Infineon Technologies CYUSB3011-BZXC
- Part No.:
- CYUSB3011-BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 121-TFBGA
- Datasheet:
-
CYUSB3011-BZXC.pdf
- Description:
- IC ARM9 USB3 CONTROLLER 121FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:939
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYUSB3011-BZXC from Infineon is a USB 3.2 Gen 1 (5 Gbps) and USB 2.0 programmable SuperSpeed USB controller with ARM926EJ-S core (200 MHz), 512 KB SRAM, 32 physical endpoints, and GPIF II interface supporting 8-/16-/24-/32-bit buses up to 100 MHz - used in high-bandwidth video capture cards, industrial cameras, and medical imaging devices.
For engineers reviewing the CYUSB3011-BZXC datasheet, CYUSB3011-BZXC pinout, CYUSB3011-BZXC application, or CYUSB3011-BZXC equivalent, key selection criteria include USB 3.2 Gen 1 PHY compliance (TID #340800007), configurable GPIF II timing, dual-power-domain operation (1.2 V core / 1.8–3.3 V I/O), and boot flexibility via SPI/I²C/USB.
Technical Context
The CYUSB3011-BZXC integrates a full-featured USB 3.2 Gen 1 transceiver with integrated 5-Gbps PHY and USB 2.0 HS PHY, enabling simultaneous SuperSpeed and High-Speed device/host operation. It supports OTG Supplement v2.0 with HS-OTG host/peripheral mode and renumerability.
GPIF II provides deterministic, software-configurable parallel interface logic with up to 16 control signals and support for synchronous/asynchronous Slave FIFO, SRAM, and custom state machines - enabling direct connection to FPGAs, image sensors, and ADCs without external glue logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Standard | Compliant with USB 3.2 Gen 1 (5 Gbps) and USB 2.0; TID #340800007 certified - ensures interoperability with host controllers and hubs. |
| CPU Core | ARM926EJ-S @ 200 MHz - delivers real-time firmware execution for protocol translation, data buffering, and sensor interface management. |
| Embedded RAM | 512 KB SRAM - sufficient for dual-buffered UVC video streaming at 1080p60 with metadata processing. |
| GPIF II Bus Width | Configurable 8/16/24/32-bit data bus - matches common image sensor and FPGA data widths without bit-banging overhead. |
| Power Domains | Independent 1.2-V core + 1.8–3.3-V I/O domains - enables mixed-voltage system integration (e.g., 1.8-V FPGA + 3.3-V camera interface). |
| Boot Sources | Supports SPI, I²C, USB, and internal ROM boot - allows field firmware recovery and secure update via multiple trusted paths. |
| Low-Power Mode | <60 µA core power-down (VBATT on) - suitable for battery-powered portable media players and surveillance edge nodes. |
Pinout & Package
Package: 121-ball, 10 mm × 10 mm, 0.8-mm pitch Pb-free BGA (ball grid array). Pin mapping validated per Infineon datasheet Rev. *Z (2022-09-29), Table 16 "Pin Description".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[31:0] | GPIF II Data Bus | 32-bit bidirectional data path for high-throughput sensor/FPGA interfacing; configurable as 8/16/24-bit subset. |
| CTL[15:0] | GPIF II Control Signals | 16 programmable control lines (e.g., RD#, WR#, CS#, PKTEND#) - define custom handshake protocols for proprietary peripherals. |
| CLK | GPIF II Clock Input | Accepts externally generated 100-MHz clock or internal PLL-derived clock - enables precise timing alignment with external logic. |
| USBDP/USBDM | USB 3.2 Gen 1 Differential Pair | 5-Gbps SuperSpeed transmit/receive pair; requires controlled-impedance 90-Ω differential routing per USB specification. |
| VBUS_DET | USB VBUS Detection Input | Monitors host VBUS presence (5 V ±10%) to trigger device enumeration or power-state transitions. |
| RESET_N | Active-Low Hardware Reset | Synchronous deassertion required before CPU initialization; supports reset coordination with FPGA or PMIC. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable GPIF II Interface | Graphically configurable state machine (via GPIF II Designer) eliminates need for external logic, reducing BOM count and PCB area in camera/FPGA interfaces. |
| 32 Physical Endpoints | Enables concurrent UVC video streaming, audio transfer, and HID control over single USB connection - avoids bandwidth contention in multi-function devices. |
| ARM926EJ-S Core + RTOS Support | Full ThreadX v5 integration in SDK allows deterministic task scheduling for time-critical sensor acquisition and USB packetization. |
| I²S Master (Tx only) | Supports standard audio sampling rates (8–192 kHz) - enables direct connection to microphones or audio codecs in IP phone and surveillance applications. |
| HS-OTG Host/Peripheral Mode | Allows device to act as USB host (e.g., reading SD card) or peripheral (e.g., streaming to PC) - increases field deployment flexibility without hardware modification. |
Applications
| Digital Video Capture | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time 1080p60 video streaming from CMOS image sensor to host PC via USB 3.2 Gen 1. IC Role / Device Role / Timing Role: USB protocol bridge and GPIF II-to-USB data converter; manages pixel clock synchronization and frame buffering. Use Value: Eliminates need for PCIe-based capture cards by delivering 400+ MB/s sustained throughput directly over USB. | Use Scenario: High-speed inspection system using line-scan camera and FPGA preprocessing. IC Role / Device Role / Timing Role: Configurable GPIF II interface synchronizes with FPGA's pixel clock; ARM core handles metadata tagging and USB descriptor management. Use Value: Enables sub-millisecond latency between image acquisition and host notification via interrupt endpoint. |
| Medical Imaging Device | Test & Measurement Equipment |
Use Scenario: Ultrasound probe interface transmitting raw RF data to workstation. IC Role / Device Role / Timing Role: Bulk-transfer controller with zero-copy DMA engine; routes sensor data through 512 KB SRAM buffers to USB endpoints. Use Value: Sustains >350 MB/s continuous transfer without host-side driver tuning or OS-level buffering. | Use Scenario: Logic analyzer capturing 100-MHz digital signals and streaming to PC. IC Role / Device Role / Timing Role: GPIF II configured as synchronous slave FIFO; ARM core formats timestamped samples into UVC-compatible packets. Use Value: Achieves 16-channel, 100-MHz sampling using open-source sigrok PulseView without custom drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB 3.2 Gen 1 controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3014-BZXI | Same architecture but 256 KB SRAM and -40°C to +85°C industrial temp grade; identical pinout and firmware compatibility. | Preferred for extended temperature environments (e.g., outdoor surveillance, factory floor test equipment). | Select when operating ambient exceeds 70°C or long-term reliability under thermal cycling is critical. |
| CX3-EBZ | Dedicated MIPI CSI-2 to USB 3.0 bridge; no ARM core or general-purpose GPIF II; fixed-function silicon. | Optimized for mobile image sensors only; lacks programmability for non-CameraLink/FPGA use cases. | Choose only for cost-sensitive, single-sensor camera designs where firmware customization is unnecessary. |
Compared with CYUSB3014-BZXI, CYUSB3011-BZXC offers higher on-chip memory for complex UVC descriptors and multi-stream buffering; versus CX3-EBZ, it provides full firmware control and interface flexibility at the cost of higher development effort.
Availability
CYUSB3011-BZXC is available at Aetrix Electronics and suitable for digital video capture cards, industrial machine vision systems, and medical imaging devices requiring stable component supply across multi-year production cycles.
Supply support for CYUSB3011-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.
CYUSB3011-BZXC belongs to the EZ-USB FX3 family - designed specifically to enable high-bandwidth, low-latency USB 3.2 Gen 1 connectivity for embedded vision, instrumentation, and human interface applications.
FAQ
Does CYUSB3011-BZXC support USB 3.2 Gen 2 (10 Gbps)?
No. CYUSB3011-BZXC implements USB 3.2 Gen 1 (5 Gbps) only, as confirmed by its PHY compliance with TID #340800007 and maximum link rate of 5 GT/s. It does not support Gen 2 encoding, 10-Gbps signaling, or enhanced SuperSpeedPlus features.
Can the ARM926EJ-S core run bare-metal firmware without ThreadX?
Yes. The SDK supports bare-metal development using GCC toolchain and startup code provided in the FX3 TRM. All peripheral drivers (USB, GPIF II, SPI, I²C) are accessible in source form, enabling deterministic real-time control without RTOS overhead.
What is the minimum supported crystal frequency for CYUSB3011-BZXC?
The minimum supported crystal input is 19.2 MHz, as specified in Section 10 "Clocking" of the datasheet. This frequency enables stable PLL lock for both USB 3.2 Gen 1 (125-MHz reference) and USB 2.0 (48-MHz reference) operation.
Is CYUSB3011-BZXC pin-compatible with CYUSB3014-BZXI?
Yes. Both share identical 121-ball BGA package (10 mm × 10 mm, 0.8-mm pitch) and pin-for-pin signal mapping per Infineon's FX3 variant table. Firmware and hardware designs are interchangeable except for SRAM size and temperature grade.
CYUSB3011-BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EZ-USB FX3™
- Package/Case:
- 121-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- SuperSpeed USB Peripheral Controller
- Core Processor:
- ARM9®
- Program Memory Type:
- External Program Memory
- Controller Series:
- CYUSB
- RAM Size:
- 256K x 8
- Interface:
- GPIF, I2C, I2S, SPI, UART, USB
- Number of I/O:
- 60
- Voltage - Supply:
- 1.15V ~ 1.25V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 121-FBGA (10x10)
CYUSB3011-BZXC FAQ
1.How can I place an order for CYUSB3011-BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB3011-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB3011-BZXC reliable?
The price and inventory of CYUSB3011-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3011-BZXC is usually 5 days.
3.What payment methods are accepted for CYUSB3011-BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3011-BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB3011-BZXC?
CYUSB3011-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB3011-BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB3011-BZXC?
For technical support, including CYUSB3011-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3011-BZXC requirements.
6.How does Aetrix verify that CYUSB3011-BZXC is sourced from the original manufacturer or authorized distributors?
All CYUSB3011-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3011-BZXC meets industry standards.
7.What is the process for return or replacement of CYUSB3011-BZXC?
All CYUSB3011-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3011-BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB3011-BZXC part is unused and in its original packaging.
Return procedure for CYUSB3011-BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB3011-BZXC Tags

-
CYPD3175-24LQXQ
Infineon Technologies

-
SLB9672VU20FW1523XTMA1
Infineon Technologies

-
SLB9670VQ20FW785XTMA1
Infineon Technologies

-
SLB9672XU20FW1523XTMA1
Infineon Technologies

-
SLB9673XU20FW2613XTMA1
Infineon Technologies

-
CYPD3125-40LQXIT
Infineon Technologies

-
AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

-
SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

-
SLB9672AU20FW1613XTMA1
Infineon Technologies

-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

