Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3015-BZXC

Name: CYUSB3015-BZXC
Brand: Infineon Technologies
SKU: CYUSB3015-BZXC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CYUSB3015-BZXC

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3015-BZXC.pdf

Description:: USB SuperSpeed Peripherals

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:334

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CYUSB3015-BZXC from Infineon Technologies (formerly Cypress Semiconductor) is a configurable SuperSpeed USB 3.2 Gen 1 peripheral controller with integrated ARM926EJ-S CPU, 512-KB on-chip SRAM, and a 100-MHz General Configurable Interface supporting 8-/16-/24-/32-bit parallel data buses. It implements USB 3.2 Gen 1 (5 Gbps) and USB 2.0 PHYs, supports UVC/UAC/vendor-class protocols, and targets high-bandwidth video and data acquisition systems requiring flexible host-to-FPGA/ASIC bridging.

For engineers reviewing the CYUSB3015-BZXC datasheet, CYUSB3015-BZXC pinout, CYUSB3015-BZXC application, or CYUSB3015-BZXC equivalent, this device is selected for USB video capture, FPGA configuration loading, and custom high-speed data streaming where re-enumeration-enabled firmware flexibility, deterministic DMA throughput up to 375 MBps, and dual-power-domain operation (1.2-V core / 1.8–3.3-V I/O) are critical design requirements.

Technical Context

The CYUSB3015-BZXC implements a distributed DMA architecture that enables direct memory access between its General Configurable Interface and USB endpoints without CPU intervention, sustaining up to 375 MBps throughput. Its ARM926EJ-S core runs at 200 MHz and executes firmware from on-chip SRAM, enabling real-time descriptor management and protocol handling.

It supports soft-reconfiguration via USB-based re-enumeration: initial enumeration uses Cypress VID (0x04B4), followed by dynamic firmware download and electrical disconnect/reconnect to assume final device identity (e.g., custom VID/PID). Clocking is configurable via 19.2/26/38.4/52 MHz inputs, including 19.2-MHz crystal support.

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.2 Gen 1 (5 Gbps) and USB 2.0 backward compatible; enables single-chip SuperSpeed peripheral implementation without external PHY.
CPU Core	ARM926EJ-S @ 200 MHz; executes application firmware and USB protocol stack directly from embedded SRAM.
On-chip Memory	512-KB SRAM; stores code, descriptors, DMA buffers, and runtime variables-eliminates need for external RAM in many designs.
Configurable Interface	100-MHz parallel bus with 8/16/24/32-bit width; supports Slave FIFO and image sensor timing for direct FPGA/ASIC/ISP interfacing.
Power Domains	Independent 1.2-V core and 1.8–3.3-V I/O domains; allows mixed-voltage system integration and low-power I/O retention during core sleep.
Re-enumeration	Two-stage USB enumeration using downloaded firmware; enables field-upgradable device identity and protocol behavior without hardware change.
Low-Power Mode	<60 µA core power-down with VBATT active; supports battery-backed suspend in portable video capture devices.

Pinout & Package

121-ball, 10-mm × 10-mm, 0.8-mm pitch Pb-free BGA package (package code BZXC per Infineon ordering information).

Pin/Terminal	Circuit Role	Design Meaning
VDD	Core power supply	1.2-V supply for ARM926EJ-S core and internal logic; requires local decoupling.
VIO1–VIO5	I/O power supplies	Independent 1.8–3.3-V domains for configurable interface, USB, SPI, I²C, and GPIO banks.
SSTX+/SSTX−/SSRX+/SSRX−	SuperSpeed differential lanes	5-Gbps USB 3.2 Gen 1 signaling; require controlled-impedance PCB routing and ESD protection.
D+/D−	High-Speed USB 2.0 differential pair	Backward-compatible USB 2.0 interface; used during enumeration and fallback operation.
GPIF_DATA[31:0]	Parallel data bus	32-bit bidirectional data path for Slave FIFO or image sensor interface; clocked up to 100 MHz.
GPIF_CLK	Interface clock input	Source-synchronous clock for GPIF; supports phase-aligned sampling of external data sources.
VBATT	Backup power rail	Maintains register state and low-power wake logic when main VDD is off; enables fast resume.

Key Features

Feature	Design Value
Configurable General Interface	Programmable timing and bus width (8/16/24/32-bit) enables direct connection to diverse ASICs, FPGAs, and image sensors without glue logic.
USB Re-enumeration	Dynamic firmware-driven identity switch allows one hardware design to emulate multiple USB device classes (e.g., UVC camera, vendor-class data logger) via software update.
Distributed DMA Engine	Hardware-accelerated data movement between GPIF and USB endpoints achieves sustained 375 MBps transfer-critical for uncompressed 4K30 video streaming.
Multi-domain Power Management	Separate voltage rails for core and I/O permit selective power gating, reducing active power in mixed-voltage systems and extending battery life.
Integrated Boot Support	Direct SPI flash boot with configurable boot mode pins eliminates external boot ROM and simplifies BOM for production deployment.

Applications

USB Video Capture Card

HDMI-to-USB3 Bridge

Use Scenario: Capturing HDMI 1080p60 or 4K30 video from broadcast equipment into Windows/macOS/Linux hosts via USB 3.0.

IC Role / Device Role / Timing Role: Acts as USB endpoint and bridge controller-receives parallel pixel data from HDMI receiver IC, applies UVC descriptors, and streams over SuperSpeed USB.

Use Value: Eliminates need for external USB microcontroller and FPGA configuration logic; integrates descriptor management, DMA, and USB PHY in one die.

Use Scenario: Converting HDMI signals from medical endoscopes or industrial cameras into plug-and-play USB video class devices.

IC Role / Device Role / Timing Role: Serves as UVC-compliant video interface controller-handles pixel clock recovery, frame buffering, and USB video streaming protocol.

Use Value: Enables certified UVC driver compatibility across OS platforms without custom driver development.

Industrial Machine Vision Camera

FPGA Configuration Loader

Use Scenario: High-resolution line-scan or area-scan cameras in factory automation requiring deterministic latency and high throughput.

IC Role / Device Role / Timing Role: Functions as image sensor interface and USB streaming engine-accepts LVDS/parallel sensor output and delivers raw or processed frames via vendor-class USB.

Use Value: Supports custom pixel formats and trigger protocols not covered by UVC, while maintaining USB 3.2 Gen 1 bandwidth.

Use Scenario: Loading bitstreams into Xilinx or Intel FPGAs during USB-based system initialization or field updates.

IC Role / Device Role / Timing Role: Acts as SPI master and configuration host-programs FPGA via dedicated SPI interface while simultaneously managing USB control channel.

Use Value: Merges FPGA bitstream and SX3 firmware into single SPI flash image, reducing boot complexity and component count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar configurable USB peripheral controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3016-BZXC	Same silicon, identical features and pinout; differs only in factory-programmed USB descriptors and default firmware variant (SX3-Data).	No functional difference in hardware; selection depends on preloaded firmware and VID/PID assignment.	Choose CYUSB3016-BZXC if preconfigured UVC descriptors are not required and full vendor-class flexibility is preferred.
CYUSB3017-BZXC	Same package and pinout; includes factory-loaded UVC/UAC descriptors and optimized firmware for video/audio streaming.	Targeted specifically for USB video class (UVC) and audio class (UAC) implementations; reduces firmware development effort.	Choose CYUSB3017-BZXC when deploying certified UVC/UAC devices without custom descriptor engineering.

Compared with CYUSB3015-BZXC, CYUSB3016-BZXC offers identical hardware flexibility but with different default firmware, while CYUSB3017-BZXC trades configurability for out-of-box UVC/UAC compliance-making CYUSB3015-BZXC optimal for fully custom vendor-class data pipelines.

Availability

CYUSB3015-BZXC is available at Aetrix Electronics and suitable for USB video capture cards, industrial machine vision systems, and FPGA-based data acquisition platforms requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for CYUSB3015-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, delivering power systems, microcontrollers, sensors, and connectivity solutions for automotive, industrial, and IoT markets.

CYUSB3015-BZXC belongs to the EZ-USB™ SX3 family-designed specifically to simplify high-bandwidth USB peripheral development by integrating configurable parallel interfaces, ARM processing, and USB 3.2 Gen 1 PHY in a single BGA package.

FAQ

What USB device classes does CYUSB3015-BZXC natively support?

CYUSB3015-BZXC supports USB vendor class by default and can be configured for UVC/UAC via firmware load. It does not ship with preprogrammed UVC descriptors like CYUSB3017-BZXC, making it ideal for custom protocol implementations where VID/PID and descriptors are defined by the end application.

Does CYUSB3015-BZXC require an external crystal oscillator?

Yes-CYUSB3015-BZXC supports 19.2-MHz crystal input for precise USB timing compliance. It also accepts 26/38.4/52 MHz clock sources, but a 19.2-MHz crystal is recommended for USB 3.2 Gen 1 jitter specifications and full-speed USB 2.0 synchronization.

Can CYUSB3015-BZXC interface directly with MIPI CSI-2 image sensors?

No-CYUSB3015-BZXC lacks native MIPI CSI-2 PHY. It supports parallel (8/16/24/32-bit) and Slave FIFO interfaces only. To connect MIPI sensors, an external bridge IC (e.g., TC358743) must convert CSI-2 to parallel format before interfacing with the SX3's GPIF.

What is the maximum sustained data rate achievable from GPIF to USB?

The distributed DMA engine supports up to 375 MBps (3 Gbps) sustained throughput from the General Configurable Interface to USB endpoints. This assumes optimal buffer sizing, 100-MHz GPIF clock, and continuous data flow-verified in reference designs for 4K30 uncompressed video streaming.

CYUSB3015-BZXC Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB™ SX3

Package/Case:: 121-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Applications:: SuperSpeed USB Peripheral Controller

Core Processor:: ARM926EJ-S

Program Memory Type:: External Program Memory

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: I2C, SPI, UART, USB

Number of I/O:: 7

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3015-BZXC FAQ

1.How can I place an order for CYUSB3015-BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3015-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3015-BZXC reliable?

The price and inventory of CYUSB3015-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3015-BZXC is usually 5 days.

3.What payment methods are accepted for CYUSB3015-BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3015-BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3015-BZXC?

CYUSB3015-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3015-BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3015-BZXC?

For technical support, including CYUSB3015-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3015-BZXC requirements.

6.How does Aetrix verify that CYUSB3015-BZXC is sourced from the original manufacturer or authorized distributors?

All CYUSB3015-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3015-BZXC meets industry standards.

7.What is the process for return or replacement of CYUSB3015-BZXC?

All CYUSB3015-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3015-BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3015-BZXC part is unused and in its original packaging.

Return procedure for CYUSB3015-BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…