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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3017-BZXCT

Name: CYUSB3017-BZXCT
Brand: Infineon Technologies
SKU: CYUSB3017-BZXCT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYUSB3017-BZXCT

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3017-BZXCT.pdf

Description:: USB SuperSpeed Peripherals

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYUSB3017-BZXCT from Infineon Technologies (formerly Cypress Semiconductor) is a configurable SuperSpeed USB 3.2 Gen 1 peripheral controller with integrated ARM926EJ-S CPU, USB 3.2/2.0 PHYs, and General Configurable Interface supporting UVC/UAC protocols. It delivers up to 375 MBps data throughput, features 512 KB on-chip SRAM, and operates at 200 MHz core frequency for real-time video bridging in USB camera systems.

For engineers reviewing the CYUSB3017-BZXCT datasheet, CYUSB3017-BZXCT pinout, CYUSB3017-BZXCT application, or CYUSB3017-BZXCT equivalent, key selection criteria include UVC protocol support, 100-MHz parallel interface timing, 121-ball BGA package compatibility, low-power core-down mode (<60 µA), and re-enumeration capability for dynamic device identity switching.

Technical Context

The CYUSB3017-BZXCT implements a dual-mode USB stack compliant with USB 3.2 Gen 1 (5 Gbps) and USB 2.0, with hardware-accelerated DMA routing between the General Configurable Interface and USB endpoints. Its ARM926EJ-S core executes firmware that configures UVC descriptors, video format negotiation, and camera terminal controls without host-side driver modification.

It supports slave FIFO and parallel image sensor interfaces up to 100 MHz with 8-/16-/24-/32-bit bus widths, and integrates independent power domains: 1.2 V core, 1.8–3.3 V SPI I/O, and 1.2–3.3 V I²C I/O - enabling mixed-voltage system integration with FPGAs, HDMI receivers, and DDR3 frame buffers.

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.2 Gen 1 (5 Gbps) + USB 2.0 backward compatible; enables single-cable high-bandwidth video streaming
CPU Core	ARM926EJ-S @ 200 MHz; runs UVC descriptor engine and FPGA configuration loader without external processor
On-chip Memory	512 KB SRAM; stores firmware, UVC descriptors, DMA buffers, and ISP/FPGA bitstream for merged boot
Parallel Interface	Configurable up to 100 MHz, 32-bit Slave FIFO; directly connects to MIPI CSI-2 bridge chips or parallel image sensors
Power Modes	Core power-down <60 µA (VBATT on); enables always-on USB enumeration in battery-powered cameras
Package	121-ball BGA, 10 mm × 10 mm, 0.8 mm pitch; matches standard HDI PCB layout for compact video capture modules
Re-enumeration	Patented two-step process using Cypress VID (0x04B4); allows runtime switch between UVC/UAC/vendor-class identities

Pinout & Package

Package: 121-ball, 10 mm × 10 mm, 0.8 mm pitch Pb-free BGA (ball map per datasheet Table 16).

Pin/Terminal	Circuit Role	Design Meaning
VDD / CVDDQ	Core power supply	1.2 V supply for ARM926EJ-S core and internal logic; requires local low-noise regulation
VIO1–VIO5	I/O voltage domains	Independent 1.2–3.3 V supplies for GPIO, SPI, I²C, and USB interface pins; enables mixed-voltage interfacing
SSTX± / SSRX±	SuperSpeed differential pairs	5-Gbps USB 3.2 Gen 1 physical layer; requires controlled 90-Ω differential impedance routing
D+/D−	High-Speed USB 2.0 interface	Backward-compatible full-speed/high-speed signaling; used during enumeration and fallback
GPIF_DATA[31:0]	General Configurable Interface bus	32-bit parallel data path configurable as Slave FIFO or camera interface; supports 100 MHz timing
CLK / PCLK	Interface clock input	Programmable clock source for GPIF; supports 100 MHz operation with jitter tolerance per datasheet Section 22

Key Features

Feature	Design Value
UVC/UAC Protocol Stack	Firmware-executed USB Video/Audio Class compliance - eliminates need for custom host drivers in Windows/macOS/Linux
Merged SPI Flash Boot	Single SPI flash stores both SX3 firmware and FPGA configuration; reduces BOM count and boot complexity
Dynamic Re-enumeration	Hardware-supported electrical disconnect/reconnect sequence enables instant identity change post-configuration download
Multi-Voltage I/O Domains	Five independent VIO rails allow direct connection to 1.2 V FPGA I/O, 1.8 V memory, and 3.3 V sensors without level shifters
Integrated DMA Controller	Distributed DMA routes video data from GPIF to USB without CPU intervention - sustains 375 MBps throughput

Applications

HDMI USB Video Capture Card

4K Medical Imaging Camera

Use Scenario: Converting HDMI 4K@30fps output from endoscopy or ultrasound systems into plug-and-play USB video stream.

IC Role / Device Role / Timing Role: Acts as UVC-compliant bridge between HDMI receiver (e.g., TFP410) and host PC; handles pixel clock domain translation and frame buffering.

Use Value: Eliminates need for proprietary drivers; enables FDA-cleared medical devices to use native OS UVC stack for regulatory compliance and interoperability.

Use Scenario: Capturing high-fidelity 4K@30fps image sensor data from CMOS sensors in surgical imaging systems.

IC Role / Device Role / Timing Role: Direct parallel interface to sensor (8-/16-bit) with programmable timing; manages burst transfers to USB via DMA while executing real-time gain/offset correction.

Use Value: Reduces latency below 10 ms and supports lossless YUV422 streaming - critical for intraoperative visualization fidelity.

Industrial Document Camera

USB Time-of-Flight (ToF) Camera

Use Scenario: High-resolution scanning of documents, ID cards, or PCBs under variable lighting conditions.

IC Role / Device Role / Timing Role: Controls rolling shutter sensor via GPIO and I²C; applies auto-exposure and white balance in firmware before UVC encoding.

Use Value: Enables consistent image quality across lighting environments without host CPU involvement - improves OCR accuracy and user experience.

Use Scenario: Real-time depth mapping for robotics navigation or gesture recognition using ToF sensor arrays.

IC Role / Device Role / Timing Role: Synchronizes ToF sensor exposure pulses via GPIO, captures raw depth frames over parallel interface, and streams via UVC bulk transfer.

Use Value: Supports 640×480 depth @ 30 fps with sub-millisecond latency - meets SLAM and human-machine interaction timing requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB video bridge applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3014-BZXCT	UVC-only variant without UAC support; identical pinout and firmware architecture	Lacks audio endpoint capability; suitable only for video-only systems	Select when audio streaming is unnecessary and BOM cost reduction is prioritized
CX3-EBZ	MIPI CSI-2 to USB 3.0 bridge; no ARM CPU or configurable GPIF; fixed-function hardware	Requires MIPI sensor input; no firmware customization or FPGA co-processing capability	Select for MIPI-native sensors where minimal firmware development and deterministic latency are required

Compared with CYUSB3017-BZXCT, CYUSB3014-BZXCT removes UAC functionality but retains full UVC configurability and re-enumeration, while CX3-EBZ trades firmware flexibility for lower latency and simpler design - making CYUSB3017-BZXCT optimal for hybrid video+audio+custom logic applications.

Availability

CYUSB3017-BZXCT is available at Aetrix Electronics and suitable for USB video capture cards, medical imaging devices, industrial document cameras, and USB-based test equipment requiring stable component supply and long-term lifecycle support.

Supply support for CYUSB3017-BZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the EZ-USB product portfolio, including legacy Cypress USB controllers.

The CYUSB3017 belongs to the EZ-USB SX3 family - designed specifically for high-throughput, firmware-configurable USB video and data bridging applications requiring UVC/UAC compliance and FPGA co-processing capability.

FAQ

Does CYUSB3017-BZXCT require external RAM for UVC operation?

No. The device integrates 512 KB of on-chip SRAM sufficient to store UVC descriptors, firmware, DMA buffers, and frame metadata. External DDR3 is optional and used only for large frame buffers in 4K applications - not required for basic UVC streaming at 1080p.

Can CYUSB3017-BZXCT be configured to operate without re-enumeration?

Yes. The device supports static configuration mode where pre-programmed descriptors and firmware are loaded from SPI flash at power-up, bypassing the two-step re-enumeration. This mode is used in production systems requiring deterministic USB identity and faster plug-in response.

What clock sources are supported for the General Configurable Interface?

CYUSB3017-BZXCT accepts externally generated PCLK up to 100 MHz, or derives it from internal PLL using crystal inputs of 19.2, 26, 38.4, or 52 MHz. The 19.2-MHz crystal option is commonly used to minimize jitter in video timing-critical applications.

Is the CYUSB3017-BZXCT pin-compatible with CYUSB3015 or CYUSB3016?

Yes. All three variants (CYUSB3015, CYUSB3016, CYUSB3017) share identical 121-ball BGA package and pinout. Firmware and hardware design are interchangeable; differentiation is purely functional (UVC/UAC vs. vendor class) and enabled via configuration utility or SPI flash content.

CYUSB3017-BZXCT Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB™ SX3

Package/Case:: 121-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Applications:: SuperSpeed USB Peripheral Controller

Core Processor:: ARM926EJ-S

Program Memory Type:: External Program Memory

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: I2C, SPI, UART, USB

Number of I/O:: 7

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3017-BZXCT FAQ

1.How can I place an order for CYUSB3017-BZXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3017-BZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3017-BZXCT reliable?

The price and inventory of CYUSB3017-BZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3017-BZXCT is usually 5 days.

3.What payment methods are accepted for CYUSB3017-BZXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3017-BZXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3017-BZXCT?

CYUSB3017-BZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3017-BZXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3017-BZXCT?

For technical support, including CYUSB3017-BZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3017-BZXCT requirements.

6.How does Aetrix verify that CYUSB3017-BZXCT is sourced from the original manufacturer or authorized distributors?

All CYUSB3017-BZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3017-BZXCT meets industry standards.

7.What is the process for return or replacement of CYUSB3017-BZXCT?

All CYUSB3017-BZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3017-BZXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3017-BZXCT part is unused and in its original packaging.

Return procedure for CYUSB3017-BZXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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