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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3016-BZXI

Name: CYUSB3016-BZXI
Brand: Infineon Technologies
SKU: CYUSB3016-BZXI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYUSB3016-BZXI

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3016-BZXI.pdf

Description:: USB SuperSpeed Peripherals

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYUSB3016-BZXI from Infineon Technologies (formerly Cypress Semiconductor) is a configurable SuperSpeed USB 3.2 Gen 1 peripheral controller with ARM926EJ-S CPU, 512-KB on-chip SRAM, and General Configurable Interface supporting up to 100 MHz, 32-bit parallel bus, and Slave FIFO mode. It integrates USB 3.2 Gen 1 (5 Gbps) and USB 2.0 PHYs, supports UVC/UAC/vendor-class protocols, and targets high-bandwidth video and data acquisition systems.

For engineers reviewing the CYUSB3016-BZXI datasheet, CYUSB3016-BZXI pinout, CYUSB3016-BZXI application, or CYUSB3016-BZXI equivalent, this page delivers verified technical context, package mapping, real-world use cases, and validated alternative options for USB 3.0 bridge controller selection in camera, capture, and industrial data interface designs.

Technical Context

The CYUSB3016-BZXI implements a 32-bit ARM926EJ-S core operating at 200 MHz, coupled with a distributed DMA controller enabling 375-MBps throughput between its General Configurable Interface and USB 3.2 Gen 1 endpoint. Its architecture supports dynamic re-enumeration via firmware download over USB, allowing runtime identity switching without hardware change.

It features independent power domains: 1.2-V core, 1.8–3.3-V SPI I/O, and 1.2–3.3-V I²C I/O, with ultra-low-power core power-down (<60 µA with VBATT on). Clocking supports 19.2/26/38.4/52 MHz inputs, including direct 19.2-MHz crystal operation, and integrates boot ROM, ITCM/DTCM, and dual-cache ARM subsystem.

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.2 Gen 1 (5 Gbps) and USB 2.0 backward compatible; enables single-chip USB 3.0 peripheral design without external PHY.
CPU Core	ARM926EJ-S @ 200 MHz; executes custom firmware for protocol translation, buffer management, and FPGA configuration loading.
On-chip Memory	512-KB SRAM; holds application code, DMA buffers, and descriptor tables-eliminates need for external RAM in many embedded USB bridge designs.
Configurable Interface	8/16/24/32-bit parallel bus @ up to 100 MHz; supports Slave FIFO and image sensor timing modes for direct connection to FPGA, ISP, or CMOS sensors.
Power Domains	Independent 1.2-V core + 1.8–3.3-V I/O rails; allows mixed-voltage system integration and selective domain shutdown for power optimization.
Boot Sources	SPI flash (with 1.8–3.3-V support) and I²C slaves (100/400/1000 kHz); enables field-upgradable firmware and flexible BOM sourcing.

Pinout & Package

Package: 121-ball, 10-mm × 10-mm, 0.8-mm pitch Pb-free BGA (RoHS-compliant).

Pin/Terminal	Circuit Role	Design Meaning
VDD / CVDDQ / U3TXVDDQ / U3RXVDDQ	Core & USB PHY supply rails	Separate 1.2-V core and 1.0-V USB transceiver supplies enable precise power sequencing and noise isolation.
VIO1–VIO5	I/O voltage domains	Five independently powered I/O banks (1.2–3.3 V) allow interfacing with diverse peripherals (FPGA, sensor, flash) without level shifters.
GPIF_DATA[31:0]	General Configurable Interface data bus	32-bit bidirectional parallel bus supporting Slave FIFO handshake; directly connects to FPGA or image sensor data lines.
CLK / PCLK	Interface clock input	Accepts externally generated clock up to 100 MHz for synchronous data capture; jitter tolerance specified per datasheet AC timing.
SPI_MOSI / SPI_MISO / SPI_SCK / SPI_SS	SPI boot interface	1.8–3.3-V tolerant SPI port for loading firmware and configuration from external flash; supports quad-mode reads.
I2C_SDA / I2C_SCL	I²C peripheral interface	100/400/1000 kHz I²C master/slave interface for configuring sensors, PMICs, or EEPROMs without GPIO overhead.

Key Features

Feature	Design Value
Re-enumeration capability	Enables single hardware platform to present as multiple USB device classes (e.g., UVC camera then vendor-class data logger) via runtime firmware download.
Configurable General Interface	Supports both Slave FIFO and image sensor timing modes-allows direct connection to parallel-output CMOS sensors or FPGA data pipelines without glue logic.
Integrated USB 3.2 Gen 1 PHY	Eliminates external USB 3.0 transceiver; reduces BOM count, PCB area, and signal integrity complexity in compact camera modules.
DMA-accelerated data path	375-MBps sustained throughput from GPIF to USB endpoint ensures full utilization of USB 3.0 bandwidth for 4K30 video or high-speed data streaming.
Multi-domain power management	Allows selective shutdown of unused I/O banks and core during idle, achieving <60 µA deep-sleep current with VBATT active.

Applications

USB Video Capture Card

HDMI-to-USB3 Bridge

Use Scenario: Converting HDMI 1080p60 or 4K30 video streams into USB Video Class (UVC) format for PC ingestion.

IC Role / Device Role / Timing Role: Acts as USB 3.0 bridge controller with integrated ARM processor handling HDMI RX register control, frame buffering, and UVC descriptor generation.

Use Value: Eliminates need for separate FPGA-based video processing; uses on-chip SRAM as frame buffer and leverages re-enumeration to auto-configure as UVC device on plug-in.

Use Scenario: Capturing HDMI output from broadcast equipment or medical imaging devices for recording or analysis via USB host.

IC Role / Device Role / Timing Role: Serves as timing-critical interface between HDMI receiver IC and USB 3.0 host, managing pixel clock alignment and packetization.

Use Value: Achieves 375-MBps sustained transfer using DMA-accelerated GPIF-to-USB path, preserving HDMI timing integrity without external memory bottleneck.

Industrial Camera Interface

USB Data Acquisition System

Use Scenario: Connecting LVDS or parallel-output CMOS image sensors in factory automation or machine vision systems to USB hosts.

IC Role / Device Role / Timing Role: Functions as sensor interface controller with programmable GPIF timing, capturing raw sensor frames and packaging them as vendor-class bulk transfers.

Use Value: Supports 100-MHz GPIF clock and 32-bit bus width-enables >1 Gbps sensor data ingestion while maintaining deterministic latency via Slave FIFO handshaking.

Use Scenario: Aggregating high-speed analog/digital sensor data (e.g., oscilloscope, logic analyzer) and streaming over USB 3.0 to host PC.

IC Role / Device Role / Timing Role: Operates as real-time data concentrator and USB endpoint controller, executing custom firmware for trigger logic, decimation, and packet formatting.

Use Value: On-chip 512-KB SRAM stores pre-trigger samples; ARM926EJ-S core processes metadata and manages dual-buffered DMA transfers to sustain full USB 3.0 bandwidth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.0 bridge controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3015-BZXI	Same silicon die and package; differs only in factory-programmed configuration-supports USB vendor class but not UVC/UAC descriptors.	Limited to non-standard USB device classes; unsuitable for plug-and-play video applications requiring UVC compliance.	Select when firmware handles all protocol translation and no standard class enumeration is required.
CYUSB3017-BZXI	Same silicon die and package; factory-configured for UVC/UAC class support with preloaded descriptors and audio/video controls.	Designed for immediate UVC/UAC enumeration; includes built-in camera terminal and processing unit controls unavailable in CYUSB3016.	Choose for rapid deployment of compliant webcams or audio/video peripherals without custom descriptor development.

Compared with CYUSB3016-BZXI, CYUSB3015-BZXI omits UVC/UAC firmware assets and requires full custom descriptor implementation, while CYUSB3017-BZXI provides ready-to-use UVC class functionality-making CYUSB3016 the optimal balance for developers needing UVC capability with full firmware customization freedom.

Availability

CYUSB3016-BZXI is available at Aetrix Electronics and suitable for USB video capture cards, industrial camera interfaces, and test-and-measurement equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant BGA packaging.

Supply support for CYUSB3016-BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the EZ-USB product portfolio, delivering high-performance mixed-signal and connectivity solutions for industrial, automotive, and consumer markets.

CYUSB3016-BZXI belongs to the EZ-USB SX3 family-designed specifically for configurable USB 3.0 peripheral bridging in bandwidth-intensive video, imaging, and data acquisition systems where flexibility, low-latency DMA, and firmware-defined behavior are critical.

FAQ

Does CYUSB3016-BZXI require external memory to operate?

No. CYUSB3016-BZXI integrates 512 KB of on-chip SRAM, sufficient to hold firmware, USB descriptors, DMA buffers, and application data for most USB 3.0 bridge implementations-including 4K30 video streaming and multi-channel data acquisition-without external RAM.

Can CYUSB3016-BZXI be used as a USB 2.0-only device?

Yes. The device supports USB 2.0 High-Speed (480 Mbps) operation independently of USB 3.2 Gen 1. Its dual-mode PHY automatically negotiates speed during enumeration, enabling fallback compatibility and simplified testing on legacy hosts without USB 3.0 ports.

What clock sources does CYUSB3016-BZXI support for the General Configurable Interface?

CYUSB3016-BZXI accepts an external PCLK input up to 100 MHz for synchronous GPIF operation. It also supports internal clock derivation from the main crystal (19.2/26/38.4/52 MHz), with programmable dividers enabling precise timing for sensor or FPGA interfaces.

Is the EZ-USB SX3 Configuration Utility required for development?

The utility is optional but strongly recommended: it generates initialization firmware, configures GPIOs and USB descriptors, merges FPGA bitstreams with SX3 firmware, and programs SPI flash. All functionality is accessible via command-line tools and APIs for automated CI/CD integration.

CYUSB3016-BZXI Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB™ SX3

Package/Case:: 121-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Applications:: SuperSpeed USB Peripheral Controller

Core Processor:: ARM926EJ-S

Program Memory Type:: External Program Memory

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: I2C, SPI, UART, USB

Number of I/O:: 7

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3016-BZXI FAQ

1.How can I place an order for CYUSB3016-BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3016-BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3016-BZXI reliable?

The price and inventory of CYUSB3016-BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3016-BZXI is usually 5 days.

3.What payment methods are accepted for CYUSB3016-BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3016-BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3016-BZXI?

CYUSB3016-BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3016-BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3016-BZXI?

For technical support, including CYUSB3016-BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3016-BZXI requirements.

6.How does Aetrix verify that CYUSB3016-BZXI is sourced from the original manufacturer or authorized distributors?

All CYUSB3016-BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3016-BZXI meets industry standards.

7.What is the process for return or replacement of CYUSB3016-BZXI?

All CYUSB3016-BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3016-BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3016-BZXI part is unused and in its original packaging.

Return procedure for CYUSB3016-BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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