 5-Gbps PHY and USB 2.0 HS PHY, enabling simultaneous SuperSpeed and High-Speed device/host operation. It supports OTG Supplement v2.0 with HS-OTG host/peripheral mode and renumerability.

GPIF II provides deterministic, software-configurable parallel interface logic with up to 16 control signals and support for synchronous/asynchronous Slave FIFO, SRAM, and custom state machines - enabling direct connection to FPGAs, image sensors, and ADCs without external glue logic.

Key Specifications

ParameterValue and Actual Design Meaning
USB StandardCompliant with USB 3.2 Gen 1 (5 Gbps) and USB 2.0; TID #340800007 certified - ensures interoperability with host controllers and hubs.
CPU CoreARM926EJ-S @ 200 MHz - delivers real-time firmware execution for protocol translation, data buffering, and sensor interface management.
Embedded RAM512 KB SRAM - sufficient for dual-buffered UVC video streaming at 1080p60 with metadata processing.
GPIF II Bus WidthConfigurable 8/16/24/32-bit data bus - matches common image sensor and FPGA data widths without bit-banging overhead.
Power DomainsIndependent 1.2-V core + 1.8–3.3-V I/O domains - enables mixed-voltage system integration (e.g., 1.8-V FPGA + 3.3-V camera interface).
Boot SourcesSupports SPI, I²C, USB, and internal ROM boot - allows field firmware recovery and secure update via multiple trusted paths.
Low-Power Mode<60 µA core power-down (VBATT on) - suitable for battery-powered portable media players and surveillance edge nodes.

Pinout & Package

Package: 121-ball, 10 mm × 10 mm, 0.8-mm pitch Pb-free BGA (ball grid array). Pin mapping validated per Infineon datasheet Rev. *Z (2022-09-29), Table 16 "Pin Description".

Pin/TerminalCircuit RoleDesign Meaning
DQ[31:0]GPIF II Data Bus32-bit bidirectional data path for high-throughput sensor/FPGA interfacing; configurable as 8/16/24-bit subset.
CTL[15:0]GPIF II Control Signals16 programmable control lines (e.g., RD#, WR#, CS#, PKTEND#) - define custom handshake protocols for proprietary peripherals.
CLKGPIF II Clock InputAccepts externally generated 100-MHz clock or internal PLL-derived clock - enables precise timing alignment with external logic.
USBDP/USBDMUSB 3.2 Gen 1 Differential Pair5-Gbps SuperSpeed transmit/receive pair; requires controlled-impedance 90-Ω differential routing per USB specification.
VBUS_DETUSB VBUS Detection InputMonitors host VBUS presence (5 V ±10%) to trigger device enumeration or power-state transitions.
RESET_NActive-Low Hardware ResetSynchronous deassertion required before CPU initialization; supports reset coordination with FPGA or PMIC.

Key Features

FeatureDesign Value
Programmable GPIF II InterfaceGraphically configurable state machine (via GPIF II Designer) eliminates need for external logic, reducing BOM count and PCB area in camera/FPGA interfaces.
32 Physical EndpointsEnables concurrent UVC video streaming, audio transfer, and HID control over single USB connection - avoids bandwidth contention in multi-function devices.
ARM926EJ-S Core + RTOS SupportFull ThreadX v5 integration in SDK allows deterministic task scheduling for time-critical sensor acquisition and USB packetization.
I²S Master (Tx only)Supports standard audio sampling rates (8–192 kHz) - enables direct connection to microphones or audio codecs in IP phone and surveillance applications.
HS-OTG Host/Peripheral ModeAllows device to act as USB host (e.g., reading SD card) or peripheral (e.g., streaming to PC) - increases field deployment flexibility without hardware modification.

Applications

Digital Video CaptureIndustrial Machine Vision

Use Scenario: Real-time 1080p60 video streaming from CMOS image sensor to host PC via USB 3.2 Gen 1.

IC Role / Device Role / Timing Role: USB protocol bridge and GPIF II-to-USB data converter; manages pixel clock synchronization and frame buffering.

Use Value: Eliminates need for PCIe-based capture cards by delivering 400+ MB/s sustained throughput directly over USB.

Use Scenario: High-speed inspection system using line-scan camera and FPGA preprocessing.

IC Role / Device Role / Timing Role: Configurable GPIF II interface synchronizes with FPGA's pixel clock; ARM core handles metadata tagging and USB descriptor management.

Use Value: Enables sub-millisecond latency between image acquisition and host notification via interrupt endpoint.

Medical Imaging DeviceTest & Measurement Equipment

Use Scenario: Ultrasound probe interface transmitting raw RF data to workstation.

IC Role / Device Role / Timing Role: Bulk-transfer controller with zero-copy DMA engine; routes sensor data through 512 KB SRAM buffers to USB endpoints.

Use Value: Sustains >350 MB/s continuous transfer without host-side driver tuning or OS-level buffering.

Use Scenario: Logic analyzer capturing 100-MHz digital signals and streaming to PC.

IC Role / Device Role / Timing Role: GPIF II configured as synchronous slave FIFO; ARM core formats timestamped samples into UVC-compatible packets.

Use Value: Achieves 16-channel, 100-MHz sampling using open-source sigrok PulseView without custom drivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.2 Gen 1 controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CYUSB3014-BZXISame architecture but 256 KB SRAM and -40°C to +85°C industrial temp grade; identical pinout and firmware compatibility.Preferred for extended temperature environments (e.g., outdoor surveillance, factory floor test equipment).Select when operating ambient exceeds 70°C or long-term reliability under thermal cycling is critical.
CX3-EBZDedicated MIPI CSI-2 to USB 3.0 bridge; no ARM core or general-purpose GPIF II; fixed-function silicon.Optimized for mobile image sensors only; lacks programmability for non-CameraLink/FPGA use cases.Choose only for cost-sensitive, single-sensor camera designs where firmware customization is unnecessary.

Compared with CYUSB3014-BZXI, CYUSB3011-BZXC offers higher on-chip memory for complex UVC descriptors and multi-stream buffering; versus CX3-EBZ, it provides full firmware control and interface flexibility at the cost of higher development effort.

Availability

CYUSB3011-BZXC is available at Aetrix Electronics and suitable for digital video capture cards, industrial machine vision systems, and medical imaging devices requiring stable component supply across multi-year production cycles.

Supply support for CYUSB3011-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CYUSB3011-BZXC belongs to the EZ-USB FX3 family - designed specifically to enable high-bandwidth, low-latency USB 3.2 Gen 1 connectivity for embedded vision, instrumentation, and human interface applications.

FAQ

Does CYUSB3011-BZXC support USB 3.2 Gen 2 (10 Gbps)?

No. CYUSB3011-BZXC implements USB 3.2 Gen 1 (5 Gbps) only, as confirmed by its PHY compliance with TID #340800007 and maximum link rate of 5 GT/s. It does not support Gen 2 encoding, 10-Gbps signaling, or enhanced SuperSpeedPlus features.

Can the ARM926EJ-S core run bare-metal firmware without ThreadX?

Yes. The SDK supports bare-metal development using GCC toolchain and startup code provided in the FX3 TRM. All peripheral drivers (USB, GPIF II, SPI, I²C) are accessible in source form, enabling deterministic real-time control without RTOS overhead.

What is the minimum supported crystal frequency for CYUSB3011-BZXC?

The minimum supported crystal input is 19.2 MHz, as specified in Section 10 "Clocking" of the datasheet. This frequency enables stable PLL lock for both USB 3.2 Gen 1 (125-MHz reference) and USB 2.0 (48-MHz reference) operation.

Is CYUSB3011-BZXC pin-compatible with CYUSB3014-BZXI?

Yes. Both share identical 121-ball BGA package (10 mm × 10 mm, 0.8-mm pitch) and pin-for-pin signal mapping per Infineon's FX3 variant table. Firmware and hardware designs are interchangeable except for SRAM size and temperature grade.

CYUSB3011-BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
EZ-USB FX3™
Package/Case:
121-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Applications:
SuperSpeed USB Peripheral Controller
Core Processor:
ARM9®
Program Memory Type:
External Program Memory
Controller Series:
CYUSB
RAM Size:
256K x 8
Interface:
GPIF, I2C, I2S, SPI, UART, USB
Number of I/O:
60
Voltage - Supply:
1.15V ~ 1.25V
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
121-FBGA (10x10)

CYUSB3011-BZXC FAQ

1.How can I place an order for CYUSB3011-BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3011-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3011-BZXC reliable?

The price and inventory of CYUSB3011-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3011-BZXC is usually 5 days.

3.What payment methods are accepted for CYUSB3011-BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3011-BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3011-BZXC?

CYUSB3011-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3011-BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3011-BZXC?

For technical support, including CYUSB3011-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3011-BZXC requirements.

6.How does Aetrix verify that CYUSB3011-BZXC is sourced from the original manufacturer or authorized distributors?

All CYUSB3011-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3011-BZXC meets industry standards.

7.What is the process for return or replacement of CYUSB3011-BZXC?

All CYUSB3011-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3011-BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3011-BZXC part is unused and in its original packaging.

Return procedure for CYUSB3011-BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYUSB3011-BZXC Tags

  • CYUSB3011-BZXC
  • CYUSB3011-BZXC PDF
  • CYUSB3011-BZXC Datasheet
  • CYUSB3011-BZXC Specifications
  • CYUSB3011-BZXC Images
  • Infineon Technologies
  • Infineon Technologies CYUSB3011-BZXC
  • Buy CYUSB3011-BZXC
  • CYUSB3011-BZXC Price
  • CYUSB3011-BZXC Distributor
  • CYUSB3011-BZXC Supplier
  • CYUSB3011-BZXC Wholesale
Related Products
CYPD3175-24LQXQ
CYPD3175-24LQXQ

Infineon Technologies

SLB9672VU20FW1523XTMA1
SLB9672VU20FW1523XTMA1

Infineon Technologies

SLB9670VQ20FW785XTMA1
SLB9670VQ20FW785XTMA1

Infineon Technologies

SLB9672XU20FW1523XTMA1
SLB9672XU20FW1523XTMA1

Infineon Technologies

SLB9673XU20FW2613XTMA1
SLB9673XU20FW2613XTMA1

Infineon Technologies

CYPD3125-40LQXIT
CYPD3125-40LQXIT

Infineon Technologies

AT97SC3204-U2A1A-20
AT97SC3204-U2A1A-20

Microchip Technology

AT97SC3204-U2A1A-10
AT97SC3204-U2A1A-10

Microchip Technology

SLM9670AQ20FW1311XTMA1
SLM9670AQ20FW1311XTMA1

Infineon Technologies

SLB9672XU20FW1613XTMA1
SLB9672XU20FW1613XTMA1

Infineon Technologies

SLB9672AU20FW1613XTMA1
SLB9672AU20FW1613XTMA1

Infineon Technologies

SLB9673AU20FW2613XTMA1
SLB9673AU20FW2613XTMA1

Infineon Technologies

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER