Infineon Technologies CYUSB3015-BZXI
- Part No.:
- CYUSB3015-BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 121-TFBGA
- Datasheet:
-
CYUSB3015-BZXI.pdf
- Description:
- USB SuperSpeed Peripherals
- Quantity:
- Payment:

- Shipping:

Inventory:336
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYUSB3015-BZXI from Infineon Technologies (formerly Cypress Semiconductor) is a configurable SuperSpeed USB 3.2 Gen 1 peripheral controller with ARM926EJ-S CPU, 512-KB on-chip SRAM, and General Configurable Interface supporting up to 100 MHz, 32-bit parallel bus, and Slave FIFO mode. It implements USB vendor class protocol, supports SPI boot flash and I²C peripherals, and targets high-bandwidth data acquisition and video bridging applications.
For engineers reviewing the CYUSB3015-BZXI datasheet, CYUSB3015-BZXI pinout, CYUSB3015-BZXI application, or CYUSB3015-BZXI equivalent, key selection criteria include USB 3.2 Gen 1 PHY compliance, 375-MBps DMA throughput, 1.2-V core/1.8–3.3-V I/O voltage domains, and re-enumeration-capable firmware loading over USB.
Technical Context
The CYUSB3015-BZXI integrates a 200-MHz ARM926EJ-S CPU with tightly coupled memory (ITCM/DTCM), distributed DMA controller, and dual-protocol USB PHY supporting simultaneous SuperSpeed (5 Gbps), High-Speed (480 Mbps), and Full-Speed (12 Mbps) operation. Its General Configurable Interface operates at up to 100 MHz with programmable bus width (8/16/24/32-bit) and timing modes for FPGA, image sensor, or ASIC interfacing.
Power architecture includes independent core (1.2 V) and I/O (1.8–3.3 V) domains, ultra-low-power core power-down mode (<60 µA with VBATT on), and support for multiple clock inputs (19.2/26/38.4/52 MHz). Boot sources include SPI flash and USB re-enumeration with descriptor download.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Compliance | USB 3.2 Gen 1 (5 Gbps) and USB 2.0 backward compatible; enables single-chip USB video/data bridge without external transceiver. |
| CPU Core | ARM926EJ-S @ 200 MHz; executes custom firmware for real-time interface translation and descriptor management. |
| On-chip Memory | 512-KB SRAM; holds application code, DMA buffers, and USB descriptors-eliminates external RAM in compact designs. |
| Configurable Interface | Up to 100 MHz, 32-bit parallel Slave FIFO or camera interface; directly connects to FPGA, ISP, or CMOS image sensors. |
| Power Domains | Independent 1.2-V core and 1.8–3.3-V I/O rails; allows mixed-voltage system integration and low-power standby states. |
| Boot Sources | SPI flash and USB re-enumeration; enables field-upgradable firmware and dynamic device identity switching. |
| USB Class Support | Vendor class only (CYUSB3015 variant); provides full control over USB descriptors and endpoint behavior for custom protocols. |
Pinout & Package
Package: 121-ball, 10 mm × 10 mm, 0.8-mm pitch Pb-free BGA (RoHS-compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 1.2-V supply for ARM926EJ-S CPU and internal logic; requires local decoupling. |
| VIO1–VIO5 | I/O power domains | Configurable 1.8–3.3-V supplies for GPIO banks, enabling mixed-voltage interface to peripherals. |
| SSTX+/SSTX−/SSRX+/SSRX− | SuperSpeed differential pairs | 5-Gbps USB 3.2 Gen 1 physical layer signals; require controlled-impedance PCB routing (85-Ω differential). |
| D+/D− | USB 2.0 differential pair | Backward-compatible High-Speed/Full-Speed signaling; shared with SuperSpeed PHY for seamless enumeration. |
| GPIF_DATA[31:0] | Parallel interface data bus | 32-bit bidirectional data path for Slave FIFO or image sensor interface; supports 100-MHz synchronous operation. |
| CLK | Interface clock input | Drives General Configurable Interface timing; sourced externally or derived from internal PLL for precise synchronization. |
Key Features
| Feature | Design Value |
|---|---|
| Re-enumeration capability | Enables dynamic USB identity change via firmware download-supports multiple device classes from one hardware design. |
| Configurable General Interface | Programmable timing, bus width, and protocol (Slave FIFO/camera) eliminates need for glue logic or FPGA configuration overhead. |
| Integrated USB 3.2 Gen 1 PHY | Reduces BOM count and layout complexity by integrating 5-Gbps transceiver with analog front-end and termination. |
| Distributed DMA controller | Handles 375-MBps data flow between parallel interface and USB endpoints without CPU intervention-preserves ARM926EJ-S cycles. |
| Multi-domain power management | Allows selective shutdown of I/O banks while retaining core state-critical for battery-powered video capture devices. |
Applications
| USB Video Capture Card | Industrial Camera Interface |
|---|---|
|
Use Scenario: HDMI-to-USB3 conversion for live streaming and recording. IC Role / Device Role / Timing Role: Acts as USB peripheral controller bridging HDMI RX and host PC; manages pixel data buffering and UVC descriptor handling. Use Value: Enables 1080p60 or 4K30 video streaming using vendor-class firmware-no UVC driver dependency required. |
Use Scenario: High-speed image sensor data acquisition in machine vision systems. IC Role / Device Role / Timing Role: Interfaces directly to parallel-output CMOS sensors via Slave FIFO; clocks data into USB at line rate. Use Value: Delivers sustained 375-MBps throughput with deterministic latency-supports real-time inspection without frame drops. |
| USB Data Acquisition System | USB Logic Analyzer |
|
Use Scenario: Multi-channel analog/digital signal logging with PC-based analysis. IC Role / Device Role / Timing Role: Serves as high-bandwidth data pipe between ADC/FPGA and USB host; handles bulk transfers and buffer management. Use Value: Leverages 512-KB SRAM for deep sample buffering and ARM926EJ-S for real-time preprocessing-reduces host-side processing load. |
Use Scenario: Portable digital signal debugging with >100-MHz sampling capability. IC Role / Device Role / Timing Role: Captures parallel bus traces via GPIF and streams time-stamped samples over USB 3.2 Gen 1. Use Value: Achieves >100-MHz effective sampling using synchronous Slave FIFO mode-exceeds typical USB 2.0 logic analyzer bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB peripheral controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3016-BZXI | Same package and core architecture; differs only in factory-programmed USB VID/PID and default firmware image. | Identical use cases; selected when distinct USB device identity is required within same hardware platform. | Choose for multi-product SKU strategies requiring unique enumeration IDs without hardware change. |
| CYUSB3017-BZXI | Includes UVC/UAC class support and preconfigured video pipeline firmware; lacks vendor-class flexibility. | Optimized for plug-and-play webcams and audio devices; not suitable for custom protocol development. | Choose only when standard UVC driver compatibility is mandatory and firmware customization is unnecessary. |
Compared with CYUSB3016-BZXI, CYUSB3015-BZXI offers identical hardware but targets vendor-class implementations requiring full descriptor control; versus CYUSB3017-BZXI, it trades out-of-box UVC support for maximum firmware flexibility and lower licensing overhead.
Availability
CYUSB3015-BZXI is available at Aetrix Electronics and suitable for USB video capture cards, industrial camera interfaces, and USB data acquisition systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CYUSB3015-BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and microcontroller solutions for industrial, automotive, and IoT applications.
CYUSB3015-BZXI belongs to the EZ-USB™ SX3 family-designed specifically for high-throughput, configurable USB 3.2 Gen 1 peripheral bridging in imaging, test equipment, and custom data interface applications.
FAQ
Does CYUSB3015-BZXI support USB Video Class (UVC) natively?
No. CYUSB3015-BZXI is the vendor-class variant of the SX3 family and does not include built-in UVC firmware or descriptors. It requires custom firmware development for video streaming. The CYUSB3017-BZXI variant provides native UVC/UAC support with preconfigured video pipeline logic.
What clock sources are supported for the General Configurable Interface?
The CYUSB3015-BZXI accepts external clock inputs up to 100 MHz on the CLK pin, synchronized to the internal PLL. It also supports crystal inputs at 19.2 MHz, 26 MHz, 38.4 MHz, or 52 MHz for system clock generation, with internal dividers enabling precise interface timing alignment.
Can CYUSB3015-BZXI operate without external SPI flash memory?
Yes. While SPI flash is the primary boot source, CYUSB3015-BZXI supports USB re-enumeration mode: it boots from internal ROM, enumerates as a Cypress device, downloads firmware and descriptors over USB, then reboots into the configured application-enabling flashless prototyping and field updates.
Is the 121-ball BGA package RoHS-compliant and lead-free?
Yes. The CYUSB3015-BZXI uses a Pb-free, RoHS-compliant 121-ball BGA package with 0.8-mm pitch and 10 mm × 10 mm footprint. It meets JEDEC J-STD-020 moisture sensitivity level 3 and is qualified for industrial temperature range (–40°C to +85°C).
CYUSB3015-BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EZ-USB™ SX3
- Package/Case:
- 121-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- SuperSpeed USB Peripheral Controller
- Core Processor:
- ARM926EJ-S
- Program Memory Type:
- External Program Memory
- Controller Series:
- CYUSB
- RAM Size:
- 512K x 8
- Interface:
- I2C, SPI, UART, USB
- Number of I/O:
- 7
- Voltage - Supply:
- 1.15V ~ 1.25V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 121-FBGA (10x10)
CYUSB3015-BZXI FAQ
1.How can I place an order for CYUSB3015-BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB3015-BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB3015-BZXI reliable?
The price and inventory of CYUSB3015-BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3015-BZXI is usually 5 days.
3.What payment methods are accepted for CYUSB3015-BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3015-BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB3015-BZXI?
CYUSB3015-BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB3015-BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB3015-BZXI?
For technical support, including CYUSB3015-BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3015-BZXI requirements.
6.How does Aetrix verify that CYUSB3015-BZXI is sourced from the original manufacturer or authorized distributors?
All CYUSB3015-BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3015-BZXI meets industry standards.
7.What is the process for return or replacement of CYUSB3015-BZXI?
All CYUSB3015-BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3015-BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB3015-BZXI part is unused and in its original packaging.
Return procedure for CYUSB3015-BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB3015-BZXI Tags

-
CYPD3175-24LQXQ
Infineon Technologies

-
SLB9672VU20FW1523XTMA1
Infineon Technologies

-
SLB9670VQ20FW785XTMA1
Infineon Technologies

-
SLB9672XU20FW1523XTMA1
Infineon Technologies

-
SLB9673XU20FW2613XTMA1
Infineon Technologies

-
CYPD3125-40LQXIT
Infineon Technologies

-
AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

-
SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

-
SLB9672AU20FW1613XTMA1
Infineon Technologies

-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
