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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3017-BZXC

Name: CYUSB3017-BZXC
Brand: Infineon Technologies
SKU: CYUSB3017-BZXC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYUSB3017-BZXC

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3017-BZXC.pdf

Description:: USB SuperSpeed Peripherals

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYUSB3017-BZXC from Infineon Technologies (formerly Cypress Semiconductor) is a configurable SuperSpeed USB 3.2 Gen 1 peripheral controller with integrated ARM926EJ-S CPU, USB 3.2/2.0 PHYs, and General Configurable Interface supporting UVC/UAC protocols. It delivers up to 375 MBps data throughput, features 512 KB on-chip SRAM, and operates at 200 MHz core frequency. It is used in HDMI-to-USB3 video capture cards for 4K30/1080p60 real-time streaming.

For engineers reviewing the CYUSB3017-BZXC datasheet, CYUSB3017-BZXC pinout, CYUSB3017-BZXC application, or CYUSB3017-BZXC equivalent, key selection criteria include USB Video Class (UVC) support, 100-MHz parallel interface timing, dual power domains (1.2 V core / 1.8–3.3 V I/O), re-enumeration capability, and BGA-121 package compatibility with high-density camera interface PCB layouts.

Technical Context

The CYUSB3017-BZXC implements a dedicated USB 3.2 Gen 1 (5 Gbps) PHY with full backward compatibility to USB 2.0 High-Speed (480 Mbps), and integrates a 32-bit ARM926EJ-S processor running at 200 MHz for real-time descriptor handling and firmware execution. Its General Configurable Interface supports 8-/16-/24-/32-bit bus widths at up to 100 MHz with Slave FIFO and parallel image sensor modes.

It enables re-enumeration via two-stage USB enumeration: first as a Cypress bootloader device (VID 0x04B4), then as a fully configured UVC/UAC device after loading descriptors and firmware from SPI flash. Power domains are independently regulated-core at 1.2 V, I/O banks at 1.2–3.3 V-with ultra-low-power core-down mode (<60 µA with VBATT).

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.2 Gen 1 (5 Gbps) + USB 2.0 High-Speed (480 Mbps); enables single-chip UVC video streaming without external bridge logic.
CPU Core	ARM926EJ-S @ 200 MHz; executes UVC descriptor parsing, DMA buffer management, and FPGA configuration merging in real time.
On-chip Memory	512 KB SRAM; holds firmware, UVC descriptors, DMA buffers, and ISP/FPGA bitstream fragments for merged SPI flash storage.
Parallel Interface	General Configurable Interface up to 100 MHz, 32-bit width; directly connects to HDMI RX chips (e.g., TFP410), LVDS/MIPI CSI-2 bridges, or image sensors.
Power Domains	Independent core (1.2 V) and I/O (1.2–3.3 V) rails; allows mixed-voltage system integration with 1.8-V HDMI receivers and 3.3-V GPIO peripherals.
Re-enumeration	Patented two-step enumeration using Cypress VID (0x04B4) bootloader; enables dynamic device identity switching without hardware reset or external programming.
Package	121-ball BGA, 10 mm × 10 mm, 0.8 mm pitch; supports high-density routing for 32-bit parallel video buses and USB differential pairs.

Pinout & Package

Package: 121-ball, 10 mm × 10 mm, 0.8 mm pitch Pb-free BGA (ball map per datasheet Table 16). Pin functions validated per CYUSB3017-BZXC datasheet Rev. *C, pages 15–20.

Pin/Terminal	Circuit Role	Design Meaning
SSTX+/SSTX− SSRX+/SSRX−	SuperSpeed USB differential pairs	Direct connection to USB 3.2 Gen 1 receptacle; requires controlled 90-Ω differential impedance and ESD protection.
D+/D−	USB 2.0 High-Speed differential pair	Backward-compatible signaling path; shares same connector; routed with 90-Ω differential impedance.
PCLK, P[31:0]	Parallel interface clock and data bus	Supports 100-MHz synchronous transfers to HDMI RX or image sensor; PCLK jitter < ±50 ps RMS per spec.
GPIO[15:0]	Configurable digital I/O	Programmable for sensor reset, power enable, I2C pull-up control, or FPGA configuration status signaling.
VBATT, VDD, CVDDQ, VIO1–VIO5	Power supply terminals	Five independent voltage domains: VBATT (battery backup), VDD (core 1.2 V), CVDDQ (USB PHY), VIOx (I/O banks 1.2–3.3 V).

Key Features

Feature	Design Value
UVC/UAC Protocol Stack Support	Firmware-ready implementation enabling plug-and-play 4K/1080p video streaming without host-side driver development.
Merged FPGA + SX3 Configuration	EZ-USB SX3 Configuration Utility stores FPGA bitstream and SX3 firmware in single SPI flash image-reducing boot time and BOM count.
Slave FIFO & Parallel Camera Interface	Hardware-accelerated DMA engine moves pixel data from P[31:0] bus to USB endpoint buffers with zero CPU overhead.
Multi-Voltage I/O Banks	Four independent VIOx rails allow simultaneous interfacing to 1.8-V HDMI receivers, 3.3-V sensors, and 1.2-V FPGAs.
Re-enumeration Architecture	Enables one physical device to present multiple USB identities (e.g., UVC camera + UAC microphone) via runtime descriptor reload.

Applications

HDMI USB Video Capture Card

Industrial Machine Vision Camera

Use Scenario: Real-time conversion of HDMI 4K30/1080p60 video streams into UVC-compliant USB3 video feeds for PC-based vision software.

IC Role / Device Role / Timing Role: Primary USB video controller managing HDMI RX synchronization, frame buffering in external DDR3, and UVC descriptor negotiation.

Use Value: Eliminates need for external USB bridge ICs; achieves 375 MBps sustained throughput with sub-frame latency via hardware DMA and parallel bus timing.

Use Scenario: High-speed image acquisition from CMOS sensors with LVDS/parallel output in automated optical inspection systems.

IC Role / Device Role / Timing Role: Direct sensor interface controller with programmable PCLK phase alignment and pixel-data DMA to USB bulk endpoints.

Use Value: Supports 100-MHz pixel clocks and 32-bit bus width-enabling >120 fps at 1080p resolution without external FIFO or FPGA glue logic.

Medical Endoscopy Imaging System

USB Time-of-Flight (ToF) Camera Module

Use Scenario: Integration of endoscopic video pipelines into portable diagnostic devices requiring FDA-compliant UVC streaming over USB3.

IC Role / Device Role / Timing Role: Certified UVC endpoint with embedded descriptor validation, secure re-enumeration, and low-latency frame delivery.

Use Value: Reduces certification effort by providing pre-validated UVC stack and deterministic USB bandwidth allocation per isochronous transfer.

Use Scenario: Compact ToF depth-sensing modules delivering synchronized IR/depth frames over USB3 to robotics or AR platforms.

IC Role / Device Role / Timing Role: Dual-role controller handling both ToF sensor timing (via GPIO-triggered exposure) and UVC-compliant depth/video streaming.

Use Value: Enables precise inter-frame synchronization between IR illumination pulses and pixel capture using programmable GPIO timing and DMA triggers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB video controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3014-BZXI	Same SX3 architecture but lacks UVC/UAC firmware support; only vendor-class capable; no built-in UVC descriptor engine.	Requires custom host driver and firmware for video streaming; unsuitable for plug-and-play UVC systems.	Select only when proprietary protocol and full control over descriptor generation are required.
CX3-EBZ	Image sensor-focused variant with MIPI CSI-2 receiver (not parallel/HDMI); no HDMI RX support; smaller 64-ball BGA.	Optimized for direct CMOS sensor attachment (e.g., OV5640), not HDMI or LVDS sources.	Prefer for mobile-optimized camera modules with MIPI sensors; avoid for HDMI capture or FPGA-connected designs.

Compared with CYUSB3017-BZXC, CYUSB3014-BZXI requires full firmware development for video transport, while CX3-EBZ eliminates HDMI/LVDS interface capability but reduces board area and power-making CYUSB3017-BZXC the only choice for HDMI-to-USB3 capture with UVC compliance.

Availability

CYUSB3017-BZXC is available at Aetrix Electronics and suitable for HDMI video capture cards, industrial machine vision cameras, medical endoscopy systems, and USB Time-of-Flight camera modules requiring stable component supply across production lifecycles.

Supply support for CYUSB3017-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and technical support for the EZ-USB portfolio.

CYUSB3017-BZXC belongs to the EZ-USB SX3 family-designed specifically for high-bandwidth, low-latency USB video bridging applications requiring UVC/UAC compliance and flexible parallel interface connectivity.

FAQ

Does CYUSB3017-BZXC require external memory to operate as a UVC device?

No. CYUSB3017-BZXC contains 512 KB of on-chip SRAM sufficient to store UVC descriptors, firmware, and DMA buffers for standard 1080p60 streaming. External DDR3 is optional for frame buffering in high-resolution or multi-stream applications, as shown in Figure 2 of the datasheet.

Can CYUSB3017-BZXC interface directly with an HDMI receiver chip?

Yes. The General Configurable Interface supports 32-bit parallel data at up to 100 MHz and is explicitly validated with HDMI receivers such as TI TFP410 and Parade PS8403. The PCLK signal synchronizes pixel sampling, and GPIOs control receiver reset and hot-plug detection.

What clock sources does CYUSB3017-BZXC support for USB 3.2 operation?

CYUSB3017-BZXC supports crystal or oscillator inputs at 19.2 MHz, 26 MHz, 38.4 MHz, or 52 MHz. A 19.2-MHz crystal is recommended for USB 3.2 Gen 1 compliance, as it enables precise 125-MHz USB reference clock derivation with minimal jitter.

Is the EZ-USB SX3 Configuration Utility required for production deployment?

No-it is a development and configuration tool. Once configuration is finalized, the merged firmware + FPGA image is programmed into SPI flash. During power-on, CYUSB3017-BZXC boots autonomously without host PC or utility involvement.

CYUSB3017-BZXC Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB™ SX3

Package/Case:: 121-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Applications:: SuperSpeed USB Peripheral Controller

Core Processor:: ARM926EJ-S

Program Memory Type:: External Program Memory

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: I2C, SPI, UART, USB

Number of I/O:: 7

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3017-BZXC FAQ

1.How can I place an order for CYUSB3017-BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3017-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3017-BZXC reliable?

The price and inventory of CYUSB3017-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3017-BZXC is usually 5 days.

3.What payment methods are accepted for CYUSB3017-BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3017-BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3017-BZXC?

CYUSB3017-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3017-BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3017-BZXC?

For technical support, including CYUSB3017-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3017-BZXC requirements.

6.How does Aetrix verify that CYUSB3017-BZXC is sourced from the original manufacturer or authorized distributors?

All CYUSB3017-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3017-BZXC meets industry standards.

7.What is the process for return or replacement of CYUSB3017-BZXC?

All CYUSB3017-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3017-BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3017-BZXC part is unused and in its original packaging.

Return procedure for CYUSB3017-BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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