Infineon Technologies CYUSB3012-BZXC

Overview

CYUSB3012-BZXC from Infineon is a USB 3.2 Gen 1 (5 Gbps) and USB 2.0 compliant SuperSpeed USB controller with ARM926EJ-S core (200 MHz), 512 KB SRAM, programmable GPIF II interface (8/16/24/32-bit, 100 MHz), and support for SPI (33 MHz), UART (4 Mbps), I²C (1 MHz), and I²S (up to 192 kHz). It serves as the host-side bridge between high-bandwidth peripherals-such as image sensors or FPGAs-and USB hosts in embedded vision systems.

For engineers reviewing the CYUSB3012-BZXC datasheet, CYUSB3012-BZXC pinout, CYUSB3012-BZXC application, or CYUSB3012-BZXC equivalent, key selection criteria include USB 3.2 Gen 1 PHY compliance (TID #340800007), GPIF II configurability for custom parallel interfaces, ARM9-based firmware extensibility, low-power core mode (<60 µA), and BGA-121 (10 × 10 mm, 0.8 mm pitch) package compatibility with high-density PCB layouts.

Technical Context

The CYUSB3012-BZXC integrates a dedicated USB 3.2 Gen 1 PHY with full link training and clock recovery, alongside a fully accessible 32-bit ARM926EJ-S CPU enabling real-time firmware control of data flow and protocol handling. Its GPIF II engine operates at up to 100 MHz with synchronous/asynchronous timing modes and supports 8–32-bit bus widths plus 16 configurable control signals.

It implements independent power domains: 1.2 V for core logic, 1.8–3.3 V for UART/SPI/I²S I/Os, and 1.2–3.3 V for I²C, enabling mixed-voltage system interfacing without level shifters. Boot options include USB, SPI, I²C, or internal ROM, supporting field-upgradable firmware deployment.

Key Specifications

Pinout & Package

Package: 121-ball Pb-free BGA, 10 mm × 10 mm body, 0.8 mm ball pitch, with exposed thermal pad (EP) for enhanced thermal performance in continuous video streaming applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.2 Gen 1 bridge controller applications.

Compared with CYUSB3014-BZXI, CYUSB3012-BZXC offers higher on-chip memory for complex UVC extensions but narrower temperature tolerance; versus CX3-EBZ, it trades MIPI integration for full GPIF II and ARM9 programmability - making it suitable for non-MIPI, FPGA- or custom-sensor-based designs.

Availability

CYUSB3012-BZXC is available at Aetrix Electronics and suitable for digital video camcorders, industrial cameras, and medical imaging devices requiring stable component supply across multi-year production cycles.

Supply support for CYUSB3012-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and consumer markets.

CYUSB3012-BZXC belongs to the EZ-USB FX3 product line, designed specifically to enable high-bandwidth, firmware-programmable USB 3.2 Gen 1 bridging for embedded vision, test equipment, and data acquisition systems.

FAQ

Does CYUSB3012-BZXC support USB On-The-Go (OTG)?

Yes, CYUSB3012-BZXC supports USB 2.0 High-Speed OTG as both host and peripheral, compliant with OTG Supplement Version 2.0. It implements session request protocol (SRP) and host negotiation protocol (HNP), enabling dual-role operation in portable devices like handheld scanners or diagnostic tools that must alternate between connecting to PCs and acting as USB hosts for peripherals.

What clock sources does CYUSB3012-BZXC accept?

CYUSB3012-BZXC accepts crystal or external clock inputs at 19.2 MHz, 26 MHz, 38.4 MHz, or 52 MHz. A 19.2-MHz crystal is explicitly supported for USB 3.2 Gen 1 reference clock derivation. The internal PLL generates all required system clocks, including 400-MHz CPU clock and 100-MHz GPIF II clock, with jitter specifications meeting USB 3.2 electrical compliance requirements.

Can CYUSB3012-BZXC interface directly with an FPGA?

Yes, CYUSB3012-BZXC interfaces directly with FPGAs using its programmable GPIF II interface. Configured as a synchronous slave FIFO, it supports 8-, 16-, 24-, or 32-bit data buses with up to 16 control signals (e.g., SLRD, SLWR, PKTEND), enabling zero-wait-state transfers at up to 100 MHz. Reference designs exist for Xilinx and Intel FPGA development boards, including timing-validated HDL examples.

Is there a recommended development kit for CYUSB3012-BZXC?

The CYUSB3KIT-003 EZ-USB FX3 SuperSpeed Explorer Kit is the official Infineon development platform for CYUSB3012-BZXC. It includes on-board JTAG debugging, USB 3.2 Gen 1 connector, expansion headers for GPIF II and serial interfaces, and preloaded firmware examples covering UVC, bulk loopback, and SPI boot - enabling rapid validation of sensor interface timing and USB enumeration behavior.